Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2150_X_018_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2150_X_018_C_H4/GlueWeightHybridASIC_PPB_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2150_X_018_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PPB_v1//20USBHX2001323.config
IService::next INFO Scheduling Data_20USBHX2001323.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PPB_v1//GPC2206_X_008_A_H4/1/
Metadata
Value
Component type
Operator
Aware Deshmukh
Date
2023-04-10T20:05:40.838+00:00
Program
ASIC-X-PPB.SRC
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
41.604
Volume per glue dot [nL]
800.083
Weight of glue under ASICs [mg]
44.800
Weights of bare hybrid [g]
2.071
Weights of stuffed hybrid [g]
2.116
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 786.252750, chip thickness 300.000000 and glue 95.747750, giving hybrid 390.505000 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 781.573177, chip thickness 300.000000 and glue 94.653111, giving hybrid 386.920066 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 779.415632, chip thickness 300.000000 and glue 90.341306, giving hybrid 389.074326 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.867965, chip thickness 300.000000 and glue 90.537778, giving hybrid 385.330187 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 773.742861, chip thickness 300.000000 and glue 89.410028, giving hybrid 384.332833 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.242362, chip thickness 300.000000 and glue 91.255361, giving hybrid 382.987001 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.710666, chip thickness 300.000000 and glue 90.042389, giving hybrid 385.668277 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 772.337255, chip thickness 300.000000 and glue 90.086444, giving hybrid 382.250810 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.655494, chip thickness 300.000000 and glue 90.608167, giving hybrid 390.047328 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.141853, chip thickness 300.000000 and glue 90.596750, giving hybrid 389.545103 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.514250, chip thickness 300.000000 and glue 95.060875, giving hybrid 385.453375 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H4/1//Data__GPC2150_X_018_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H4/1//Results__GPC2150_X_018_C_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H4/1//Data__GPC2150_X_018_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2150_X_018_C_H4/1//Results__GPC2150_X_018_C_H4.txt
IService::log INFO Logging status 1111 for component GPC2150_X_018_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2150_X_018_C_H4/MetrologyHybrid_PPB_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2150_X_018_C_H4.txt...
IService::install INFO Installed Results__GPC2150_X_018_C_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2150_X_018_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PPB_X_v0//GPC2206_X_008_A_H2.config
IService::next INFO Scheduling GPC2206-008-A-H2-H4-H6.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2206_X_008_A_H2/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0000665
Metadata
Value
Component type
X
Operator
Tony Affolder
Date
2023-03-21T01:01:29.791+00:00
Program version
PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$