Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/GlueWeightHybridASIC_PROD_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2001433_image.jpg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2233_X_003_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PROD_v1//20USBHX2001434.config
IService::next INFO Scheduling Data_20USBHX2001434.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PROD_v1//GPC2233_X_003_C_H5/1/
Metadata
Value
Component type
Operator
NN FMM
Date
2023-06-22T22:13:34.574+00:00
Program
ATLAS_X_PPB
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
40.769
Volume per glue dot [nL]
784.010
Weight of glue under ASICs [mg]
43.900
Weights of bare hybrid [g]
2.323
Weights of stuffed hybrid [g]
2.367
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 845.777750, chip thickness 300.000000 and glue 121.919250, giving hybrid 423.858500 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 839.694975, chip thickness 300.000000 and glue 120.274028, giving hybrid 419.420947 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 836.902594, chip thickness 300.000000 and glue 119.048333, giving hybrid 417.854261 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 833.378390, chip thickness 300.000000 and glue 118.366444, giving hybrid 415.011946 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 830.567030, chip thickness 300.000000 and glue 115.430750, giving hybrid 415.136280 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 829.005750, chip thickness 300.000000 and glue 115.896028, giving hybrid 413.109723 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 829.597478, chip thickness 300.000000 and glue 118.116889, giving hybrid 411.480589 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 826.347369, chip thickness 300.000000 and glue 120.070806, giving hybrid 406.276563 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 832.260145, chip thickness 300.000000 and glue 119.969111, giving hybrid 412.291034 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 832.509982, chip thickness 300.000000 and glue 122.421125, giving hybrid 410.088857 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 831.502500, chip thickness 300.000000 and glue 124.534250, giving hybrid 406.968250 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_003_C_H4/1//Data__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_003_C_H4/1//Results__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_003_C_H4/1//Data__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_003_C_H4/1//Results__GPC2233_X_003_C_H4.txt
IService::log INFO Logging status 1111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/MetrologyHybrid_PROD_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_003_C_H4.txt...
IService::install INFO Installed Results__GPC2233_X_003_C_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_003_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v0//GPC2233_X_003_C_H3.config
IService::next INFO Scheduling GPC2233-X-3C-H5-0.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_003_C_H3/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002151
Measurement::addPoint ERROR Unknown type ?! Ignoring!
Metadata
Value
Component type
X
Operator
Alex Wang
Date
2023-06-23T00:21:15.130+00:00
Program version
MetrologyHybrid_PROD_X_v0/PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1004.270750, chip thickness 300.000000 and glue 102.124375, giving hybrid 602.146375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1005.629769, chip thickness 300.000000 and glue 114.734639, giving hybrid 590.895130 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1003.052552, chip thickness 300.000000 and glue 108.107472, giving hybrid 594.945080 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.347442, chip thickness 300.000000 and glue 107.812306, giving hybrid 593.535136 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1002.887178, chip thickness 300.000000 and glue 107.261583, giving hybrid 595.625595 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1003.782631, chip thickness 300.000000 and glue 108.271583, giving hybrid 595.511048 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1002.395813, chip thickness 300.000000 and glue 111.490639, giving hybrid 590.905174 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 994.884419, chip thickness 300.000000 and glue 104.830417, giving hybrid 590.054002 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 990.703376, chip thickness 300.000000 and glue 109.376194, giving hybrid 581.327182 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.538031, chip thickness 300.000000 and glue 109.877375, giving hybrid 581.660656 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 989.839500, chip thickness 300.000000 and glue 66.183375, giving hybrid 623.656125 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/1//Data__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/1//Results__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/1//Data__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/1//Results__GPC2233_X_003_C_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_003_C_H4.txt...
