The information on this page was generated on Sat Aug 29 06:30:14 2026 (America/Los_Angeles). You may click the button below to manually regenerate the content.
Basic Information for DSG2608_X_040_B_H4
Brief description of DB components associated to this Hybrid Assembly and associated tests
Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component DSG2608_X_040_B_H4
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_040_B_H4/GlueWeightHybridASIC_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2008047_image.jpg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed DSG2608_X_040_B_H4.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor INFO Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor INFO Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor INFO Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
Metadata
Value
Component type
Operator
LM, AS
Date
2026-07-17T23:43:35.531+00:00
Program
ASIC_X_PPB.src
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
39.840
Volume per glue dot [nL]
766.151
Weight of glue under ASICs [mg]
42.900
Weights of bare hybrid [g]
2.513
Weights of stuffed hybrid [g]
2.555
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_0] Height in z : 471.287500 +/- 4.940500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_0] Height in z : 70.840125 +/- 10.753503 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 400.447375
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 100.447375 +/- 12.847037 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 401.447375 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_1] Height in z : 464.657750 +/- 1.722500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_1] Height in z : 84.313889 +/- 7.273333 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 380.343861
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 80.343861 +/- 8.992685 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 381.343861 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_2] Height in z : 457.934750 +/- 2.231750 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_2] Height in z : 74.649778 +/- 7.535167 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 383.284972
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 83.284972 +/- 9.314475 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 384.284972 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_3] Height in z : 453.366500 +/- 0.717250 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_3] Height in z : 77.980111 +/- 8.442500 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 375.386389
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 75.386389 +/- 9.838204 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 376.386389 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_4] Height in z : 451.009000 +/- 1.767500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_4] Height in z : 80.303333 +/- 7.299500 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 370.705667
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 70.705667 +/- 9.022569 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 371.705667 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_5] Height in z : 449.180000 +/- 0.481000 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_5] Height in z : 71.130222 +/- 5.641667 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 378.049778
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 78.049778 +/- 7.553791 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 379.049778 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_6] Height in z : 447.199500 +/- 0.669500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_6] Height in z : 70.004667 +/- 8.895167 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 377.194833
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.194833 +/- 10.226056 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.194833 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_7] Height in z : 445.041750 +/- 1.080250 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_7] Height in z : 75.598667 +/- 7.821333 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 369.443083
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 69.443083 +/- 9.345598 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 370.443083 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_8] Height in z : 448.663000 +/- 1.040500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_8] Height in z : 72.142778 +/- 6.747667 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 376.520222
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 76.520222 +/- 8.462485 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 377.520222 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_9] Height in z : 453.531500 +/- 1.482750 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_9] Height in z : 62.177125 +/- 8.627763 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 391.354375
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 91.354375 +/- 10.081510 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 392.354375 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [HCC_X_0] Height in z : 450.944500 +/- 1.004500 um
MetrologySvc::analyzeGlueHeights INFO ----> [HCC_X_0] Height in z : 68.818875 +/- 4.588769 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 382.125625
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 82.125625 +/- 6.860454 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 383.125625 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.540250, chip thickness 300.000000 and glue 100.447375, giving hybrid 541.092875 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 934.844940, chip thickness 300.000000 and glue 80.343861, giving hybrid 554.501079 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 930.753677, chip thickness 300.000000 and glue 83.284972, giving hybrid 547.468704 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 928.509699, chip thickness 300.000000 and glue 75.386389, giving hybrid 553.123310 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 929.075372, chip thickness 300.000000 and glue 70.705667, giving hybrid 558.369706 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 929.853547, chip thickness 300.000000 and glue 78.049778, giving hybrid 551.803770 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 928.934783, chip thickness 300.000000 and glue 77.194833, giving hybrid 551.739950 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 926.236485, chip thickness 300.000000 and glue 69.443083, giving hybrid 556.793402 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 929.112627, chip thickness 300.000000 and glue 76.520222, giving hybrid 552.592405 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 934.497010, chip thickness 300.000000 and glue 91.354375, giving hybrid 543.142635 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 930.246500, chip thickness 300.000000 and glue 82.125625, giving hybrid 548.120875 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_040_B_H4/1//Data__DSG2608_X_040_B_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_040_B_H4/1//Results__DSG2608_X_040_B_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_040_B_H4/1//Data__DSG2608_X_040_B_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_040_B_H4/1//Results__DSG2608_X_040_B_H4.txt
IService::log INFO Logging status 0111 for component DSG2608_X_040_B_H4
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_040_B_H4/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__DSG2608_X_040_B_H4.txt...
IService::install INFO Installed Results__DSG2608_X_040_B_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed DSG2608_X_040_B_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_040_B_H5-1.config
IService::next INFO Scheduling DSG2608-040-B0-1-2-3-4-5.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_040_B_H5/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0012384
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for DSG2608_X_040_B_H4
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component DSG2608_X_040_B_H4
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_040_B_H4/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed DSG2608_X_040_B_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_040_B_H5-1.config
IService::next INFO Scheduling HybridBonding_DSG2608_X_040_B_H5-1.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_040_B_H5/1/
Metadata
Value
Date
2026-07-20T23:11:49.000+00:00
Operator
AS, LM
Bonder
hk1
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files DSG2608_X_040_B_H4/20USBHX2008047
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files DSG2608_X_040_B_H4/20USBHX2008047
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008047_20260721_6_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008047_20260721_6_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008047_20260721_6_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008047_20260721_6_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008047_20260721_6_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_040_B_H4_GAIN_TEST.json
ElectricalSvc::PassFail INFO Reading PassFail status directly from uploaded files
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 0111 for component DSG2608_X_040_B_H4
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_040_B_H4/BurnInHybrids_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2008047_20260721_6_PEDESTAL_TRIM_BURNIN.json...
IService::install INFO Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2008047_20260721_6_STROBE_DELAY_BURNIN.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008047_20260721_6_3PG_BURNIN.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008047_20260721_6_RESPONSE_CURVE_BURNIN.json...
IService::install INFO Installed DB_READY_NO_BURNIN_SN20USBHX2008047_20260721_6_NO_BURNIN.json...
IService::install INFO Installed DSG2608_X_040_B_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_040_B_H5-1.config
IService::next INFO Scheduling Burnin_Panel_63_66_59_67_Jul21_2026 file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//DSG2608_X_040_B_H5/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for DSG2608_X_040_B_H4
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0012384
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362456
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362455
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362454
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362453
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362452
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362451
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362447
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362446
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362445
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1362444
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
