Results for GPC2150-0010-A2-X


Basic Information for GPC2150-0010-A2-X


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier BNL-X-0092
Serial Number 20USBHX2001183
Assembled True
Completed True
Current Location CERN
Manufacture ID 003
User Luis Felipe Gutierrez Zagazeta

Children

ComponentTypeTimestamp
HCC Chip HCCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
ABC Chip ABCSTAR 2022-12-14T18:11:28.552Z
STAR Hybrid Flex X 2022-12-14T18:11:29.578Z
HCC Chip HCCSTARV1 2023-01-26T18:26:37.217Z
ABC Chip ABCSTARV1 2023-01-26T18:26:39.662Z
ABC Chip ABCSTARV1 2023-01-26T18:26:40.849Z
ABC Chip ABCSTARV1 2023-01-26T18:26:42.090Z
ABC Chip ABCSTARV1 2023-01-26T18:26:43.421Z
ABC Chip ABCSTARV1 2023-01-26T18:26:44.666Z
ABC Chip ABCSTARV1 2023-01-26T18:26:45.836Z
ABC Chip ABCSTARV1 2023-01-26T18:26:46.995Z
ABC Chip ABCSTARV1 2023-01-26T18:26:48.266Z
ABC Chip ABCSTARV1 2023-01-26T18:26:49.447Z
ABC Chip ABCSTARV1 2023-01-26T18:26:38.469Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2023-04-06T19:10:33.240Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2022-12-14T18:43:55.000Z
ASIC Metrology
Visual Inspection 2022-12-16T14:54:35.000Z
Wire bonding 2022-12-16T14:54:08.000Z
Noise Occupancy PPA
Strobe Delay PPA 2023-02-19T02:26:48.000Z
Response Curve PPA 2023-02-19T02:29:13.000Z
Pedestal Trim PPA 2023-02-19T02:26:10.000Z