Results for GPC2150-0002-B5-X


Basic Information for GPC2150-0002-B5-X


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier BNL-X-0088
Serial Number 20USBHX2001179
Assembled False
Completed True
Current Location CERN
Manufacture ID 003
User Luis Felipe Gutierrez Zagazeta

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
ABC Chip ABCSTAR 2022-12-13T18:54:42.931Z
STAR Hybrid Flex X 2022-12-13T18:54:43.924Z
HCC Chip HCCSTARV1 2023-02-06T20:22:16.182Z
ABC Chip ABCSTARV1 2023-02-06T20:22:18.575Z
ABC Chip ABCSTARV1 2023-02-06T20:22:19.790Z
ABC Chip ABCSTARV1 2023-02-06T20:22:21.132Z
ABC Chip ABCSTARV1 2023-02-06T20:22:22.339Z
ABC Chip ABCSTARV1 2023-02-06T20:22:23.922Z
ABC Chip ABCSTARV1 2023-02-06T20:22:25.187Z
ABC Chip ABCSTARV1 2023-02-06T20:22:26.896Z
ABC Chip ABCSTARV1 2023-02-06T20:22:28.502Z
ABC Chip ABCSTARV1 2023-02-06T20:22:29.899Z
ABC Chip ABCSTARV1 2023-02-06T20:22:17.371Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2023-04-06T19:24:44.150Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2022-12-13T19:12:55.000Z
ASIC Metrology
Visual Inspection 2022-12-14T16:07:50.000Z
Wire bonding 2022-12-14T16:07:19.000Z
Noise Occupancy PPA
Strobe Delay PPA 2023-02-19T02:26:48.000Z
Response Curve PPA 2023-02-19T02:29:13.000Z
Pedestal Trim PPA 2023-02-19T02:26:10.000Z