Results for DSG2608_X_048_D_H0


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Basic Information for DSG2608_X_048_D_H0


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1207
Serial Number 20USBHX2008064
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_048_D_H0
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-07-20T18:00:42.644Z
HCC Chip HCCSTARV1 2026-07-23T19:37:30.808Z
ABC Chip ABCSTARV1 2026-07-23T19:37:32.419Z
ABC Chip ABCSTARV1 2026-07-23T19:37:34.002Z
ABC Chip ABCSTARV1 2026-07-23T19:37:35.646Z
ABC Chip ABCSTARV1 2026-07-23T19:37:37.224Z
ABC Chip ABCSTARV1 2026-07-23T19:37:38.830Z
ABC Chip ABCSTARV1 2026-07-23T19:37:40.583Z
ABC Chip ABCSTARV1 2026-07-23T19:37:42.156Z
ABC Chip ABCSTARV1 2026-07-23T19:37:43.745Z
ABC Chip ABCSTARV1 2026-07-23T19:37:45.330Z
ABC Chip ABCSTARV1 2026-07-23T19:37:46.922Z
Hybrid Interposer 2026-07-20T18:00:39.439Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-08-03T18:16:10.787Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-07-20T18:14:43.954Z
Visual Inspection 2026-07-22T18:54:16.520Z
ASIC Metrology 2026-07-20T21:48:13.473Z
Wire bonding 2026-07-22T18:54:16.520Z
Noise Occupancy Burn In 2026-07-25T14:47:00.000Z
Response Curve Burn In 2026-07-25T14:46:29.000Z
Strobe Delay Burn In 2026-07-25T14:33:06.000Z
Pedestal Trim Burn In 2026-07-25T14:32:28.000Z

Glue weight for DSG2608_X_048_D_H0


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_048_D_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_048_D_H0/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008064_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_048_D_H0.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator KA, LM
Date 2026-07-20T18:14:43.954+00:00
Program ASIC_X_PPB.src
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 41.047
Volume per glue dot [nL] 789.368
Weight of glue under ASICs [mg] 44.200
Weights of bare hybrid [g] 2.529
Weights of stuffed hybrid [g] 2.573

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               471.250250 +/- 6.927750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               92.838125 +/- 10.909774 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             378.412125
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 78.412125 +/- 13.857016 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 379.412125 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               466.061750 +/- 3.328500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               91.818667 +/- 5.052167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             374.243083
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 74.243083 +/- 7.848777 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 375.243083 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               457.567500 +/- 3.437000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               83.160444 +/- 6.212833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             374.407056
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 74.407056 +/- 8.684024 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 375.407056 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               452.288000 +/- 2.482250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               79.436444 +/- 5.949000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             372.851556
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 72.851556 +/- 8.157951 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 373.851556 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               449.133250 +/- 1.726500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               77.460333 +/- 7.011167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             371.672917
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 71.672917 +/- 8.782782 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 372.672917 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               445.250750 +/- 1.813750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               66.489667 +/- 5.561167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             378.761083
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 78.761083 +/- 7.695210 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 379.761083 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               443.672750 +/- 2.131750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               65.338667 +/- 5.115500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             378.334083
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 78.334083 +/- 7.464094 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 379.334083 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               442.858500 +/- 2.060750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               59.854222 +/- 5.838000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             383.004278
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 83.004278 +/- 7.957948 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 384.004278 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               445.012250 +/- 2.334250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               56.894889 +/- 7.430000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             388.117361
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 88.117361 +/- 9.254924 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 389.117361 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               450.369000 +/- 3.344250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               45.243125 +/- 8.703601 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             405.125875
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 105.125875 +/- 10.580013 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 406.125875 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               460.051250 +/- 1.547000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               65.293125 +/- 1.959216 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             394.758125
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 94.758125 +/- 5.588536 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 395.758125 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 951.602000, chip thickness 300.000000 and glue 78.412125, giving hybrid 573.189875 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 943.453205, chip thickness 300.000000 and glue 74.243083, giving hybrid 569.210121 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 937.108020, chip thickness 300.000000 and glue 74.407056, giving hybrid 562.700965 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 933.658611, chip thickness 300.000000 and glue 72.851556, giving hybrid 560.807055 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 932.918754, chip thickness 300.000000 and glue 71.672917, giving hybrid 561.245838 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 931.141517, chip thickness 300.000000 and glue 78.761083, giving hybrid 552.380434 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 930.130629, chip thickness 300.000000 and glue 78.334083, giving hybrid 551.796546 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.296477, chip thickness 300.000000 and glue 83.004278, giving hybrid 545.292200 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.199071, chip thickness 300.000000 and glue 88.117361, giving hybrid 541.081710 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 934.594728, chip thickness 300.000000 and glue 105.125875, giving hybrid 529.468853 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 934.143750, chip thickness 300.000000 and glue 94.758125, giving hybrid 539.385625 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H0/1//Data__DSG2608_X_048_D_H0.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H0/1//Results__DSG2608_X_048_D_H0.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H0/1//Data__DSG2608_X_048_D_H0.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H0/1//Results__DSG2608_X_048_D_H0.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_048_D_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_048_D_H0/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_048_D_H0.txt...
IService::install                          INFO                Installed Results__DSG2608_X_048_D_H0.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_048_D_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H1-1.config
IService::next                             INFO                Scheduling DSG2608-048-D0-1-2-3-4-5.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H1/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0012730
MetadataValue
Component type X
Operator LM
Date 2026-07-20T21:48:13.473+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_048_D_H0


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_048_D_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_048_D_H0/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_048_D_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_048_D_H1-1.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_048_D_H1-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_048_D_H1/1/
MetadataValue
Date 2026-07-22T18:54:16.520+00:00
Operator LM
Bonder hk1
Version v1
Bond numberTypeComment