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Basic Information for DSG2608_X_064_B_H5
Brief description of DB components associated to this Hybrid Assembly and associated tests
Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component DSG2608_X_064_B_H5
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_064_B_H5/GlueWeightHybridASIC_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2008121_image.jpg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed DSG2608_X_064_B_H5.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor INFO Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor INFO Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor INFO Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
Metadata
Value
Component type
Operator
LM, AS
Date
2026-07-21T23:00:52.567+00:00
Program
ASIC_X_PPB.src
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
39.376
Volume per glue dot [nL]
757.222
Weight of glue under ASICs [mg]
42.400
Weights of bare hybrid [g]
2.532
Weights of stuffed hybrid [g]
2.575
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_0] Height in z : 448.476750 +/- 5.343750 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_0] Height in z : 57.154875 +/- 7.957249 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 391.321875
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 91.321875 +/- 10.810804 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 392.321875 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_1] Height in z : 445.837250 +/- 3.453000 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_1] Height in z : 64.796444 +/- 7.095333 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 381.040806
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 81.040806 +/- 9.341679 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 382.040806 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_2] Height in z : 438.952750 +/- 2.992000 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_2] Height in z : 62.815556 +/- 7.210500 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 376.137194
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 76.137194 +/- 9.270565 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 377.137194 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_3] Height in z : 433.392500 +/- 2.338500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_3] Height in z : 55.700000 +/- 5.754833 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 377.692500
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 77.692500 +/- 7.974126 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 378.692500 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_4] Height in z : 429.897500 +/- 1.088500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_4] Height in z : 61.348889 +/- 6.277500 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 368.548611
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 68.548611 +/- 8.098879 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 369.548611 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_5] Height in z : 426.219000 +/- 2.013500 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_5] Height in z : 46.966444 +/- 5.367167 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 379.252556
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 79.252556 +/- 7.606620 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 380.252556 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_6] Height in z : 424.943250 +/- 2.003750 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_6] Height in z : 42.310111 +/- 7.827500 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 382.633139
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 82.633139 +/- 9.501830 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 383.633139 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_7] Height in z : 422.579750 +/- 3.339000 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_7] Height in z : 58.574667 +/- 9.240500 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 364.005083
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 64.005083 +/- 11.024326 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 365.005083 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_8] Height in z : 427.375250 +/- 2.063750 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_8] Height in z : 54.843444 +/- 10.814667 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 372.531806
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 72.531806 +/- 12.091984 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 373.531806 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_9] Height in z : 432.998750 +/- 3.172750 um
MetrologySvc::analyzeGlueHeights INFO ----> [ABC_X_9] Height in z : 38.756750 +/- 10.073090 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 394.242000
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 94.242000 +/- 11.684754 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 395.242000 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeGlueHeights INFO Printing associated surfaces...
MetrologySvc::analyzeGlueHeights INFO ----> [HCC_X_0] Height in z : 441.941000 +/- 0.412000 um
MetrologySvc::analyzeGlueHeights INFO ----> [HCC_X_0] Height in z : 63.730125 +/- 4.465026 um
MetrologySvc::analyzeGlueHeights INFO ----> Difference in heights : 378.210875
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 78.210875 +/- 6.716115 um
MetrologySvc::analyzeGlueHeights INFO ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 379.210875 um
MetrologySvc::analyzeGlueHeights INFO ---------------------------------------------------------------------------------
MetrologySvc::analyzeHybridThickness INFO Total stack up 945.739250, chip thickness 300.000000 and glue 91.321875, giving hybrid 554.417375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 939.822998, chip thickness 300.000000 and glue 81.040806, giving hybrid 558.782193 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 935.060943, chip thickness 300.000000 and glue 76.137194, giving hybrid 558.923748 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 931.303958, chip thickness 300.000000 and glue 77.692500, giving hybrid 553.611458 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 930.248234, chip thickness 300.000000 and glue 68.548611, giving hybrid 561.699623 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 928.670891, chip thickness 300.000000 and glue 79.252556, giving hybrid 549.418335 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 927.956323, chip thickness 300.000000 and glue 82.633139, giving hybrid 545.323185 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 924.549744, chip thickness 300.000000 and glue 64.005083, giving hybrid 560.544661 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 928.089192, chip thickness 300.000000 and glue 72.531806, giving hybrid 555.557387 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 933.722873, chip thickness 300.000000 and glue 94.242000, giving hybrid 539.480873 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 936.586750, chip thickness 300.000000 and glue 78.210875, giving hybrid 558.375875 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_064_B_H5/1//Data__DSG2608_X_064_B_H5.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_064_B_H5/1//Results__DSG2608_X_064_B_H5.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_064_B_H5/1//Data__DSG2608_X_064_B_H5.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_064_B_H5/1//Results__DSG2608_X_064_B_H5.txt
IService::log INFO Logging status 0111 for component DSG2608_X_064_B_H5
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_064_B_H5/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__DSG2608_X_064_B_H5.txt...
IService::install INFO Installed Results__DSG2608_X_064_B_H5.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed DSG2608_X_064_B_H5.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_064_B_H6-1.config
IService::next INFO Scheduling DSG2608-064-B5-B6_DSG2608-069-D0-1-2-3.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//DSG2608_X_064_B_H6/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0013393
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for DSG2608_X_064_B_H5
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component DSG2608_X_064_B_H5
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_064_B_H5/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed DSG2608_X_064_B_H5.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//DSG2608_X_064_B_H6-1.config
IService::next INFO Scheduling HybridBonding_DSG2608_X_064_B_H6-1.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//DSG2608_X_064_B_H6/1/
Metadata
Value
Date
2026-07-23T23:24:16.285+00:00
Operator
LM
Bonder
hk1
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files DSG2608_X_064_B_H5/20USBHX2008121
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files DSG2608_X_064_B_H5/20USBHX2008121
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008121_20260724_6_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008121_20260724_6_powerCycleTest_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008121_20260724_6_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008121_20260724_6_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008121_20260724_6_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle SN20USBHX2008121_20260724_6_NO_BURNIN.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_064_B_H5_GAIN_TEST.json
ElectricalSvc::PassFail INFO Reading PassFail status directly from uploaded files
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 0111 for component DSG2608_X_064_B_H5
IService::install INFO Installing output directory to /home/data/modules/DSG2608_X_064_B_H5/BurnInHybrids_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2008121_20260724_6_PEDESTAL_TRIM_BURNIN.json...
IService::install INFO Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2008121_20260724_6_STROBE_DELAY_BURNIN.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008121_20260724_6_3PG_BURNIN.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2008121_20260724_6_RESPONSE_CURVE_BURNIN.json...
IService::install INFO Installed DB_READY_NO_BURNIN_SN20USBHX2008121_20260724_6_NO_BURNIN.json...
IService::install INFO Installed DSG2608_X_064_B_H5.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//DSG2608_X_064_B_H6-1.config
IService::next INFO Scheduling Burnin_Panel_43_44_64_July24_2026 file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//DSG2608_X_064_B_H6/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for DSG2608_X_064_B_H5
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0013393
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360111
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360110
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360109
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360108
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360107
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360106
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360105
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360104
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360103
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1360102
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
