Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2149_X_006_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2149_X_006_C_H4/GlueWeightHybridASIC_PPB_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2149_X_006_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PPB_v1//20USBHX2001269.config
IService::next INFO Scheduling Data_20USBHX2001269.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PPB_v1//GPC2150_X_018_C_H0/1/
Metadata
Value
Component type
Operator
Aware Deshmukh
Date
2023-04-10T20:03:33.787+00:00
Program
ASIC-X-PPB.SRC
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
41.604
Volume per glue dot [nL]
800.083
Weight of glue under ASICs [mg]
44.800
Weights of bare hybrid [g]
2.183
Weights of stuffed hybrid [g]
2.228
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 789.966500, chip thickness 300.000000 and glue 85.613250, giving hybrid 404.353250 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 784.354007, chip thickness 300.000000 and glue 85.739139, giving hybrid 398.614868 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 781.304632, chip thickness 300.000000 and glue 81.550222, giving hybrid 399.754410 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 778.214859, chip thickness 300.000000 and glue 78.993639, giving hybrid 399.221220 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.810562, chip thickness 300.000000 and glue 78.303222, giving hybrid 397.507340 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.646580, chip thickness 300.000000 and glue 79.372583, giving hybrid 396.273996 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 777.226390, chip thickness 300.000000 and glue 85.191111, giving hybrid 392.035279 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.719872, chip thickness 300.000000 and glue 81.571000, giving hybrid 393.148872 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 781.312756, chip thickness 300.000000 and glue 81.210389, giving hybrid 400.102367 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 783.024261, chip thickness 300.000000 and glue 84.986500, giving hybrid 398.037761 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.515750, chip thickness 300.000000 and glue 82.382375, giving hybrid 398.133375 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H4/1//Data__GPC2149_X_006_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H4/1//Results__GPC2149_X_006_C_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H4/1//Data__GPC2149_X_006_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2149_X_006_C_H4/1//Results__GPC2149_X_006_C_H4.txt
IService::log INFO Logging status 1111 for component GPC2149_X_006_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2149_X_006_C_H4/MetrologyHybrid_PPB_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2149_X_006_C_H4.txt...
IService::install INFO Installed Results__GPC2149_X_006_C_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2149_X_006_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H4.config
IService::next INFO Scheduling GPC-2149-6-c0_2_4_5_6-2150-18-c-4.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H4/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000784
Metadata
Value
Component type
X
Operator
Tony Affolder
Date
2023-03-20T21:23:22.744+00:00
Program version
PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$