Results for GPC2149_X_006_C_H2


Basic Information for GPC2149_X_006_C_H2


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0138
Serial Number 20USBHX2001265
Assembled True
Completed True
Current Location Brookhaven National Laboratory
Manufacture ID GPC2149_X_006_C_H2
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
ABC Chip ABCSTAR 2023-03-20T19:20:06.835Z
STAR Hybrid Flex X 2023-03-20T19:21:22.014Z
HCC Chip HCCSTARV1 2023-04-14T19:08:52.446Z
ABC Chip ABCSTARV1 2023-04-14T19:08:52.932Z
ABC Chip ABCSTARV1 2023-04-14T19:08:53.466Z
ABC Chip ABCSTARV1 2023-04-14T19:08:53.963Z
ABC Chip ABCSTARV1 2023-04-14T19:08:54.505Z
ABC Chip ABCSTARV1 2023-04-14T19:08:55.012Z
ABC Chip ABCSTARV1 2023-04-14T19:08:55.994Z
ABC Chip ABCSTARV1 2023-04-14T19:08:56.525Z
ABC Chip ABCSTARV1 2023-04-14T19:08:57.016Z
ABC Chip ABCSTARV1 2023-04-14T19:08:57.538Z
ABC Chip ABCSTARV1 2023-04-14T19:08:58.027Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2023-04-21T00:18:28.575Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2023-04-10T20:02:47.853Z
ASIC Metrology 2023-03-20T21:23:22.741Z
Visual Inspection 2023-04-10T20:02:47.853Z

Glue weight for GPC2149_X_006_C_H2


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 1111 for component GPC2149_X_006_C_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2149_X_006_C_H2/GlueWeightHybridASIC_PPB_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2149_X_006_C_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//GlueWeightHybridASIC_PPB_v1//20USBHX2001266.config
IService::next                             INFO                Scheduling Data_20USBHX2001266.json file to run...
IService::next                             INFO                Writing results to /home/data/output//GlueWeightHybridASIC_PPB_v1//GPC2149_X_006_C_H4/1/

MetadataValue
Component type
Operator Aware Deshmukh
Date 2023-04-10T20:02:47.853+00:00
Program ASIC-X-PPB.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 42.440
Volume per glue dot [nL] 816.157
Weight of glue under ASICs [mg] 45.700
Weights of bare hybrid [g] 2.175
Weights of stuffed hybrid [g] 2.220

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeHybridThickness       INFO                Total stack up 789.257000, chip thickness 300.000000 and glue 94.454125, giving hybrid 394.802875 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 784.351263, chip thickness 300.000000 and glue 89.525278, giving hybrid 394.825986 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 780.799489, chip thickness 300.000000 and glue 85.479389, giving hybrid 395.320100 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 778.326356, chip thickness 300.000000 and glue 83.777833, giving hybrid 394.548523 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 776.041467, chip thickness 300.000000 and glue 83.030778, giving hybrid 393.010689 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 775.914210, chip thickness 300.000000 and glue 82.851889, giving hybrid 393.062321 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 776.919859, chip thickness 300.000000 and glue 84.105472, giving hybrid 392.814386 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 773.506653, chip thickness 300.000000 and glue 80.958861, giving hybrid 392.547792 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 782.174336, chip thickness 300.000000 and glue 79.593944, giving hybrid 402.580392 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 782.993305, chip thickness 300.000000 and glue 78.061250, giving hybrid 404.932055 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 780.808250, chip thickness 300.000000 and glue 79.657125, giving hybrid 401.151125 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H2/1//Data__GPC2149_X_006_C_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H2/1//Results__GPC2149_X_006_C_H2.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H2/1//Data__GPC2149_X_006_C_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H2/1//Results__GPC2149_X_006_C_H2.txt
IService::log                              INFO                Logging status 1111 for component GPC2149_X_006_C_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2149_X_006_C_H2/MetrologyHybrid_PPB_X_v0-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC2149_X_006_C_H2.txt...
IService::install                          INFO                Installed Results__GPC2149_X_006_C_H2.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC2149_X_006_C_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H0.config
IService::next                             INFO                Scheduling GPC-2149-6-c0_2_4_5_6-2150-18-c-4.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H0/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0000782
Measurement::addPoint                      ERROR               Unknown type ?! Ignoring!
MetadataValue
Component type X
Operator Tony Affolder
Date 2023-03-20T21:23:22.741+00:00
Program version PPB_cloneable_v0_DB102
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$