Results for DSG2608_X_048_D_H4


The information on this page was generated on Sat Aug 29 06:30:57 2026 (America/Los_Angeles).
You may click the button below to manually regenerate the content.

Basic Information for DSG2608_X_048_D_H4


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1211
Serial Number 20USBHX2008068
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_048_D_H4
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-07-20T18:26:21.573Z
HCC Chip HCCSTARV1 2026-07-23T19:38:47.249Z
ABC Chip ABCSTARV1 2026-07-23T19:38:48.860Z
ABC Chip ABCSTARV1 2026-07-23T19:38:50.478Z
ABC Chip ABCSTARV1 2026-07-23T19:38:52.069Z
ABC Chip ABCSTARV1 2026-07-23T19:38:53.659Z
ABC Chip ABCSTARV1 2026-07-23T19:38:55.264Z
ABC Chip ABCSTARV1 2026-07-23T19:38:56.863Z
ABC Chip ABCSTARV1 2026-07-23T19:38:58.454Z
ABC Chip ABCSTARV1 2026-07-23T19:39:00.018Z
ABC Chip ABCSTARV1 2026-07-23T19:39:01.664Z
ABC Chip ABCSTARV1 2026-07-23T19:39:03.285Z
Hybrid Interposer 2026-07-20T18:26:18.927Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-08-03T18:16:53.917Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-07-20T18:39:41.637Z
Visual Inspection 2026-07-22T18:54:16.571Z
ASIC Metrology 2026-07-20T21:48:13.488Z
Wire bonding 2026-07-22T18:54:16.571Z
Response Curve Burn In 2026-07-25T14:46:29.000Z
Strobe Delay Burn In 2026-07-25T14:33:06.000Z
Noise Occupancy Burn In 2026-07-25T14:47:00.000Z
Pedestal Trim Burn In 2026-07-25T14:32:28.000Z
Pedestal Trim TC 2026-08-09T08:24:31.000Z
Strobe Delay TC 2026-08-09T08:24:42.000Z
Response Curve TC 2026-08-09T08:26:33.000Z
Noise Occupancy TC 2026-08-09T08:36:26.000Z
Open Channel Search TC 2026-08-09T08:39:33.000Z

Glue weight for DSG2608_X_048_D_H4


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_048_D_H4
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_048_D_H4/GlueWeightHybridASIC_PROD_v2-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008068_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_048_D_H4.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator KA
Date 2026-07-20T18:39:41.637+00:00
Program ASIC_X_PPB.src
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 41.976
Volume per glue dot [nL] 807.227
Weight of glue under ASICs [mg] 45.200
Weights of bare hybrid [g] 2.499
Weights of stuffed hybrid [g] 2.544

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               450.541000 +/- 5.921250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               58.236500 +/- 6.985154 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             392.304500
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 92.304500 +/- 10.433292 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 393.304500 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               446.989250 +/- 2.098250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               53.608667 +/- 6.371333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             393.380583
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 93.380583 +/- 8.366394 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 394.380583 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               441.262750 +/- 2.106250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               57.203667 +/- 5.357667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             384.059083
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 84.059083 +/- 7.625017 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 385.059083 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               437.497000 +/- 1.466250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               54.347556 +/- 6.084167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             383.149444
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 83.149444 +/- 8.010429 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 384.149444 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               435.864500 +/- 0.784000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               54.400333 +/- 7.057833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.464167
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.464167 +/- 8.684910 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.464167 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               434.814250 +/- 1.001500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               52.990889 +/- 6.964000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.823361
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.823361 +/- 8.631356 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.823361 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               434.044500 +/- 0.329250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               51.440111 +/- 6.476333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             382.604389
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 82.604389 +/- 8.188486 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 383.604389 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               433.158250 +/- 0.736250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               57.315778 +/- 8.038333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             375.842472
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 75.842472 +/- 9.495097 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 376.842472 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               435.695750 +/- 1.105750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               58.530000 +/- 6.895333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             377.165750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.165750 +/- 8.588848 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.165750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               440.364750 +/- 0.715000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               54.528125 +/- 8.609732 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             385.836625
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 85.836625 +/- 9.981919 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 386.836625 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               442.791000 +/- 0.526500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               69.283875 +/- 3.483738 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             373.507125
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 73.507125 +/- 6.116669 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 374.507125 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 940.096250, chip thickness 300.000000 and glue 92.304500, giving hybrid 547.791750 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 934.430063, chip thickness 300.000000 and glue 93.380583, giving hybrid 541.049480 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 930.944663, chip thickness 300.000000 and glue 84.059083, giving hybrid 546.885579 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.111311, chip thickness 300.000000 and glue 83.149444, giving hybrid 545.961866 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 930.007475, chip thickness 300.000000 and glue 81.464167, giving hybrid 548.543308 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 931.194762, chip thickness 300.000000 and glue 81.823361, giving hybrid 549.371401 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 931.098724, chip thickness 300.000000 and glue 82.604389, giving hybrid 548.494335 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.281538, chip thickness 300.000000 and glue 75.842472, giving hybrid 553.439066 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 930.675441, chip thickness 300.000000 and glue 77.165750, giving hybrid 553.509691 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 935.470271, chip thickness 300.000000 and glue 85.836625, giving hybrid 549.633646 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 933.226250, chip thickness 300.000000 and glue 73.507125, giving hybrid 559.719125 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H4/1//Data__DSG2608_X_048_D_H4.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H4/1//Results__DSG2608_X_048_D_H4.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H4/1//Data__DSG2608_X_048_D_H4.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H4/1//Results__DSG2608_X_048_D_H4.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_048_D_H4
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_048_D_H4/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_048_D_H4.txt...
IService::install                          INFO                Installed Results__DSG2608_X_048_D_H4.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_048_D_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H5-1.config
IService::next                             INFO                Scheduling DSG2608-048-D0-1-2-3-4-5.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_048_D_H5/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0012734
MetadataValue
Component type X
Operator LM
Date 2026-07-20T21:48:13.488+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_048_D_H4


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_048_D_H4
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_048_D_H4/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_048_D_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_048_D_H5-1.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_048_D_H5-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_048_D_H5/1/
MetadataValue
Date 2026-07-22T18:54:16.571+00:00
Operator LM
Bonder hk1
Version v1
Bond numberTypeComment