Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2149_Y_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_Y_006_C_H1/GlueWeightHybridASIC_PPB_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHY0000332_image.jpg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2149_Y_006_C_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PPB_v1//20USBHY0000333.config
IService::next INFO Scheduling Data_20USBHY0000333.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PPB_v1//GPC2149_Y_006_C_H2/1/
Good
Metadata
Value
Component type
Operator
KA, AD
Date
2022-05-23T18:45:51.993+00:00
Program
ASIC_Y_PPB.SRC
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
42.719
Volume per glue dot [nL]
821.514
Weight of glue under ASICs [mg]
46.000
Weights of bare hybrid [g]
2.194
Weights of stuffed hybrid [g]
2.240
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 800.966951, chip thickness 300.000000 and glue 87.323056, giving hybrid 413.643896 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 795.344848, chip thickness 300.000000 and glue 72.022389, giving hybrid 423.322459 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 786.119234, chip thickness 300.000000 and glue 63.218667, giving hybrid 422.900567 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 786.204726, chip thickness 300.000000 and glue 65.614139, giving hybrid 420.590587 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 781.084406, chip thickness 300.000000 and glue 67.360694, giving hybrid 413.723711 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.917192, chip thickness 300.000000 and glue 68.492333, giving hybrid 412.424859 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.900747, chip thickness 300.000000 and glue 68.574111, giving hybrid 412.326636 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 784.074865, chip thickness 300.000000 and glue 69.366056, giving hybrid 414.708810 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 787.322015, chip thickness 300.000000 and glue 75.823167, giving hybrid 411.498849 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 790.084626, chip thickness 300.000000 and glue 87.079139, giving hybrid 403.005487 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 788.990534, chip thickness 300.000000 and glue 81.561375, giving hybrid 407.429159 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_Y_v0//GPC2149_Y_006_C_H1/1//Data__GPC2149_Y_006_C_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_Y_v0//GPC2149_Y_006_C_H1/1//Results__GPC2149_Y_006_C_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_Y_v0//GPC2149_Y_006_C_H1/1//Data__GPC2149_Y_006_C_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_Y_v0//GPC2149_Y_006_C_H1/1//Results__GPC2149_Y_006_C_H1.txt
IService::log INFO Logging status 1111 for component GPC2149_Y_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_Y_006_C_H1/MetrologyHybrid_PPB_Y_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2149_Y_006_C_H1.txt...
IService::install INFO Installed Results__GPC2149_Y_006_C_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2149_Y_006_C_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PPB_Y_v0//GPC2149_Y_006_C_H3.config
IService::next INFO Scheduling SCIPP-PPB-Hybrids-006-C1-C3-C4.PRT file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PPB_Y_v0//GPC2149_Y_006_C_H3/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000116
Metadata
Value
Component type
Y
Operator
Matthew Gignac
Date
2022-06-03T16:44:11.947+00:00
Program version
PPB_cloneable_v0_Y_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2149_Y_006_C_H1
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2149_Y_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_Y_006_C_H1/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2149_Y_006_C_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2149_Y_006_C_H6.config
IService::next INFO Scheduling HybridBonding_GPC2149_Y_006_C_H6.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2149_Y_006_C_H6/1/
Metadata
Value
Date
2022-06-06T22:59:57.887+00:00
Operator
FMM
Bonder
hk1
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2149_Y_006_C_H1/20USBHY0000332
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2149_Y_006_C_H1_20220610.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2149_Y_006_C_H1_RC_2_5.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2149_Y_006_C_H1_RC_2_8.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2149_Y_006_C_H1/20USBHY0000332
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_Y_006_C_H1_20220610_2_3.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_Y_006_C_H1_20220610_2_4.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_Y_006_C_H1_20220610_2_5.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_Y_006_C_H1_20220610_2_8.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2149_Y_006_C_H1_20220610_2_18.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC2149_Y_006_C_H1
ElectricalSvc::read INFO Detected 0 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2558 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2149_Y_006_C_H1_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::UPLOADDB INFO Working on test code NO_PPA
IService::log INFO Logging status 1111 for component GPC2149_Y_006_C_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2149_Y_006_C_H1/ElectricalHybrids_PPB_v1-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC2149_Y_006_C_H1_20220610_2_3.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC2149_Y_006_C_H1_20220610_2_4.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2149_Y_006_C_H1_20220610_2_5.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2149_Y_006_C_H1_20220610_2_8.json...
IService::install INFO File already installed: DB_READY_NO_PPA_GPC2149_Y_006_C_H1_20220610_2_18.json...
IService::install INFO File already installed: GPC2149_Y_006_C_H1.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2149_Y_006_C_H6.config
IService::next INFO Scheduling Panel-029-June-10th_final file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids_PPB_v1//GPC2149_Y_006_C_H6/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000116
Defect
Number of channels (%)
Dead
0
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2558
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
Comments for GPC2149_Y_006_C_H1
06.06.2022--23-00-55
This hybrid was bonded on the gluing jig, then moved to the panel
