Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2149_X_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_X_006_C_H1/GlueWeightHybridASIC_PPB_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2001264_6C68ABFF-F4DB-4EF9-8371-85B6D1AECAE9.jpeg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2149_X_006_C_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PPB_v1//20USBHX2001263.config
IService::next INFO Scheduling Data_20USBHX2001263.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PPB_v1//GPC2149_X_006_C_H0/1/
Metadata
Value
Component type
Operator
KA AND
Date
2023-03-20T23:09:13.329+00:00
Program
ASIC-X-PPB.SRC
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
40.397
Volume per glue dot [nL]
776.867
Weight of glue under ASICs [mg]
43.500
Weights of bare hybrid [g]
2.169
Weights of stuffed hybrid [g]
2.213
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 793.921500, chip thickness 300.000000 and glue 89.656250, giving hybrid 404.265250 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 785.594565, chip thickness 300.000000 and glue 83.264500, giving hybrid 402.330065 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 783.227780, chip thickness 300.000000 and glue 77.996000, giving hybrid 405.231780 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.068038, chip thickness 300.000000 and glue 78.816222, giving hybrid 401.251816 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 777.449273, chip thickness 300.000000 and glue 78.452889, giving hybrid 398.996385 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 776.857055, chip thickness 300.000000 and glue 75.928444, giving hybrid 400.928611 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 777.920964, chip thickness 300.000000 and glue 76.929472, giving hybrid 400.991492 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.789633, chip thickness 300.000000 and glue 76.410944, giving hybrid 398.378688 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 784.862508, chip thickness 300.000000 and glue 73.237167, giving hybrid 411.625342 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 790.819846, chip thickness 300.000000 and glue 77.464125, giving hybrid 413.355721 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 781.816500, chip thickness 300.000000 and glue 75.078125, giving hybrid 406.738375 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H1/1//Data__GPC2149_X_006_C_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H1/1//Results__GPC2149_X_006_C_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H1/1//Data__GPC2149_X_006_C_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H1/1//Results__GPC2149_X_006_C_H1.txt
IService::log INFO Logging status 1111 for component GPC2149_X_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_X_006_C_H1/MetrologyHybrid_PPB_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2149_X_006_C_H1.txt...
IService::install INFO Installed Results__GPC2149_X_006_C_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2149_X_006_C_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H0.config
IService::next INFO Scheduling GPC2150-18-C0-5.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H0/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000781
Measurement::addPoint ERROR Unknown type ?! Ignoring!
Metadata
Value
Component type
X
Operator
Tony Affolder
Date
2023-03-20T21:23:22.738+00:00
Program version
PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2149_X_006_C_H1
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2149_X_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_X_006_C_H1/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2149_X_006_C_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2149_X_006_C_H6.config
IService::next INFO Scheduling HybridBonding_GPC2149_X_006_C_H6.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2149_X_006_C_H6/1/
Metadata
Value
Date
2023-03-29T20:39:31.667+00:00
Operator
Noah Nagel
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2149_X_006_C_H1/20USBHX2001264
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2149_X_006_C_H1/20USBHX2001264
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_X_006_C_H1_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_X_006_C_H1_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_X_006_C_H1_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_X_006_C_H1_STROBE_DELAY_BURNIN.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2149_X_006_C_H1_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 1111 for component GPC2149_X_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_X_006_C_H1/BurnInHybrids_PROD_v2-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_BURNIN_GPC2149_X_006_C_H1_PEDESTAL_TRIM_BURNIN.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_BURNIN_GPC2149_X_006_C_H1_STROBE_DELAY_BURNIN.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2149_X_006_C_H1_RESPONSE_CURVE_BURNIN.json...
IService::install INFO File already installed: DB_READY_NO_BURNIN_GPC2149_X_006_C_H1_NO_BURNIN.json...
IService::install INFO File already installed: GPC2149_X_006_C_H1.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2150_X_018_C_H0.config
IService::next INFO Scheduling Panel32_28_39_40_PPB_200h_PC_merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2150_X_018_C_H0/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2149_X_006_C_H1
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000781
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
