Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.979000, chip thickness 300.000000 and glue 121.602500, giving hybrid 580.376500 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1000.993941, chip thickness 300.000000 and glue 121.459167, giving hybrid 579.534774 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 996.705488, chip thickness 300.000000 and glue 127.884417, giving hybrid 568.821072 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 998.924862, chip thickness 300.000000 and glue 129.301611, giving hybrid 569.623251 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.958480, chip thickness 300.000000 and glue 125.745667, giving hybrid 574.212813 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.256521, chip thickness 300.000000 and glue 125.637528, giving hybrid 573.618993 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.156656, chip thickness 300.000000 and glue 124.170722, giving hybrid 574.985934 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.087917, chip thickness 300.000000 and glue 124.994000, giving hybrid 574.093917 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1000.979783, chip thickness 300.000000 and glue 125.249583, giving hybrid 575.730200 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 994.073105, chip thickness 300.000000 and glue 106.947875, giving hybrid 587.125230 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.550750, chip thickness 300.000000 and glue 117.417875, giving hybrid 584.132875 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/1//Data__GPC2230_X_016_B_H6.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/1//Results__GPC2230_X_016_B_H6.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/1//Data__GPC2230_X_016_B_H6.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/1//Results__GPC2230_X_016_B_H6.txt
IService::log INFO Logging status 0111 for component GPC2230_X_016_B_H6
IService::install INFO Installing output directory to /home/data/modules/GPC2230_X_016_B_H6/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2230_X_016_B_H6.txt...
IService::install INFO Installed Results__GPC2230_X_016_B_H6.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2230_X_016_B_H6.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0001915
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1004.737250, chip thickness 300.000000 and glue 116.353375, giving hybrid 588.383875 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.991260, chip thickness 300.000000 and glue 120.788694, giving hybrid 581.202565 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 997.647071, chip thickness 300.000000 and glue 125.944417, giving hybrid 571.702654 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.041183, chip thickness 300.000000 and glue 127.616056, giving hybrid 571.425127 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.760508, chip thickness 300.000000 and glue 124.484583, giving hybrid 575.275925 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 997.608395, chip thickness 300.000000 and glue 123.272639, giving hybrid 574.335756 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 996.800515, chip thickness 300.000000 and glue 124.079250, giving hybrid 572.721265 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 998.611319, chip thickness 300.000000 and glue 125.899222, giving hybrid 572.712097 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1000.020218, chip thickness 300.000000 and glue 125.774611, giving hybrid 574.245607 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.817582, chip thickness 300.000000 and glue 104.038875, giving hybrid 587.778707 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.533000, chip thickness 300.000000 and glue 115.173875, giving hybrid 586.359125 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/2//Data__GPC2230_X_016_B_H6.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/2//Results__GPC2230_X_016_B_H6.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/2//Data__GPC2230_X_016_B_H6.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2230_X_016_B_H6/2//Results__GPC2230_X_016_B_H6.txt
IService::log INFO Logging status 0111 for component GPC2230_X_016_B_H6
IService::install INFO Installing output directory to /home/data/modules/GPC2230_X_016_B_H6/MetrologyHybrid_PROD_X_v2_thick_interposer-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2230_X_016_B_H6.txt...
IService::install INFO Installed Results__GPC2230_X_016_B_H6.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2230_X_016_B_H6.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0001915
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2230_X_016_B_H6/20USBHX2001567
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2230_X_016_B_H6/20USBHX2001567
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2230_X_016_B_H6_NO.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2230_X_016_B_H6_PEDESTAL_TRIM.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2230_X_016_B_H6_RESPONSE_CURVE.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2230_X_016_B_H6_STROBE_DELAY.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2230_X_016_B_H6_3PG.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2230_X_016_B_H6_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 0111 for component GPC2230_X_016_B_H6
IService::install INFO Installing output directory to /home/data/modules/GPC2230_X_016_B_H6/BurnInHybrids_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_PEDESTAL_TRIM_BURNIN_GPC2230_X_016_B_H6_PEDESTAL_TRIM.json...
IService::install INFO Installed DB_READY_STROBE_DELAY_BURNIN_GPC2230_X_016_B_H6_STROBE_DELAY.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_GPC2230_X_016_B_H6_RESPONSE_CURVE.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_GPC2230_X_016_B_H6_3PG.json...
IService::install INFO Installed DB_READY_NO_BURNIN_GPC2230_X_016_B_H6_NO.json...
IService::install INFO Installed GPC2230_X_016_B_H6.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_023_B_H6-1.config
IService::next INFO Scheduling Test_BurnIn_LBNL_009_010_merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_023_B_H6/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2230_X_016_B_H6
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0001915
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.