IService::install INFO Installed Results__GPC2233_X_003_C_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_003_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H5-1.config
IService::next INFO Scheduling GPC2233-X-003-C0-5_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H5/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002151
✔ Component is at UCSC. OK to upload
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1004.270750, chip thickness 300.000000 and glue 102.124375, giving hybrid 602.146375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1005.629769, chip thickness 300.000000 and glue 114.734639, giving hybrid 590.895130 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1003.052552, chip thickness 300.000000 and glue 108.107472, giving hybrid 594.945080 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.347442, chip thickness 300.000000 and glue 107.812306, giving hybrid 593.535136 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1002.887178, chip thickness 300.000000 and glue 107.261583, giving hybrid 595.625595 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1003.782631, chip thickness 300.000000 and glue 108.271583, giving hybrid 595.511048 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1002.395813, chip thickness 300.000000 and glue 111.490639, giving hybrid 590.905174 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 994.884419, chip thickness 300.000000 and glue 104.830417, giving hybrid 590.054002 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 990.703376, chip thickness 300.000000 and glue 109.376194, giving hybrid 581.327182 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.538031, chip thickness 300.000000 and glue 109.877375, giving hybrid 581.660656 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 989.839500, chip thickness 300.000000 and glue 66.183375, giving hybrid 623.656125 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/2//Data__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/2//Results__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/2//Data__GPC2233_X_003_C_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H4/2//Results__GPC2233_X_003_C_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_003_C_H4.txt...
IService::install INFO Installed Results__GPC2233_X_003_C_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_003_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H5-2.config
IService::next INFO Scheduling GPC2233-X-003-C0-5_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_003_C_H5/2/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002151
✔ Component is at UCSC. OK to upload
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2233_X_003_C_H4
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2233_X_003_C_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2233_X_003_C_H3.config
IService::next INFO Scheduling HybridBonding_GPC2233_X_003_C_H3.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2233_X_003_C_H3/1/
Metadata
Value
Date
2023-06-26T22:40:14.640+00:00
Operator
FMM
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2233_X_003_C_H4/20USBHX2001433
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2233_X_003_C_H4_20230627.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2233_X_003_C_H4_RC_4_3.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2233_X_003_C_H4_RC_4_6.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2233_X_003_C_H4/20USBHX2001433
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_20230627_4_1_PEDESTAL_TRIM_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_20230627_4_2_STROBE_DELAY_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_20230627_4_3_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_20230627_4_6_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_20230627_4_16_NO_PPA.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC2233_X_003_C_H4
ElectricalSvc::read INFO Detected 0 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2559 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2233_X_003_C_H4_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::UPLOADDB INFO Working on test code NO_PPA
IService::log INFO Logging status 1111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/ElectricalHybrids_PPB_v1-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC2233_X_003_C_H4_20230627_4_1_PEDESTAL_TRIM_PPA.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC2233_X_003_C_H4_20230627_4_2_STROBE_DELAY_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2233_X_003_C_H4_20230627_4_3_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2233_X_003_C_H4_20230627_4_6_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_NO_PPA_GPC2233_X_003_C_H4_20230627_4_16_NO_PPA.json...
IService::install INFO File already installed: GPC2233_X_003_C_H4.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2233_X_003_C_H5.config
IService::next INFO Scheduling Panel47_June27 file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids_PPB_v1//GPC2233_X_003_C_H5/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2233_X_003_C_H4
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002151
Defect
Number of channels (%)
Dead
0
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2559
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2233_X_003_C_H4/20USBHX2001433
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2233_X_003_C_H4/20USBHX2001433
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_003_C_H4_STROBE_DELAY_BURNIN.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_003_C_H4_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 1111 for component GPC2233_X_003_C_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_003_C_H4/BurnInHybrids_PROD_v2-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_BURNIN_GPC2233_X_003_C_H4_PEDESTAL_TRIM_BURNIN.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_BURNIN_GPC2233_X_003_C_H4_STROBE_DELAY_BURNIN.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2233_X_003_C_H4_RESPONSE_CURVE_BURNIN.json...
IService::install INFO File already installed: DB_READY_NO_BURNIN_GPC2233_X_003_C_H4_NO_BURNIN.json...
IService::install INFO File already installed: GPC2233_X_003_C_H4.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_003_C_H5.config
IService::next INFO Scheduling BurnIn_43_44_45_46_47_June27_merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_003_C_H5/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2233_X_003_C_H4
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002151
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
