Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/GlueWeightHybridASIC_PROD_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2001381_image.jpg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2233_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//GlueWeightHybridASIC_PROD_v1//20USBHX2001382.config
IService::next INFO Scheduling Data_20USBHX2001382.json file to run...
IService::next INFO Writing results to /home/data/output//GlueWeightHybridASIC_PROD_v1//GPC2233_X_011_B_H1/1/
Metadata
Value
Component type
Operator
FMM, AND
Date
2023-06-05T22:31:28.845+00:00
Program
ASIC_X_PPB
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
41.511
Volume per glue dot [nL]
798.298
Weight of glue under ASICs [mg]
44.700
Weights of bare hybrid [g]
2.316
Weights of stuffed hybrid [g]
2.360
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 845.616500, chip thickness 300.000000 and glue 124.705875, giving hybrid 420.910625 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 838.748181, chip thickness 300.000000 and glue 121.827000, giving hybrid 416.921181 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 834.922707, chip thickness 300.000000 and glue 117.268444, giving hybrid 417.654263 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 829.932984, chip thickness 300.000000 and glue 116.092556, giving hybrid 413.840428 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 827.425493, chip thickness 300.000000 and glue 109.352833, giving hybrid 418.072659 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 826.556830, chip thickness 300.000000 and glue 106.277944, giving hybrid 420.278885 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 826.923920, chip thickness 300.000000 and glue 107.548139, giving hybrid 419.375781 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 823.200968, chip thickness 300.000000 and glue 104.821694, giving hybrid 418.379274 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 830.713406, chip thickness 300.000000 and glue 104.673000, giving hybrid 426.040406 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 832.370815, chip thickness 300.000000 and glue 107.937125, giving hybrid 424.433690 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 831.377750, chip thickness 300.000000 and glue 109.675125, giving hybrid 421.702625 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_011_B_H0/1//Data__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_011_B_H0/1//Results__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_011_B_H0/1//Data__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_011_B_H0/1//Results__GPC2233_X_011_B_H0.txt
IService::log INFO Logging status 1111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/MetrologyHybrid_PROD_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_011_B_H0.txt...
IService::install INFO Installed Results__GPC2233_X_011_B_H0.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v0//GPC2233_X_011_B_H1.config
IService::next INFO Scheduling GPC2233-X-11B-H0-5.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v0//GPC2233_X_011_B_H1/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002287
Metadata
Value
Component type
X
Operator
Kirsten Affolder
Date
2023-06-06T18:06:56.706+00:00
Program version
MetrologyHybrid_PROD_X_v0/PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1008.706500, chip thickness 300.000000 and glue 92.677125, giving hybrid 616.029375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1002.334833, chip thickness 300.000000 and glue 108.351444, giving hybrid 593.983388 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 998.319819, chip thickness 300.000000 and glue 104.892583, giving hybrid 593.427236 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.211589, chip thickness 300.000000 and glue 102.919083, giving hybrid 592.292505 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 994.545387, chip thickness 300.000000 and glue 95.759694, giving hybrid 598.785693 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 992.502958, chip thickness 300.000000 and glue 95.757667, giving hybrid 596.745291 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 993.994480, chip thickness 300.000000 and glue 96.792833, giving hybrid 597.201647 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 992.226732, chip thickness 300.000000 and glue 96.182222, giving hybrid 596.044510 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.887626, chip thickness 300.000000 and glue 95.983861, giving hybrid 595.903765 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.599995, chip thickness 300.000000 and glue 89.397250, giving hybrid 602.202745 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1004.212500, chip thickness 300.000000 and glue 101.304375, giving hybrid 602.908125 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2233_X_011_B_H0/1//Data__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2233_X_011_B_H0/1//Results__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2233_X_011_B_H0/1//Data__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2233_X_011_B_H0/1//Results__GPC2233_X_011_B_H0.txt
IService::log INFO Logging status 0111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/MetrologyHybrid_PROD_X_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_011_B_H0.txt...
