Results for GPC1938_X_015_B_H2


Basic Information for GPC1938_X_015_B_H2


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0035
Serial Number 20USBHX2000756
Assembled True
Completed True
Current Location Brookhaven National Laboratory
Manufacture ID GPC1938_X_015_B_H2
User Matthew Gignac

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2022-02-20T17:10:44.058Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
ABC Chip ABCSTAR 2021-10-07T19:45:48.854Z
STAR Hybrid Flex X 2021-10-07T19:45:51.415Z
HCC Chip HCCSTARV1 2021-10-07T19:45:48.854Z
ABC Chip ABCSTARV1 2021-10-22T20:59:09.294Z
ABC Chip ABCSTARV1 2021-10-22T20:59:10.445Z
ABC Chip ABCSTARV1 2021-10-22T20:59:12.072Z
ABC Chip ABCSTARV1 2021-10-22T20:59:13.333Z
ABC Chip ABCSTARV1 2021-10-22T20:59:14.511Z
ABC Chip ABCSTARV1 2021-10-22T20:59:16.572Z
ABC Chip ABCSTARV1 2021-10-22T20:59:17.626Z
ABC Chip ABCSTARV1 2021-10-22T20:59:18.884Z
ABC Chip ABCSTARV1 2021-10-22T20:59:19.995Z
ABC Chip ABCSTARV1 2021-10-22T20:59:21.978Z

Parents

ComponentTypeTimestamp
Module 2021-11-24T18:31:56.139Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2021-10-07T19:52:37.539Z
Visual Inspection (Reception) 2021-10-07T19:52:37.539Z
ASIC Metrology 2021-10-06T17:46:56.577Z
Noise Occupancy PPA
Strobe Delay PPA 2022-02-10T03:33:20.000Z
Response Curve PPA 2022-02-10T03:55:19.000Z
Pedestal Trim PPA 2022-02-10T03:33:06.000Z
Visual Inspection 2021-11-10T23:17:30.850Z
Wire bonding 2021-11-10T23:17:30.850Z

Glue weight for GPC1938_X_015_B_H2


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION_RECEPTION
IService::log                              INFO                Logging status 1111 for component GPC1938_X_015_B_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC1938_X_015_B_H2/ASICGlueWeight_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION_RECEPTION.json...
IService::install                          INFO                Installed GPC1938_X_015_B_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//ASICGlueWeight_v1//GPC1938_X_018_A_H1.config
IService::next                             INFO                Scheduling GPC1938_X_018_A_H1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//ASICGlueWeight_v1//GPC1938_X_018_A_H1/1/

MetadataValue
Component type ASIC
Operator Forest Martinez-Mckinney
Date 2021-10-07T19:52:37.539+00:00
Program ASIC_X
Tip size 23.000
Pressure 25.000
Dispense time 2.460
FieldWeight/Volume
Assummed density of glue 1.077
Extracted glue weight 0.046
Total volume of ASIC glue [uL] 42.812
Volume per glue dot [nL] 823.300
Weight of glue under ASICs [mg] 46.100
Weight per 5 glue dots [mg] 4.433
Weight per glue dot [mg] 0.887
Weights of ASICs [g] 0.393
Weights of ASICs plus HCC [g] 0.407
Weights of bare hybrid [g] 2.032
Weights of stuffed hybrid [g] 2.485

