Results for DSG2608_X_017_D_H1


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Basic Information for DSG2608_X_017_D_H1


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1320
Serial Number 20USBHX2008513
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_017_D_H1
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-08-17T18:45:05.388Z
HCC Chip HCCSTARV1 2026-08-19T19:01:10.863Z
ABC Chip ABCSTARV1 2026-08-19T19:01:12.428Z
ABC Chip ABCSTARV1 2026-08-19T19:01:14.039Z
ABC Chip ABCSTARV1 2026-08-19T19:01:15.561Z
ABC Chip ABCSTARV1 2026-08-19T19:01:17.098Z
ABC Chip ABCSTARV1 2026-08-19T19:01:18.671Z
ABC Chip ABCSTARV1 2026-08-19T19:01:20.199Z
ABC Chip ABCSTARV1 2026-08-19T19:01:21.726Z
ABC Chip ABCSTARV1 2026-08-19T19:01:23.297Z
ABC Chip ABCSTARV1 2026-08-19T19:01:24.900Z
ABC Chip ABCSTARV1 2026-08-19T19:01:26.463Z
Hybrid Interposer 2026-08-17T18:45:03.406Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-08-26T14:14:00.689Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-08-17T18:58:37.606Z
Visual Inspection 2026-08-18T22:51:50.695Z
ASIC Metrology 2026-08-17T20:57:53.080Z
Wire bonding 2026-08-18T22:51:50.695Z
Pedestal Trim Burn In 2026-08-20T14:11:08.000Z
Strobe Delay Burn In 2026-08-20T14:11:15.000Z
Response Curve Burn In 2026-08-20T14:18:35.000Z
Noise Occupancy Burn In 2026-08-20T14:21:41.000Z

Glue weight for DSG2608_X_017_D_H1


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_017_D_H1
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_017_D_H1/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008513_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_017_D_H1.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator KA, LM
Date 2026-08-17T18:58:37.606+00:00
Program ASIC-X-PPB.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 41.140
Volume per glue dot [nL] 791.154
Weight of glue under ASICs [mg] 44.300
Weights of bare hybrid [g] 2.512
Weights of stuffed hybrid [g] 2.556

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               445.070000 +/- 6.775500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               57.353625 +/- 10.583974 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             387.716375
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 87.716375 +/- 13.525085 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 388.716375 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               443.921500 +/- 2.055500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               66.635889 +/- 5.174500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             377.285611
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.285611 +/- 7.483350 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.285611 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               436.187750 +/- 1.184000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               51.863444 +/- 6.152667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             384.324306
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 84.324306 +/- 8.016057 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 385.324306 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               431.402250 +/- 2.082000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               54.457000 +/- 7.561000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             376.945250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 76.945250 +/- 9.300723 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 377.945250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               430.458750 +/- 1.027500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               51.280222 +/- 7.297333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             379.178528
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 79.178528 +/- 8.905438 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 380.178528 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               429.013500 +/- 0.559000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               47.184556 +/- 7.084333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.828944
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.828944 +/- 8.689089 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.828944 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               425.376000 +/- 2.411250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               47.761556 +/- 7.360667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             377.614444
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.614444 +/- 9.219194 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.614444 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               426.053250 +/- 1.854250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               48.997556 +/- 7.088500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             377.055694
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.055694 +/- 8.870461 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.055694 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               431.525500 +/- 1.168750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               44.446889 +/- 6.860000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             387.078611
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 87.078611 +/- 8.568873 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 388.078611 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               437.561750 +/- 1.254000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               43.468000 +/- 8.941542 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             394.093750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 94.093750 +/- 10.321031 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 395.093750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               437.334500 +/- 0.957250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               44.754250 +/- 4.808856 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             392.580250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 92.580250 +/- 7.002959 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 393.580250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 938.425500, chip thickness 300.000000 and glue 87.716375, giving hybrid 550.709125 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 933.732443, chip thickness 300.000000 and glue 77.285611, giving hybrid 556.446832 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.204103, chip thickness 300.000000 and glue 84.324306, giving hybrid 543.879798 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 925.325612, chip thickness 300.000000 and glue 76.945250, giving hybrid 548.380362 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 926.886468, chip thickness 300.000000 and glue 79.178528, giving hybrid 547.707940 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 927.641251, chip thickness 300.000000 and glue 81.828944, giving hybrid 545.812306 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 924.649785, chip thickness 300.000000 and glue 77.614444, giving hybrid 547.035340 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 924.364197, chip thickness 300.000000 and glue 77.055694, giving hybrid 547.308503 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.665692, chip thickness 300.000000 and glue 87.078611, giving hybrid 541.587081 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 934.798116, chip thickness 300.000000 and glue 94.093750, giving hybrid 540.704366 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 932.255250, chip thickness 300.000000 and glue 92.580250, giving hybrid 539.675000 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_D_H1/1//Data__DSG2608_X_017_D_H1.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_D_H1/1//Results__DSG2608_X_017_D_H1.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_D_H1/1//Data__DSG2608_X_017_D_H1.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_D_H1/1//Results__DSG2608_X_017_D_H1.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_017_D_H1
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_017_D_H1/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_017_D_H1.txt...
IService::install                          INFO                Installed Results__DSG2608_X_017_D_H1.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_017_D_H1.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_D_H4-1.config
IService::next                             INFO                Scheduling DSG2608-035-A6_019-D0-1-4-5_051-C0.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_017_D_H4/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0011471
MetadataValue
Component type X
Operator Kirsten Affolder
Date 2026-08-17T20:57:53.080+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_017_D_H1


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_017_D_H1
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_017_D_H1/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_017_D_H1.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_017_D_H4-1.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_017_D_H4-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_017_D_H4/1/
MetadataValue
Date 2026-08-18T22:51:50.695+00:00
Operator LM
Bonder hk1
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files DSG2608_X_017_D_H1/20USBHX2008513
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files DSG2608_X_017_D_H1/20USBHX2008513
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008513_20260819_15_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008513_20260819_15_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008513_20260819_15_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008513_20260819_15_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008513_20260819_15_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_017_D_H1_GAIN_TEST.json
ElectricalSvc::PassFail                    INFO                Reading PassFail status directly from uploaded files
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component DSG2608_X_017_D_H1
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_017_D_H1/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2008513_20260819_15_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2008513_20260819_15_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008513_20260819_15_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008513_20260819_15_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2008513_20260819_15_NO_BURNIN.json...
IService::install                          INFO                Installed DSG2608_X_017_D_H1.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_017_D_H4-1.config
IService::next                             INFO                Scheduling Burnin_Panel_59_Aug_19_2026 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//DSG2608_X_017_D_H4/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for DSG2608_X_017_D_H1
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0011471
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAH1023016
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370313
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370312
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370311
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370310
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370309
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370308
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370307
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370306
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370305
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370304

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.