Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2150_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2150_X_011_B_H0/GlueWeightHybridASIC_PPB_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2001185_image.jpg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2150_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PPB_v1//20USBHX2001186.config
IService::next INFO Scheduling Data_20USBHX2001186.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PPB_v1//GPC2150_X_011_B_H1/1/
Metadata
Value
Component type
Operator
FMM and
Date
2022-12-15T00:05:55.390+00:00
Program
ASIC X ppb
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
42.069
Volume per glue dot [nL]
809.013
Weight of glue under ASICs [mg]
45.300
Weights of bare hybrid [g]
2.097
Weights of stuffed hybrid [g]
2.142
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 792.016250, chip thickness 300.000000 and glue 95.570500, giving hybrid 396.445750 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 786.997762, chip thickness 300.000000 and glue 91.870361, giving hybrid 395.127401 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 783.420570, chip thickness 300.000000 and glue 88.566222, giving hybrid 394.854348 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 778.590039, chip thickness 300.000000 and glue 88.468111, giving hybrid 390.121928 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.906690, chip thickness 300.000000 and glue 84.211750, giving hybrid 391.694940 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 776.983444, chip thickness 300.000000 and glue 84.790528, giving hybrid 392.192916 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 778.301088, chip thickness 300.000000 and glue 87.027167, giving hybrid 391.273921 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 777.803429, chip thickness 300.000000 and glue 89.243917, giving hybrid 388.559513 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 782.154355, chip thickness 300.000000 and glue 91.924250, giving hybrid 390.230105 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 784.113583, chip thickness 300.000000 and glue 94.403375, giving hybrid 389.710208 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 779.243500, chip thickness 300.000000 and glue 84.202500, giving hybrid 395.041000 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_011_B_H0/1//Data__GPC2150_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_011_B_H0/1//Results__GPC2150_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_011_B_H0/1//Data__GPC2150_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_011_B_H0/1//Results__GPC2150_X_011_B_H0.txt
IService::log INFO Logging status 1111 for component GPC2150_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2150_X_011_B_H0/MetrologyHybrid_PPB_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2150_X_011_B_H0.txt...
IService::install INFO Installed Results__GPC2150_X_011_B_H0.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2150_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PPB_X_v0//GPC2150_X_011_B_H1.config
IService::next INFO Scheduling GPC2150-Y-011-B0-5.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_011_B_H1/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000507
Metadata
Value
Component type
X
Operator
Kirsten Affolder
Date
2022-12-15T01:35:57.255+00:00
Program version
PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2150_X_011_B_H0
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Wirebond number(s) 767 with commment source didn't stick
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
WireBondSvc::run INFO Wirebond number(s) 767 with commment pulled off and rebonded
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2150_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2150_X_011_B_H0/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2150_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2149_Y_007_B_H5.config
IService::next INFO Scheduling HybridBonding_GPC2149_Y_007_B_H5.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2149_Y_007_B_H5/1/
Metadata
Value
Date
2022-12-16T00:13:15.875+00:00
Operator
KA
Bonder
hk2
Version
v1
Bond number
Type
Comment
767
FAILED_HYBRID_TO_PANEL
source didn't stick
767
REPAIRED_HYBRID_TO_PANEL
pulled off and rebonded
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2150_X_011_B_H0/20USBHX2001185
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2150_X_011_B_H0_20230224.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2150_X_011_B_H0_RC_6_4.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2150_X_011_B_H0_RC_6_7.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2150_X_011_B_H0/20USBHX2001185
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2150_X_011_B_H0_20230224_6_2_PEDESTAL_TRIM_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2150_X_011_B_H0_20230224_6_3_STROBE_DELAY_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2150_X_011_B_H0_20230224_6_4_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2150_X_011_B_H0_20230224_6_7_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2150_X_011_B_H0_20230224_6_17_NO_PPA.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC2150_X_011_B_H0
ElectricalSvc::read INFO Detected 0 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2559 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2150_X_011_B_H0_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::UPLOADDB INFO Working on test code NO_PPA
IService::log INFO Logging status 1111 for component GPC2150_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2150_X_011_B_H0/ElectricalHybrids_PPB_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Gain_Channel1D.pdf...
IService::install INFO Installed DB_READY_PEDESTAL_TRIM_PPA_GPC2150_X_011_B_H0_20230224_6_2_PEDESTAL_TRIM_PPA.json...
IService::install INFO Installed DB_READY_STROBE_DELAY_PPA_GPC2150_X_011_B_H0_20230224_6_3_STROBE_DELAY_PPA.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_PPA_GPC2150_X_011_B_H0_20230224_6_4_RESPONSE_CURVE_PPA.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_PPA_GPC2150_X_011_B_H0_20230224_6_7_RESPONSE_CURVE_PPA.json...
IService::install INFO Installed DB_READY_NO_PPA_GPC2150_X_011_B_H0_20230224_6_17_NO_PPA.json...
IService::install INFO Installed GPC2150_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2149_Y_007_B_H5.config
IService::next INFO Scheduling Panel_037_fuseID file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids_PPB_v1//GPC2149_Y_007_B_H5/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2150_X_011_B_H0
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000507
Defect
Number of channels (%)
Dead
0
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2559
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
