Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION_RECEPTION
IService::log INFO Logging status 1111 for component GPC1938_X_015_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC1938_X_015_A_H1/ASICGlueWeight_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION_RECEPTION.json...
IService::install INFO Installed GPC1938_X_015_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//ASICGlueWeight_v1//GPC1938_X_015_A_H2.config
IService::next INFO Scheduling GPC1938_X_015_A_H2.json file to run...
IService::next INFO Writing results to /home/data/output//ASICGlueWeight_v1//GPC1938_X_015_A_H2/1/
Metadata
Value
Component type
ASIC
Operator
Kirsten Affolder
Date
2021-09-15T18:33:25.749+00:00
Program
ASIC_X
Tip size
23.000
Pressure
25.000
Dispense time
2.650
Field
Weight/Volume
Assummed density of glue
1.077
Extracted glue weight
0.047
Total volume of ASIC glue [uL]
44.019
Volume per glue dot [nL]
846.517
Weight of glue under ASICs [mg]
47.400
Weight per 5 glue dots [mg]
4.558
Weight per glue dot [mg]
0.912
Weights of ASICs [g]
0.398
Weights of ASICs plus HCC [g]
0.411
Weights of bare hybrid [g]
1.975
Weights of stuffed hybrid [g]
2.433
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 772.747000, chip thickness 300.000000 and glue 90.821357, giving hybrid 381.925643 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 773.201250, chip thickness 300.000000 and glue 89.898357, giving hybrid 383.302893 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 772.909750, chip thickness 300.000000 and glue 92.242286, giving hybrid 380.667464 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.354250, chip thickness 300.000000 and glue 85.331893, giving hybrid 389.022357 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 773.867750, chip thickness 300.000000 and glue 89.464786, giving hybrid 384.402964 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 771.816750, chip thickness 300.000000 and glue 86.487857, giving hybrid 385.328893 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 771.526500, chip thickness 300.000000 and glue 82.367714, giving hybrid 389.158786 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 770.040500, chip thickness 300.000000 and glue 79.351571, giving hybrid 390.688929 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 768.804250, chip thickness 300.000000 and glue 85.153393, giving hybrid 383.650857 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 766.592250, chip thickness 300.000000 and glue 79.907250, giving hybrid 386.685000 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 768.679500, chip thickness 300.000000 and glue 84.757542, giving hybrid 383.921958 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//HybridMetrology_v8//GPC1938_X_015_A_H1/1//Data__GPC1938_X_015_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//HybridMetrology_v8//GPC1938_X_015_A_H1/1//Results__GPC1938_X_015_A_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//HybridMetrology_v8//GPC1938_X_015_A_H1/1//Data__GPC1938_X_015_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//HybridMetrology_v8//GPC1938_X_015_A_H1/1//Results__GPC1938_X_015_A_H1.txt
IService::log INFO Logging status 1111 for component GPC1938_X_015_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC1938_X_015_A_H1/HybridMetrology_v8-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC1938_X_015_A_H1.txt...
IService::install INFO Installed Results__GPC1938_X_015_A_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC1938_X_015_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_v8//GPC1938_X_015_B_H1.config
IService::next INFO Scheduling GPC1938_X_015_B_H1.txt file to run...
IService::next INFO Writing results to /home/data/output//HybridMetrology_v8//GPC1938_X_015_B_H1/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAH0003045
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012081
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012082
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012083
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012084
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012085
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012086
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012087
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012088
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012089
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012090
Metadata
Value
Component type
X
Operator
Matthew Gignac
Date
2021-09-20T19:51:20.866+00:00
Program version
v8
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC1938_X_015_A_H1
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC1938_X_015_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC1938_X_015_A_H1/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC1938_X_015_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC1938_X_015_A_H2.config
IService::next INFO Scheduling HybridBonding_GPC1938_X_015_A_H2.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC1938_X_015_A_H2/1/
Metadata
Value
Date
2021-11-10T22:32:12.920+00:00
Operator
Kirsten Affolder
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC1938_X_015_A_H1/20USBHX2000740
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC1938_X_015_A_H1_RC_3_6.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC1938_X_015_A_H1_RC_3_3.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC1938_X_015_A_H1_20211103.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC1938_X_015_A_H1/20USBHX2000740
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1938_X_015_A_H1_20211103_3_16.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1938_X_015_A_H1_20211103_3_2.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1938_X_015_A_H1_20211103_3_1.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC1938_X_015_A_H1
ElectricalSvc::read INFO Detected 0 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2560 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrid//GPC1938_X_015_A_H1_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::log INFO Logging status 0111 for component GPC1938_X_015_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC1938_X_015_A_H1/ElectricalHybrids-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC1938_X_015_A_H1_20211103_3_1.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC1938_X_015_A_H1_20211103_3_2.json...
IService::install INFO File already installed: GPC1938_X_015_A_H1.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrid//GPC1938_X_015_B_H6.config
IService::next INFO Scheduling Panel-28-final-ITSDAQ file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids//GPC1938_X_015_B_H6/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAH0003045
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012081
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012082
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012083
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012084
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012085
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012086
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012087
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012088
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012089
MetaData::getLocalName WARNING Could not find a local name for identifier 20USGAA1012090
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
Defect
Number of channels (%)
Dead
0
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2560
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.