Results for DSG2608_X_014_A_H2


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Basic Information for DSG2608_X_014_A_H2


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1177
Serial Number 20USBHX2008020
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_014_A_H2
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-07-17T18:38:00.029Z
HCC Chip HCCSTARV1 2026-07-21T16:26:16.261Z
ABC Chip ABCSTARV1 2026-07-21T16:26:17.756Z
ABC Chip ABCSTARV1 2026-07-21T16:26:19.292Z
ABC Chip ABCSTARV1 2026-07-21T16:26:20.802Z
ABC Chip ABCSTARV1 2026-07-21T16:26:22.320Z
ABC Chip ABCSTARV1 2026-07-21T16:26:23.848Z
ABC Chip ABCSTARV1 2026-07-21T16:26:25.356Z
ABC Chip ABCSTARV1 2026-07-21T16:26:26.890Z
ABC Chip ABCSTARV1 2026-07-21T16:26:28.419Z
ABC Chip ABCSTARV1 2026-07-21T16:26:29.941Z
ABC Chip ABCSTARV1 2026-07-21T16:26:31.488Z
Hybrid Interposer 2026-07-17T18:37:56.477Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-07-24T23:54:07.144Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-07-17T19:09:09.557Z
Visual Inspection 2026-07-20T17:48:01.244Z
ASIC Metrology 2026-07-17T22:02:37.634Z
Wire bonding 2026-07-20T17:48:01.244Z
Pedestal Trim Burn In 2026-07-22T12:05:31.000Z
Strobe Delay Burn In 2026-07-22T12:06:00.000Z
Response Curve Burn In 2026-07-22T12:07:36.000Z
Noise Occupancy Burn In 2026-07-22T12:13:26.000Z
Pedestal Trim TC 2026-07-29T15:41:02.000Z
Strobe Delay TC 2026-07-29T15:41:19.000Z
Response Curve TC 2026-07-29T15:49:52.000Z
Noise Occupancy TC 2026-07-29T15:52:27.000Z
Open Channel Search TC 2026-07-29T15:55:43.000Z
Noise Occupancy PPA 2026-07-21T16:42:02.000Z
Response Curve PPA 2026-07-21T16:41:42.000Z
Pedestal Trim PPA 2026-07-21T16:34:33.000Z
Strobe Delay PPA 2026-07-21T16:34:49.000Z

Glue weight for DSG2608_X_014_A_H2


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_014_A_H2
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_014_A_H2/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008020_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_014_A_H2.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator LM, AS
Date 2026-07-17T19:09:09.557+00:00
Program ASIC_X_PPB.src
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 39.468
Volume per glue dot [nL] 759.008
Weight of glue under ASICs [mg] 42.500
Weights of bare hybrid [g] 2.520
Weights of stuffed hybrid [g] 2.562

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               473.576250 +/- 5.158750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               92.062375 +/- 8.319288 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.513875
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.513875 +/- 10.991963 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.513875 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               467.993750 +/- 1.969750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               86.147444 +/- 6.443667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.846306
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.846306 +/- 8.390516 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.846306 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               460.039500 +/- 2.763500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               75.455444 +/- 5.559500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             384.584056
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 84.584056 +/- 7.971510 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 385.584056 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               455.181000 +/- 1.571250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               84.356667 +/- 7.023667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             370.824333
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 70.824333 +/- 8.763602 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 371.824333 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               450.362250 +/- 1.018000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               77.492333 +/- 6.295500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             372.869917
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 72.869917 +/- 8.103681 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 373.869917 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               449.522750 +/- 0.554500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               67.444111 +/- 5.727000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             382.078639
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 82.078639 +/- 7.622729 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 383.078639 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               446.662250 +/- 1.016750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               75.185111 +/- 6.691667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             371.477139
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 71.477139 +/- 8.414998 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 372.477139 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               445.943250 +/- 0.780250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               67.981889 +/- 4.677833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             377.961361
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.961361 +/- 6.891365 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.961361 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               449.144750 +/- 0.980750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               68.342667 +/- 9.200500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             380.802083
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 80.802083 +/- 10.517180 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 381.802083 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               452.159500 +/- 2.341750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               59.916250 +/- 15.110695 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             392.243250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 92.243250 +/- 16.087787 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 393.243250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               453.708250 +/- 0.242250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               76.631500 +/- 3.617028 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             377.076750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.076750 +/- 6.175887 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.076750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 940.218500, chip thickness 300.000000 and glue 81.513875, giving hybrid 558.704625 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 934.271817, chip thickness 300.000000 and glue 81.846306, giving hybrid 552.425512 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.339966, chip thickness 300.000000 and glue 84.584056, giving hybrid 544.755910 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 927.184142, chip thickness 300.000000 and glue 70.824333, giving hybrid 556.359809 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 925.678651, chip thickness 300.000000 and glue 72.869917, giving hybrid 552.808734 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 927.811416, chip thickness 300.000000 and glue 82.078639, giving hybrid 545.732777 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 926.407105, chip thickness 300.000000 and glue 71.477139, giving hybrid 554.929967 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 925.542893, chip thickness 300.000000 and glue 77.961361, giving hybrid 547.581532 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.388898, chip thickness 300.000000 and glue 80.802083, giving hybrid 547.586814 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 932.311030, chip thickness 300.000000 and glue 92.243250, giving hybrid 540.067780 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 930.771250, chip thickness 300.000000 and glue 77.076750, giving hybrid 553.694500 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_014_A_H2/1//Data__DSG2608_X_014_A_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_014_A_H2/1//Results__DSG2608_X_014_A_H2.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_014_A_H2/1//Data__DSG2608_X_014_A_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_014_A_H2/1//Results__DSG2608_X_014_A_H2.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_014_A_H2
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_014_A_H2/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_014_A_H2.txt...
IService::install                          INFO                Installed Results__DSG2608_X_014_A_H2.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_014_A_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_014_A_H3-1.config
IService::next                             INFO                Scheduling DSG2608-014-A0-TO-A5.TXT file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_014_A_H3/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0011325
MetadataValue
Component type X
Operator Kirsten Affolder
Date 2026-07-17T22:02:37.634+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_014_A_H2


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_014_A_H2
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_014_A_H2/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_014_A_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_014_A_H3-1.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_014_A_H3-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_014_A_H3/1/
MetadataValue
Date 2026-07-20T17:48:01.244+00:00
Operator KA, AS
Bonder hk1
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files DSG2608_X_014_A_H2/20USBHX2008020
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files DSG2608_X_014_A_H2/20USBHX2008020
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008020_20260721_8_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008020_20260721_8_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008020_20260721_8_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008020_20260721_8_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008020_20260721_8_NO_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_014_A_H2_GAIN_TEST.json
ElectricalSvc::PassFail                    INFO                Reading PassFail status directly from uploaded files
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component DSG2608_X_014_A_H2
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_014_A_H2/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2008020_20260721_8_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2008020_20260721_8_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008020_20260721_8_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008020_20260721_8_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2008020_20260721_8_NO_BURNIN.json...
IService::install                          INFO                Installed DSG2608_X_014_A_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_014_A_H3-1.config
IService::next                             INFO                Scheduling Burnin_Panel_65_68_July20_2026 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//DSG2608_X_014_A_H3/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for DSG2608_X_014_A_H2
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0011325
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362142
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362141
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362140
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362139
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362138
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362137
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362136
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362135
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362134
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1362133

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.