Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION_RECEPTION
IService::log INFO Logging status 1111 for component GPC1940_Y_009_B_H4
IService::install INFO Installing output directory to /home/data/modules/GPC1940_Y_009_B_H4/ASICGlueWeight_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION_RECEPTION.json...
IService::install INFO Installed GPC1940_Y_009_B_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//ASICGlueWeight_v1//GPC1938_X_001_A_H1.config
IService::next INFO Scheduling GPC1938_X_001_A_H1.json file to run...
IService::next INFO Writing results to /home/data/output//ASICGlueWeight_v1//GPC1938_X_001_A_H1/1/
Metadata
Value
Component type
ASIC
Operator
Kirsten Affolder
Date
2021-10-20T16:56:39.297+00:00
Program
ASIC_Y.SRX
Tip size
23.000
Pressure
25.000
Dispense time
2.700
Field
Weight/Volume
Assummed density of glue
1.077
Extracted glue weight
0.045
Total volume of ASIC glue [uL]
42.069
Volume per glue dot [nL]
809.013
Weight of glue under ASICs [mg]
45.300
Weight per 5 glue dots [mg]
4.356
Weight per glue dot [mg]
0.871
Weights of ASICs [g]
0.395
Weights of ASICs plus HCC [g]
0.409
Weights of bare hybrid [g]
1.809
Weights of stuffed hybrid [g]
2.264
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 790.942250, chip thickness 300.000000 and glue 134.891125, giving hybrid 356.051125 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 793.621500, chip thickness 300.000000 and glue 131.114464, giving hybrid 362.507036 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 796.569750, chip thickness 300.000000 and glue 132.225964, giving hybrid 364.343786 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 795.942000, chip thickness 300.000000 and glue 130.860286, giving hybrid 365.081714 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 794.585250, chip thickness 300.000000 and glue 128.529571, giving hybrid 366.055679 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 794.590750, chip thickness 300.000000 and glue 125.035286, giving hybrid 369.555464 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 795.240000, chip thickness 300.000000 and glue 125.580893, giving hybrid 369.659107 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 795.954500, chip thickness 300.000000 and glue 131.454286, giving hybrid 364.500214 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 796.359000, chip thickness 300.000000 and glue 136.319321, giving hybrid 360.039679 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 795.099750, chip thickness 300.000000 and glue 135.748125, giving hybrid 359.351625 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 799.082750, chip thickness 300.000000 and glue 139.516625, giving hybrid 359.566125 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//HybridMetrology_Y_v8//GPC1940_Y_009_B_H4/1//Data__GPC1940_Y_009_B_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//HybridMetrology_Y_v8//GPC1940_Y_009_B_H4/1//Results__GPC1940_Y_009_B_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//HybridMetrology_Y_v8//GPC1940_Y_009_B_H4/1//Data__GPC1940_Y_009_B_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//HybridMetrology_Y_v8//GPC1940_Y_009_B_H4/1//Results__GPC1940_Y_009_B_H4.txt
IService::log INFO Logging status 1111 for component GPC1940_Y_009_B_H4
IService::install INFO Installing output directory to /home/data/modules/GPC1940_Y_009_B_H4/HybridMetrology_Y_v8-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC1940_Y_009_B_H4.txt...
IService::install INFO Installed Results__GPC1940_Y_009_B_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC1940_Y_009_B_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_Y_v8//GPC1940_Y_009_B_H3.config
IService::next INFO Scheduling GPC1940-Y-009-B-H3.txt file to run...
IService::next INFO Writing results to /home/data/output//HybridMetrology_Y_v8//GPC1940_Y_009_B_H3/1/
Metadata
Value
Component type
Y
Operator
Kirsten Affolder
Date
2021-10-20T22:38:27.330+00:00
Program version
v8
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC1940_Y_009_B_H4
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC1940_Y_009_B_H4
IService::install INFO Installing output directory to /home/data/modules/GPC1940_Y_009_B_H4/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC1940_Y_009_B_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC1940_Y_009_B_H5.config
IService::next INFO Scheduling HybridBonding_GPC1940_Y_009_B_H5.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC1940_Y_009_B_H5/1/
Metadata
Value
Date
2021-11-10T23:31:59.715+00:00
Operator
Kirsten Affolder
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC1940_Y_009_B_H4/20USBHY0000222
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC1940_Y_009_B_H4_RC_4_6.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC1940_Y_009_B_H4_RC_4_3.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC1940_Y_009_B_H4_20220224.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC1940_Y_009_B_H4/20USBHY0000222
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1940_Y_009_B_H4_20220224_4_16.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1940_Y_009_B_H4_20220224_4_6.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1940_Y_009_B_H4_20220224_4_3.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1940_Y_009_B_H4_20220224_4_2.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC1940_Y_009_B_H4_20220224_4_1.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC1940_Y_009_B_H4
ElectricalSvc::read INFO Detected 0 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2560 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrid//GPC1940_Y_009_B_H4_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::log INFO Logging status 1111 for component GPC1940_Y_009_B_H4
IService::install INFO Installing output directory to /home/data/modules/GPC1940_Y_009_B_H4/ElectricalHybrids-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC1940_Y_009_B_H4_20220224_4_1.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC1940_Y_009_B_H4_20220224_4_2.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC1940_Y_009_B_H4_20220224_4_6.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC1940_Y_009_B_H4_20220224_4_3.json...
IService::install INFO File already installed: GPC1940_Y_009_B_H4.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrid//GPC1940_Y_008_B_H3.config
IService::next INFO Scheduling Panel-29-BondIDed file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids//GPC1940_Y_008_B_H3/1/
Defect
Number of channels (%)
Dead
0
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2560
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.