Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1052.018750, chip thickness 300.000000 and glue 108.297500, giving hybrid 643.721250 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1032.339634, chip thickness 300.000000 and glue 110.344250, giving hybrid 621.995384 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1017.553489, chip thickness 300.000000 and glue 110.438361, giving hybrid 607.115128 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1010.932757, chip thickness 300.000000 and glue 109.926167, giving hybrid 601.006591 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.326274, chip thickness 300.000000 and glue 103.703722, giving hybrid 597.622552 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 993.416452, chip thickness 300.000000 and glue 104.387194, giving hybrid 589.029257 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 977.927973, chip thickness 300.000000 and glue 102.273806, giving hybrid 575.654167 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 979.207401, chip thickness 300.000000 and glue 99.554167, giving hybrid 579.653234 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.571592, chip thickness 300.000000 and glue 99.688306, giving hybrid 551.883287 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.504455, chip thickness 300.000000 and glue 108.602125, giving hybrid 532.902330 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 882.579750, chip thickness 300.000000 and glue 86.562125, giving hybrid 496.017625 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/1//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/1//Results__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/1//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/1//Results__GPC2233_X_012_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H0-1.config
IService::next INFO Scheduling GPC2233-X-012-A0-A1-A3-A4_2233-X-0023-B0-B1_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H0/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2233_X_012_A_H4 has failed criteria!
Measurement::addPoint ERROR Unknown type ?! Ignoring!
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1052.018750, chip thickness 300.000000 and glue 108.297500, giving hybrid 643.721250 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1032.339634, chip thickness 300.000000 and glue 110.344250, giving hybrid 621.995384 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1017.553489, chip thickness 300.000000 and glue 110.438361, giving hybrid 607.115128 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1010.932757, chip thickness 300.000000 and glue 109.926167, giving hybrid 601.006591 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.326274, chip thickness 300.000000 and glue 103.703722, giving hybrid 597.622552 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 993.416452, chip thickness 300.000000 and glue 104.387194, giving hybrid 589.029257 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 977.927973, chip thickness 300.000000 and glue 102.273806, giving hybrid 575.654167 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 979.207401, chip thickness 300.000000 and glue 99.554167, giving hybrid 579.653234 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.571592, chip thickness 300.000000 and glue 99.688306, giving hybrid 551.883287 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.504455, chip thickness 300.000000 and glue 108.602125, giving hybrid 532.902330 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 882.579750, chip thickness 300.000000 and glue 86.562125, giving hybrid 496.017625 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/2//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/2//Results__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/2//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/2//Results__GPC2233_X_012_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H0-2.config
IService::next INFO Scheduling GPC2233-X-012-A0-A1-A3-A4_2233-X-0023-B0-B1_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H0/2/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2233_X_012_A_H4 has failed criteria!
Measurement::addPoint ERROR Unknown type ?! Ignoring!
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1054.555500, chip thickness 300.000000 and glue 108.944375, giving hybrid 645.611125 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1034.250166, chip thickness 300.000000 and glue 111.032861, giving hybrid 623.217305 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1018.336752, chip thickness 300.000000 and glue 110.185889, giving hybrid 608.150863 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1010.996048, chip thickness 300.000000 and glue 109.768472, giving hybrid 601.227576 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1000.560887, chip thickness 300.000000 and glue 103.298722, giving hybrid 597.262165 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 990.229698, chip thickness 300.000000 and glue 104.041750, giving hybrid 586.187948 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 975.009325, chip thickness 300.000000 and glue 103.244333, giving hybrid 571.764992 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 962.941807, chip thickness 300.000000 and glue 99.500167, giving hybrid 563.441640 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 948.811611, chip thickness 300.000000 and glue 99.605611, giving hybrid 549.206000 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.403996, chip thickness 300.000000 and glue 108.917000, giving hybrid 531.486996 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 875.782500, chip thickness 300.000000 and glue 85.976625, giving hybrid 489.805875 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/3//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/3//Results__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/3//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/3//Results__GPC2233_X_012_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-3/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2233_X_012_A_H4 has failed criteria!