Results for GPC2150-0007-C4-X


Basic Information for GPC2150-0007-C4-X


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier BNL-X-0073
Serial Number 20USBHX2001150
Assembled False
Completed True
Current Location CERN
Manufacture ID 003
User Luis Felipe Gutierrez Zagazeta

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
ABC Chip ABCSTAR 2022-12-08T17:14:51.152Z
STAR Hybrid Flex X 2022-12-08T17:14:51.152Z
HCC Chip HCCSTARV1 2023-01-25T17:16:18.878Z
ABC Chip ABCSTARV1 2023-01-25T17:16:21.502Z
ABC Chip ABCSTARV1 2023-01-25T17:16:22.936Z
ABC Chip ABCSTARV1 2023-01-25T17:16:24.111Z
ABC Chip ABCSTARV1 2023-01-25T17:16:25.276Z
ABC Chip ABCSTARV1 2023-01-25T17:16:26.849Z
ABC Chip ABCSTARV1 2023-01-25T17:16:28.033Z
ABC Chip ABCSTARV1 2023-01-25T17:16:29.210Z
ABC Chip ABCSTARV1 2023-01-25T17:16:30.361Z
ABC Chip ABCSTARV1 2023-01-25T17:16:31.708Z
ABC Chip ABCSTARV1 2023-01-25T17:16:20.096Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2023-04-06T18:54:55.424Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid)
ASIC Metrology
Visual Inspection 2022-12-08T22:07:39.000Z
Wire bonding 2022-12-08T22:05:05.000Z
Noise Occupancy PPA
Strobe Delay PPA 2023-02-19T02:26:48.000Z
Response Curve PPA 2023-02-19T02:29:13.000Z
Pedestal Trim PPA 2023-02-19T02:26:10.000Z