Results for DSG2608_X_012_B_H6


The information on this page was generated on Sun Aug 30 06:23:47 2026 (America/Los_Angeles).
You may click the button below to manually regenerate the content.

Basic Information for DSG2608_X_012_B_H6


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1174
Serial Number 20USBHX2008017
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_012_B_H6
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-07-17T17:58:07.265Z
HCC Chip HCCSTARV1 2026-07-21T19:44:02.315Z
ABC Chip ABCSTARV1 2026-07-21T19:44:03.988Z
ABC Chip ABCSTARV1 2026-07-21T19:44:05.549Z
ABC Chip ABCSTARV1 2026-07-21T19:44:07.140Z
ABC Chip ABCSTARV1 2026-07-21T19:44:08.716Z
ABC Chip ABCSTARV1 2026-07-21T19:44:10.298Z
ABC Chip ABCSTARV1 2026-07-21T19:44:11.887Z
ABC Chip ABCSTARV1 2026-07-21T19:44:13.524Z
ABC Chip ABCSTARV1 2026-07-21T19:44:15.593Z
ABC Chip ABCSTARV1 2026-07-21T19:44:17.202Z
ABC Chip ABCSTARV1 2026-07-21T19:44:18.955Z
Hybrid Interposer 2026-07-17T17:58:04.237Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-08-05T15:48:29.862Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-07-17T18:50:23.632Z
Visual Inspection 2026-07-20T19:15:27.811Z
ASIC Metrology 2026-07-17T23:14:06.988Z
Wire bonding 2026-07-20T19:15:27.811Z
Pedestal Trim Burn In 2026-07-22T10:26:15.000Z
Strobe Delay Burn In 2026-07-22T10:27:01.000Z
Response Curve Burn In 2026-07-22T09:35:49.000Z
Noise Occupancy Burn In 2026-07-22T09:36:29.000Z
Pedestal Trim TC 2026-08-11T17:03:07.000Z
Strobe Delay TC 2026-08-11T17:03:25.000Z
Response Curve TC 2026-08-11T17:11:59.000Z
Noise Occupancy TC 2026-08-11T17:15:05.000Z
Open Channel Search TC 2026-08-11T17:18:24.000Z

Glue weight for DSG2608_X_012_B_H6


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_012_B_H6
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_012_B_H6/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008017_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_012_B_H6.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator LM, AS
Date 2026-07-17T18:50:23.632+00:00
Program ASIC_X_PPB.src
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 41.047
Volume per glue dot [nL] 789.368
Weight of glue under ASICs [mg] 44.200
Weights of bare hybrid [g] 2.485
Weights of stuffed hybrid [g] 2.529

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               479.292250 +/- 6.734750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               75.461125 +/- 13.002103 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             403.831125
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 103.831125 +/- 15.472929 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 404.831125 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               473.260500 +/- 2.739250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               82.446333 +/- 7.636833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             390.814167
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 90.814167 +/- 9.530200 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 391.814167 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               464.676250 +/- 3.302000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               78.982000 +/- 7.576000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             385.694250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 85.694250 +/- 9.659140 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 386.694250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               459.524500 +/- 2.030500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               71.113111 +/- 6.316833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             388.411389
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 88.411389 +/- 8.308147 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 389.411389 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               453.738500 +/- 1.759000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               79.042667 +/- 6.398500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             374.695833
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 74.695833 +/- 8.308723 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 375.695833 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               451.017000 +/- 1.192750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               66.363667 +/- 6.140000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             384.653333
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 84.653333 +/- 8.007637 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 385.653333 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               448.796750 +/- 0.905000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               64.145333 +/- 6.571333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             384.651417
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 84.651417 +/- 8.306711 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 385.651417 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               447.054250 +/- 0.670500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               71.983222 +/- 6.470667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             375.071028
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 75.071028 +/- 8.204822 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 376.071028 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               449.906250 +/- 1.632750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               71.075556 +/- 5.183000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             378.830694
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 78.830694 +/- 7.384400 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 379.830694 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               454.493250 +/- 2.125500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               54.568250 +/- 10.477024 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             399.925000
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 99.925000 +/- 11.801940 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 400.925000 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               456.478500 +/- 0.393000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               52.494500 +/- 6.089957 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             403.984000
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 103.984000 +/- 7.889362 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 404.984000 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 944.386250, chip thickness 300.000000 and glue 103.831125, giving hybrid 540.555125 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 937.313339, chip thickness 300.000000 and glue 90.814167, giving hybrid 546.499172 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 931.971359, chip thickness 300.000000 and glue 85.694250, giving hybrid 546.277109 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.773350, chip thickness 300.000000 and glue 88.411389, giving hybrid 541.361961 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 927.550938, chip thickness 300.000000 and glue 74.695833, giving hybrid 552.855104 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.076928, chip thickness 300.000000 and glue 84.653333, giving hybrid 543.423595 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 927.543719, chip thickness 300.000000 and glue 84.651417, giving hybrid 542.892302 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 925.877633, chip thickness 300.000000 and glue 75.071028, giving hybrid 550.806605 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.603976, chip thickness 300.000000 and glue 78.830694, giving hybrid 549.773282 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 934.333472, chip thickness 300.000000 and glue 99.925000, giving hybrid 534.408472 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.787250, chip thickness 300.000000 and glue 103.984000, giving hybrid 525.803250 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_012_B_H6/1//Data__DSG2608_X_012_B_H6.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_012_B_H6/1//Results__DSG2608_X_012_B_H6.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_012_B_H6/1//Data__DSG2608_X_012_B_H6.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_012_B_H6/1//Results__DSG2608_X_012_B_H6.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_012_B_H6
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_012_B_H6/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_012_B_H6.txt...
IService::install                          INFO                Installed Results__DSG2608_X_012_B_H6.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_012_B_H6.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_B_H0-1.config
IService::next                             INFO                Scheduling DSG2608-012-B6_DSG2608-017-B0-B2-B3-B4-B5.TXT file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_B_H0/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0011252
MetadataValue
Component type X
Operator Kirsten Affolder
Date 2026-07-17T23:14:06.988+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_012_B_H6


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_012_B_H6
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_012_B_H6/HybridBonding_v1-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_012_B_H6.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_017_B_H0-2.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_017_B_H0-2.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_017_B_H0/2/
MetadataValue
Date 2026-07-20T19:15:27.811+00:00
Operator AS, LM, KA
Bonder hk1
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files DSG2608_X_012_B_H6/20USBHX2008017
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files DSG2608_X_012_B_H6/20USBHX2008017
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008017_20260721_6_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008017_20260721_6_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008017_20260721_6_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008017_20260721_6_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008017_20260721_6_NO_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_012_B_H6_GAIN_TEST.json
ElectricalSvc::PassFail                    INFO                Reading PassFail status directly from uploaded files
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component DSG2608_X_012_B_H6
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_012_B_H6/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2008017_20260721_6_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2008017_20260721_6_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008017_20260721_6_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008017_20260721_6_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2008017_20260721_6_NO_BURNIN.json...
IService::install                          INFO                Installed DSG2608_X_012_B_H6.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_017_B_H0-1.config
IService::next                             INFO                Scheduling Burnin_Panel_63_66_59_67_Jul21_2026 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//DSG2608_X_017_B_H0/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for DSG2608_X_012_B_H6
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0011252
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362110
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362109
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362108
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362107
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362106
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362105
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362104
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362103
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362102
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362100

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.