Results for DSG2608_X_051_C_H0


The information on this page was generated on Sat Aug 29 06:43:47 2026 (America/Los_Angeles).
You may click the button below to manually regenerate the content.

Basic Information for DSG2608_X_051_C_H0


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1323
Serial Number 20USBHX2008516
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_051_C_H0
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-08-17T19:00:20.884Z
HCC Chip HCCSTARV1 2026-08-18T19:48:08.118Z
ABC Chip ABCSTARV1 2026-08-18T19:48:09.697Z
ABC Chip ABCSTARV1 2026-08-18T19:48:11.299Z
ABC Chip ABCSTARV1 2026-08-18T19:48:12.884Z
ABC Chip ABCSTARV1 2026-08-18T19:48:14.479Z
ABC Chip ABCSTARV1 2026-08-18T19:48:16.101Z
ABC Chip ABCSTARV1 2026-08-18T19:48:17.676Z
ABC Chip ABCSTARV1 2026-08-18T19:48:19.256Z
ABC Chip ABCSTARV1 2026-08-18T19:48:20.918Z
ABC Chip ABCSTARV1 2026-08-18T19:48:22.531Z
ABC Chip ABCSTARV1 2026-08-18T19:48:24.127Z
Hybrid Interposer 2026-08-17T19:00:17.064Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-08-27T17:22:27.665Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-08-17T19:22:19.883Z
Visual Inspection 2026-08-18T17:23:43.688Z
ASIC Metrology 2026-08-17T22:16:04.652Z
Wire bonding 2026-08-18T17:23:43.688Z
Pedestal Trim Burn In 2026-08-19T12:20:35.000Z
Strobe Delay Burn In 2026-08-19T12:21:09.000Z
Response Curve Burn In 2026-08-19T12:23:04.000Z
Noise Occupancy Burn In 2026-08-19T11:25:13.000Z

Glue weight for DSG2608_X_051_C_H0


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_051_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_051_C_H0/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008516_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_051_C_H0.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator KA,LM
Date 2026-08-17T19:22:19.883+00:00
Program ASIC-X-PPB.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 41.511
Volume per glue dot [nL] 798.298
Weight of glue under ASICs [mg] 44.700
Weights of bare hybrid [g] 2.482
Weights of stuffed hybrid [g] 2.527

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               462.181500 +/- 6.386250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               70.013875 +/- 8.324061 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             392.167625
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 92.167625 +/- 11.622142 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 393.167625 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               460.491000 +/- 1.536500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               78.688889 +/- 5.879167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.802111
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.802111 +/- 7.869271 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.802111 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               453.402750 +/- 1.146750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               72.223778 +/- 5.221333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.178972
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.178972 +/- 7.319656 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.178972 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               447.771500 +/- 1.779750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               71.300222 +/- 7.076167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             376.471278
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 76.471278 +/- 8.845318 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 377.471278 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               446.834000 +/- 1.121000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               71.775444 +/- 6.035667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             375.058556
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 75.058556 +/- 7.917444 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 376.058556 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               445.197500 +/- 0.739500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               64.056889 +/- 5.769833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.140611
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.140611 +/- 7.670583 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.140611 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               441.471500 +/- 2.375250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               60.754444 +/- 5.824000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             380.717056
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 80.717056 +/- 8.034973 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 381.717056 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               442.503750 +/- 1.354000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               56.991333 +/- 5.668333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             385.512417
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 85.512417 +/- 7.678758 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 386.512417 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               447.989250 +/- 0.859500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               56.920667 +/- 6.681333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             391.068583
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 91.068583 +/- 8.389217 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 392.068583 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               453.447250 +/- 0.967500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               54.393125 +/- 7.680594 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             399.054125
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 99.054125 +/- 9.215616 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 400.054125 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               453.309000 +/- 0.558500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               55.966500 +/- 4.007704 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             397.342500
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 97.342500 +/- 6.432233 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 398.342500 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 938.994000, chip thickness 300.000000 and glue 92.167625, giving hybrid 546.826375 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 933.873431, chip thickness 300.000000 and glue 81.802111, giving hybrid 552.071320 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.784115, chip thickness 300.000000 and glue 81.178972, giving hybrid 547.605143 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 924.865130, chip thickness 300.000000 and glue 76.471278, giving hybrid 548.393852 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 926.230891, chip thickness 300.000000 and glue 75.058556, giving hybrid 551.172335 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 926.586065, chip thickness 300.000000 and glue 81.140611, giving hybrid 545.445454 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 923.313651, chip thickness 300.000000 and glue 80.717056, giving hybrid 542.596595 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 923.189956, chip thickness 300.000000 and glue 85.512417, giving hybrid 537.677540 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 927.307033, chip thickness 300.000000 and glue 91.068583, giving hybrid 536.238450 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 932.676229, chip thickness 300.000000 and glue 99.054125, giving hybrid 533.622104 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 928.518250, chip thickness 300.000000 and glue 97.342500, giving hybrid 531.175750 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_051_C_H0/2//Data__DSG2608_X_051_C_H0.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_051_C_H0/2//Results__DSG2608_X_051_C_H0.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_051_C_H0/2//Data__DSG2608_X_051_C_H0.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_051_C_H0/2//Results__DSG2608_X_051_C_H0.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_051_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_051_C_H0/MetrologyHybrid_PROD_X_v2_interposer-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_051_C_H0.txt...
IService::install                          INFO                Installed Results__DSG2608_X_051_C_H0.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_051_C_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_051_C_H1-1.config
IService::next                             INFO                Scheduling DSG2608-035-A6_019-D5_051-C0-1-2-3.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_051_C_H1/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0012849
MetadataValue
Component type X
Operator LM
Date 2026-08-17T22:16:04.652+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_051_C_H0


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_051_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_051_C_H0/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_051_C_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_051_C_H1-1.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_051_C_H1-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_051_C_H1/1/
MetadataValue
Date 2026-08-18T17:23:43.688+00:00
Operator FMM
Bonder hk1
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files DSG2608_X_051_C_H0/20USBHX2008516
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files DSG2608_X_051_C_H0/20USBHX2008516
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008516_20260818_12_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008516_20260818_12_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008516_20260818_12_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008516_20260818_12_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2008516_20260818_12_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_051_C_H0_GAIN_TEST.json
ElectricalSvc::PassFail                    INFO                Reading PassFail status directly from uploaded files
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component DSG2608_X_051_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_051_C_H0/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2008516_20260818_12_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2008516_20260818_12_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008516_20260818_12_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008516_20260818_12_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2008516_20260818_12_NO_BURNIN.json...
IService::install                          INFO                Installed DSG2608_X_051_C_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_051_C_H1-1.config
IService::next                             INFO                Scheduling Burnin_Panel_61_63_65_Aug_18_2026 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//DSG2608_X_051_C_H1/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for DSG2608_X_051_C_H0
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0012849
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAH1023019
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370347
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370346
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370345
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370344
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370343
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370342
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370341
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370340
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370339
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1370338

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.