Results for DSG2608_X_060_D_H4


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Basic Information for DSG2608_X_060_D_H4


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-1243
Serial Number 20USBHX2008100
Batch PRODUCTION_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID DSG2608_X_060_D_H4
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2026-07-20T23:00:24.097Z
HCC Chip HCCSTARV1 2026-07-23T19:35:19.204Z
ABC Chip ABCSTARV1 2026-07-23T19:35:20.794Z
ABC Chip ABCSTARV1 2026-07-23T19:35:22.389Z
ABC Chip ABCSTARV1 2026-07-23T19:35:23.961Z
ABC Chip ABCSTARV1 2026-07-23T19:35:25.589Z
ABC Chip ABCSTARV1 2026-07-23T19:35:27.236Z
ABC Chip ABCSTARV1 2026-07-23T19:35:28.812Z
ABC Chip ABCSTARV1 2026-07-23T19:35:30.435Z
ABC Chip ABCSTARV1 2026-07-23T19:35:32.032Z
ABC Chip ABCSTARV1 2026-07-23T19:35:33.609Z
ABC Chip ABCSTARV1 2026-07-23T19:35:35.201Z
Hybrid Interposer 2026-07-20T23:00:21.811Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2026-08-26T14:13:19.494Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2026-07-21T21:26:28.155Z
Visual Inspection 2026-07-22T23:30:44.078Z
ASIC Metrology 2026-07-22T18:55:23.194Z
Wire bonding 2026-07-22T23:30:44.078Z
Response Curve Burn In 2026-07-25T14:46:29.000Z
Strobe Delay Burn In 2026-07-25T14:33:06.000Z
Pedestal Trim Burn In 2026-07-25T14:32:28.000Z
Noise Occupancy Burn In 2026-07-25T14:47:00.000Z

Glue weight for DSG2608_X_060_D_H4


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_060_D_H4
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_060_D_H4/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2008100_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_060_D_H4.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator LM, AS
Date 2026-07-21T21:26:28.155+00:00
Program ASIC_X_PPB.src
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 40.118
Volume per glue dot [nL] 771.509
Weight of glue under ASICs [mg] 43.200
Weights of bare hybrid [g] 2.516
Weights of stuffed hybrid [g] 2.559

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               471.444500 +/- 4.235250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               87.724375 +/- 7.052506 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             383.720125
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 83.720125 +/- 9.626795 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 384.720125 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               469.423250 +/- 1.741500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               84.669111 +/- 5.697000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             384.754139
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 84.754139 +/- 7.777444 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 385.754139 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               463.129750 +/- 1.710000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               81.498222 +/- 5.912000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             381.631528
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.631528 +/- 7.929429 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.631528 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               459.508250 +/- 0.929000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               80.418333 +/- 6.114500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             379.089917
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 79.089917 +/- 7.952996 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 380.089917 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               457.853250 +/- 1.333000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               86.490556 +/- 7.222667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             371.362694
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 71.362694 +/- 8.885033 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 372.362694 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               456.092750 +/- 1.194000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               79.514556 +/- 5.368667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             376.578194
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 76.578194 +/- 7.432914 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 377.578194 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               457.137250 +/- 0.722000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               81.561778 +/- 8.091167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             375.575472
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 75.575472 +/- 9.538777 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 376.575472 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               457.713500 +/- 0.493500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               82.787556 +/- 6.670000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             374.925944
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 74.925944 +/- 8.350595 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 375.925944 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               460.282750 +/- 0.996500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               70.087778 +/- 5.716667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             390.194972
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 90.194972 +/- 7.659849 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 391.194972 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               464.850500 +/- 0.781250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               56.846500 +/- 11.631730 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             408.004000
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 108.004000 +/- 12.684932 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 409.004000 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               465.797000 +/- 1.508250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               76.986750 +/- 3.696224 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             388.810250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 88.810250 +/- 6.398194 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 389.810250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 941.564000, chip thickness 300.000000 and glue 83.720125, giving hybrid 557.843875 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 937.201716, chip thickness 300.000000 and glue 84.754139, giving hybrid 552.447577 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 932.311295, chip thickness 300.000000 and glue 81.631528, giving hybrid 550.679767 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.777454, chip thickness 300.000000 and glue 79.089917, giving hybrid 550.687537 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.815639, chip thickness 300.000000 and glue 71.362694, giving hybrid 558.452945 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.411626, chip thickness 300.000000 and glue 76.578194, giving hybrid 552.833432 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 930.290054, chip thickness 300.000000 and glue 75.575472, giving hybrid 554.714582 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.535025, chip thickness 300.000000 and glue 74.925944, giving hybrid 554.609081 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 929.686410, chip thickness 300.000000 and glue 90.194972, giving hybrid 539.491438 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 933.543213, chip thickness 300.000000 and glue 108.004000, giving hybrid 525.539213 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 933.672250, chip thickness 300.000000 and glue 88.810250, giving hybrid 544.862000 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_060_D_H4/1//Data__DSG2608_X_060_D_H4.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_060_D_H4/1//Results__DSG2608_X_060_D_H4.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_060_D_H4/1//Data__DSG2608_X_060_D_H4.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_060_D_H4/1//Results__DSG2608_X_060_D_H4.txt
IService::log                              INFO                Logging status 0111 for component DSG2608_X_060_D_H4
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_060_D_H4/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__DSG2608_X_060_D_H4.txt...
IService::install                          INFO                Installed Results__DSG2608_X_060_D_H4.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed DSG2608_X_060_D_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_060_D_H5-1.config
IService::next                             INFO                Scheduling DSG2608-060-D1-2-3-4-5-6.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_060_D_H5/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0013238
Measurement::addPoint                      ERROR               Unknown type ?! Ignoring!
MetadataValue
Component type X
Operator LM
Date 2026-07-22T18:55:23.194+00:00
Program version MetrologyHybrid_PROD_X_v2_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thin_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for DSG2608_X_060_D_H4


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component DSG2608_X_060_D_H4
IService::install                          INFO                Installing output directory to /home/data/modules/DSG2608_X_060_D_H4/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed DSG2608_X_060_D_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_060_D_H5-1.config
IService::next                             INFO                Scheduling HybridBonding_DSG2608_X_060_D_H5-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_060_D_H5/1/
MetadataValue
Date 2026-07-22T23:30:44.078+00:00
Operator LM
Bonder hk1
Version v1
Bond numberTypeComment