Results for GPC2150-0007-C5-X


Basic Information for GPC2150-0007-C5-X


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier BNL-X-0074
Serial Number 20USBHX2001153
Assembled False
Completed True
Current Location CERN
Manufacture ID 003
User Luis Felipe Gutierrez Zagazeta

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
ABC Chip ABCSTAR 2022-12-08T19:29:47.618Z
STAR Hybrid Flex X 2022-12-08T19:29:48.998Z
HCC Chip HCCSTARV1 2023-01-25T17:16:33.740Z
ABC Chip ABCSTARV1 2023-01-25T17:16:36.196Z
ABC Chip ABCSTARV1 2023-01-25T17:16:37.403Z
ABC Chip ABCSTARV1 2023-01-25T17:16:38.658Z
ABC Chip ABCSTARV1 2023-01-25T17:16:39.916Z
ABC Chip ABCSTARV1 2023-01-25T17:16:41.260Z
ABC Chip ABCSTARV1 2023-01-25T17:16:42.400Z
ABC Chip ABCSTARV1 2023-01-25T17:16:43.582Z
ABC Chip ABCSTARV1 2023-01-25T17:16:44.862Z
ABC Chip ABCSTARV1 2023-01-25T17:16:46.159Z
ABC Chip ABCSTARV1 2023-01-25T17:16:34.966Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2023-04-14T15:24:27.530Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid)
ASIC Metrology
Visual Inspection 2023-05-17T14:36:52.000Z
Wire bonding 2023-05-17T11:22:03.000Z
Noise Occupancy PPA
Strobe Delay PPA 2023-02-19T02:26:48.000Z
Response Curve PPA 2023-02-19T02:29:13.000Z
Pedestal Trim PPA 2023-02-19T02:26:10.000Z