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeHybridThickness       INFO                Total stack up 777.909250, chip thickness 300.000000 and glue 93.118500, giving hybrid 384.790750 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 778.206000, chip thickness 300.000000 and glue 91.698250, giving hybrid 386.507750 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 778.968750, chip thickness 300.000000 and glue 90.673167, giving hybrid 388.295583 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 779.044000, chip thickness 300.000000 and glue 86.580917, giving hybrid 392.463083 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 780.115000, chip thickness 300.000000 and glue 86.241083, giving hybrid 393.873917 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 779.772750, chip thickness 300.000000 and glue 83.442667, giving hybrid 396.330083 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 778.831500, chip thickness 300.000000 and glue 79.377083, giving hybrid 399.454417 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 776.506250, chip thickness 300.000000 and glue 80.777333, giving hybrid 395.728917 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 774.177250, chip thickness 300.000000 and glue 81.375583, giving hybrid 392.801667 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 773.157000, chip thickness 300.000000 and glue 83.521821, giving hybrid 389.635179 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 772.924000, chip thickness 300.000000 and glue 82.179750, giving hybrid 390.744250 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_v10-beta//GPC1938_X_015_B_H2/1//Data__GPC1938_X_015_B_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_v10-beta//GPC1938_X_015_B_H2/1//Results__GPC1938_X_015_B_H2.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_v10-beta//GPC1938_X_015_B_H2/1//Data__GPC1938_X_015_B_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_v10-beta//GPC1938_X_015_B_H2/1//Results__GPC1938_X_015_B_H2.txt
IService::log                              INFO                Logging status 1111 for component GPC1938_X_015_B_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC1938_X_015_B_H2/MetrologyHybrid_v10-beta-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC1938_X_015_B_H2.txt...
IService::install                          INFO                Installed Results__GPC1938_X_015_B_H2.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC1938_X_015_B_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_v10-beta//GPC1938_X_015_B_H3.config
IService::next                             INFO                Scheduling GPC1938_X_015_B_H3.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_v10-beta//GPC1938_X_015_B_H3/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAH0013067
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014274
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014275
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014276
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014277
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014278
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014279
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014281
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014282
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014283
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014284
MetadataValue
Component type X
Operator Matthew Gignac
Date 2021-10-06T17:46:56.577+00:00
Program version v10
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for GPC1938_X_015_B_H2


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 1111 for component GPC1938_X_015_B_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC1938_X_015_B_H2/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC1938_X_015_B_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//GPC1938_X_015_B_H3.config
IService::next                             INFO                Scheduling HybridBonding_GPC1938_X_015_B_H3.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//GPC1938_X_015_B_H3/1/
MetadataValue
Date 2021-11-10T23:17:30.850+00:00
Operator Kirsten Affolder
Bonder hk2
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files GPC1938_X_015_B_H2/20USBHX2000756
ElectricalSvc::getListOfFilesFromDir       INFO                Found file GPC1938_X_015_B_H2_20211022.txt
ElectricalSvc::getListOfFilesFromDir       INFO                Found file GPC1938_X_015_B_H2_RC_2_4.txt
ElectricalSvc::getListOfFilesFromDir       INFO                Found file GPC1938_X_015_B_H2_RC_2_7.txt
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files GPC1938_X_015_B_H2/20USBHX2000756
ElectricalSvc::read                        INFO                Found 2 results files...
ElectricalSvc::read                        INFO                Analyzing test ResponseCurve for component GPC1938_X_015_B_H2
ElectricalSvc::read                        INFO                Detected 0 dead channels
ElectricalSvc::read                        INFO                Detected 0 stuck channels
ElectricalSvc::read                        INFO                Detected 0 low gain channels
ElectricalSvc::read                        INFO                Detected 0 high gain channels
ElectricalSvc::read                        INFO                Detected 0 low offset channels
ElectricalSvc::read                        INFO                Detected 0 high offset channels
ElectricalSvc::read                        INFO                Detected 2560 unbonded channels
ElectricalSvc::read                        INFO                Detected 0 part bonded channels
ElectricalSvc::read                        INFO                Detected 0 high noise channels
ElectricalSvc::read                        INFO                Detected 0 inefficient channels
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//ElectricalHybrid//GPC1938_X_015_B_H2_GAIN_TEST.json
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_PPA
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_PPA
IService::log                              INFO                Logging status 0111 for component GPC1938_X_015_B_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC1938_X_015_B_H2/ElectricalHybrids-1/
IService::install                          INFO                File already installed: warningLog.txt...
IService::install                          INFO                File already installed: errorLog.txt...
IService::install                          INFO                File already installed: infoLog.txt...
IService::install                          INFO                File already installed: Gain_Channel1D.pdf...
IService::install                          INFO                File already installed: GPC1938_X_015_B_H2.root...
IService::install                          INFO                File already installed: status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//ElectricalHybrid//GPC1940_Y_008_B_H2.config
IService::next                             INFO                Scheduling Panel-38-BondIDed file to run...
IService::next                             INFO                Writing results to /home/data/output//ElectricalHybrids//GPC1940_Y_008_B_H2/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAH0013067
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014274
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014275
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014276
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014277
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014278
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014279
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014281
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014282
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014283
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USGAA1014284
  • ✘ Component is at BNL. Prohibiting upload!
  • Service has no required stages or transformations. Allowing for upload, but careful! OK to upload

DefectNumber of channels (%)
Dead 0
Stuck 0
Low gain 0
High gain 0
Low offset 0
High offset 0
Unbonded 2560
Part bonded 0
High noise 0
Inefficient 0

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.