IService::install INFO Installed Results__GPC2233_X_011_B_H0.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_011_B_H0.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002287
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2233_X_011_B_H0 has failed criteria!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
✔ Component is at UCSC. OK to upload
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1008.706500, chip thickness 300.000000 and glue 92.677125, giving hybrid 616.029375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1002.334833, chip thickness 300.000000 and glue 108.351444, giving hybrid 593.983388 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 998.319819, chip thickness 300.000000 and glue 104.892583, giving hybrid 593.427236 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.211589, chip thickness 300.000000 and glue 102.919083, giving hybrid 592.292505 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 994.545387, chip thickness 300.000000 and glue 95.759694, giving hybrid 598.785693 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 992.502958, chip thickness 300.000000 and glue 95.757667, giving hybrid 596.745291 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 993.994480, chip thickness 300.000000 and glue 96.792833, giving hybrid 597.201647 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 992.226732, chip thickness 300.000000 and glue 96.182222, giving hybrid 596.044510 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.887626, chip thickness 300.000000 and glue 95.983861, giving hybrid 595.903765 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.599995, chip thickness 300.000000 and glue 89.397250, giving hybrid 602.202745 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1004.212500, chip thickness 300.000000 and glue 101.304375, giving hybrid 602.908125 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_011_B_H0/1//Data__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_011_B_H0/1//Results__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_011_B_H0/1//Data__GPC2233_X_011_B_H0.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_011_B_H0/1//Results__GPC2233_X_011_B_H0.txt
IService::log INFO Logging status 0111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_011_B_H0.txt...
IService::install INFO Installed Results__GPC2233_X_011_B_H0.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_011_B_H1-1.config
IService::next INFO Scheduling GPC2233-X-011-B1_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_011_B_H1/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002287
✔ Component is at UCSC. OK to upload
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2233_X_011_B_H0
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 1111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2233_X_011_B_H0.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2233_X_011_B_H1.config
IService::next INFO Scheduling HybridBonding_GPC2233_X_011_B_H1.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2233_X_011_B_H1/1/
Metadata
Value
Date
2023-06-08T17:18:57.157+00:00
Operator
FMM
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2233_X_011_B_H0/20USBHX2001381
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2233_X_011_B_H0_20230608.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2233_X_011_B_H0_RC_4_3.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2233_X_011_B_H0_RC_4_6.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2233_X_011_B_H0/20USBHX2001381
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_20230608_4_1_PEDESTAL_TRIM_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_20230608_4_2_STROBE_DELAY_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_20230608_4_3_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_20230608_4_6_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_20230608_4_16_NO_PPA.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC2233_X_011_B_H0
ElectricalSvc::read INFO Detected 0 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2560 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2233_X_011_B_H0_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::UPLOADDB INFO Working on test code NO_PPA
IService::log INFO Logging status 1111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/ElectricalHybrids_PPB_v1-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC2233_X_011_B_H0_20230608_4_1_PEDESTAL_TRIM_PPA.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC2233_X_011_B_H0_20230608_4_2_STROBE_DELAY_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2233_X_011_B_H0_20230608_4_3_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2233_X_011_B_H0_20230608_4_6_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_NO_PPA_GPC2233_X_011_B_H0_20230608_4_16_NO_PPA.json...
IService::install INFO File already installed: GPC2233_X_011_B_H0.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2233_X_011_B_H1.config
IService::next INFO Scheduling Panel30_June8 file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids_PPB_v1//GPC2233_X_011_B_H1/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002287
Defect
Number of channels (%)
Dead
0
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2560
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2233_X_011_B_H0/20USBHX2001381
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2233_X_011_B_H0/20USBHX2001381
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_011_B_H0_STROBE_DELAY_BURNIN.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_011_B_H0_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 1111 for component GPC2233_X_011_B_H0
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_011_B_H0/BurnInHybrids_PROD_v2-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_BURNIN_GPC2233_X_011_B_H0_PEDESTAL_TRIM_BURNIN.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_BURNIN_GPC2233_X_011_B_H0_STROBE_DELAY_BURNIN.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2233_X_011_B_H0_RESPONSE_CURVE_BURNIN.json...
IService::install INFO File already installed: DB_READY_NO_BURNIN_GPC2233_X_011_B_H0_NO_BURNIN.json...
IService::install INFO File already installed: GPC2233_X_011_B_H0.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_011_B_H1.config
IService::next INFO Scheduling BurnIn_June9_merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_011_B_H1/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2233_X_011_B_H0
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002287
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
