Results for GPC2150-0003-A3


Basic Information for GPC2150-0003-A3


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier BNL-X-0065
Serial Number 20USBHX2001121
Assembled True
Completed True
Current Location CERN
Manufacture ID 003
User Meny Raviv Moshe

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
ABC Chip ABCSTAR 2022-11-07T15:31:02.645Z
STAR Hybrid Flex X 2022-11-22T18:52:03.523Z
HCC Chip HCCSTARV1 2022-11-07T20:48:35.188Z
ABC Chip ABCSTARV1 2022-11-07T20:48:37.587Z
ABC Chip ABCSTARV1 2022-11-07T20:48:38.798Z
ABC Chip ABCSTARV1 2022-11-07T20:48:40.037Z
ABC Chip ABCSTARV1 2022-11-07T20:48:41.276Z
ABC Chip ABCSTARV1 2022-11-07T20:48:42.436Z
ABC Chip ABCSTARV1 2022-11-07T20:48:43.601Z
ABC Chip ABCSTARV1 2022-11-07T20:48:44.775Z
ABC Chip ABCSTARV1 2022-11-07T20:48:45.915Z
ABC Chip ABCSTARV1 2022-11-07T20:48:47.261Z
ABC Chip ABCSTARV1 2022-11-07T20:48:36.408Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2023-04-05T21:59:36.310Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2022-11-07T15:57:00.000Z
ASIC Metrology
Visual Inspection 2022-12-06T19:32:27.000Z
Wire bonding 2022-12-06T19:32:07.000Z
Noise Occupancy PPA
Strobe Delay PPA 2022-11-07T21:00:31.000Z
Response Curve PPA 2022-11-07T21:07:41.000Z
Pedestal Trim PPA 2022-11-07T21:00:22.000Z