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1049.801750, chip thickness 300.000000 and glue 90.389125, giving hybrid 659.412625 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1129.173476, chip thickness 300.000000 and glue 110.876222, giving hybrid 718.297254 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1174.079066, chip thickness 300.000000 and glue 111.438056, giving hybrid 762.641010 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1199.106487, chip thickness 300.000000 and glue 110.673472, giving hybrid 788.433015 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1207.872908, chip thickness 300.000000 and glue 105.437083, giving hybrid 802.435825 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1206.872650, chip thickness 300.000000 and glue 104.224750, giving hybrid 802.647900 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1193.900937, chip thickness 300.000000 and glue 100.483694, giving hybrid 793.417243 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1173.773048, chip thickness 300.000000 and glue 97.017083, giving hybrid 776.755965 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1127.395448, chip thickness 300.000000 and glue 93.512778, giving hybrid 733.882670 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1049.554340, chip thickness 300.000000 and glue 92.244875, giving hybrid 657.309465 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1084.974500, chip thickness 300.000000 and glue 85.163125, giving hybrid 699.811375 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/4//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/4//Results__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/4//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/4//Results__GPC2233_X_012_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-4/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2233_X_012_A_H4 has failed criteria!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1008.143000, chip thickness 300.000000 and glue 107.774625, giving hybrid 600.368375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 997.381066, chip thickness 300.000000 and glue 109.137917, giving hybrid 588.243150 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 993.001417, chip thickness 300.000000 and glue 111.023194, giving hybrid 581.978223 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.806707, chip thickness 300.000000 and glue 108.915750, giving hybrid 586.890957 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.796880, chip thickness 300.000000 and glue 105.640361, giving hybrid 590.156519 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.495547, chip thickness 300.000000 and glue 104.279139, giving hybrid 591.216408 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 990.700776, chip thickness 300.000000 and glue 102.286500, giving hybrid 588.414276 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 988.618662, chip thickness 300.000000 and glue 98.942250, giving hybrid 589.676412 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 985.004383, chip thickness 300.000000 and glue 99.269056, giving hybrid 585.735327 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 985.788529, chip thickness 300.000000 and glue 108.317500, giving hybrid 577.471029 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 982.849250, chip thickness 300.000000 and glue 85.665750, giving hybrid 597.183500 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/5//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/5//Results__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/5//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/5//Results__GPC2233_X_012_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-5/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1010.504500, chip thickness 300.000000 and glue 110.480000, giving hybrid 600.024500 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.816792, chip thickness 300.000000 and glue 112.620917, giving hybrid 587.195876 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.149097, chip thickness 300.000000 and glue 110.324722, giving hybrid 584.824375 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 997.666653, chip thickness 300.000000 and glue 107.865139, giving hybrid 589.801514 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 996.946174, chip thickness 300.000000 and glue 105.035944, giving hybrid 591.910230 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 996.915877, chip thickness 300.000000 and glue 103.171028, giving hybrid 593.744849 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.860415, chip thickness 300.000000 and glue 102.803528, giving hybrid 589.056887 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 990.488384, chip thickness 300.000000 and glue 99.794667, giving hybrid 590.693718 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 985.896631, chip thickness 300.000000 and glue 98.825778, giving hybrid 587.070854 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 986.884984, chip thickness 300.000000 and glue 108.356250, giving hybrid 578.528734 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 983.345000, chip thickness 300.000000 and glue 85.683625, giving hybrid 597.661375 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/6//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/6//Results__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/6//Data__GPC2233_X_012_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_012_A_H4/6//Results__GPC2233_X_012_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-6/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results__GPC2233_X_012_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name TCModules_PROD_v0 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 4 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
✘ Component is at BNL. Prohibiting upload!
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2233_X_012_A_H4/20USBHX2001578
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2233_X_012_A_H4/20USBHX2001578
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_012_A_H4_3PG.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_012_A_H4_RESPONSE_CURVE.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_012_A_H4_NO.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_012_A_H4_STROBE_DELAY.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_012_A_H4_PEDESTAL_TRIM.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_012_A_H4_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 0111 for component GPC2233_X_012_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_012_A_H4/BurnInHybrids_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_PEDESTAL_TRIM_BURNIN_GPC2233_X_012_A_H4_PEDESTAL_TRIM.json...
IService::install INFO Installed DB_READY_STROBE_DELAY_BURNIN_GPC2233_X_012_A_H4_STROBE_DELAY.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_GPC2233_X_012_A_H4_3PG.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_GPC2233_X_012_A_H4_RESPONSE_CURVE.json...
IService::install INFO Installed DB_READY_NO_BURNIN_GPC2233_X_012_A_H4_NO.json...
IService::install INFO Installed GPC2233_X_012_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_012_A_H3-1.config
IService::next INFO Scheduling Test_BurnIn_LBNL_009_010_merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_012_A_H3/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2233_X_012_A_H4
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002305
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.