Results for GPC2233_X_021_C_H0


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Basic Information for GPC2233_X_021_C_H0


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0388
Serial Number 20USBHX2002468
Batch PRESERIES_UCSC
Assembled True
Completed True
Current Location Brookhaven National Laboratory
Manufacture ID GPC2233_X_021_C_H0
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2025-04-11T02:59:17.704Z
HCC Chip HCCSTARV1 2025-04-14T21:26:03.341Z
ABC Chip ABCSTARV1 2025-04-14T21:26:03.869Z
ABC Chip ABCSTARV1 2025-04-14T21:26:04.398Z
ABC Chip ABCSTARV1 2025-04-14T21:26:04.895Z
ABC Chip ABCSTARV1 2025-04-14T21:26:05.402Z
ABC Chip ABCSTARV1 2025-04-14T21:26:05.882Z
ABC Chip ABCSTARV1 2025-04-14T21:26:06.400Z
ABC Chip ABCSTARV1 2025-04-14T21:26:06.905Z
ABC Chip ABCSTARV1 2025-04-14T21:26:07.421Z
ABC Chip ABCSTARV1 2025-04-14T21:26:07.920Z
ABC Chip ABCSTARV1 2025-04-14T21:26:08.421Z
Hybrid Interposer 2025-04-11T02:59:13.980Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2025-04-22T22:49:31.962Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2025-04-11T03:13:11.707Z
Visual Inspection 2025-04-11T22:03:54.207Z
ASIC Metrology 2025-04-11T18:29:35.177Z
Wire bonding 2025-04-11T22:03:54.207Z
Pedestal Trim Burn In 2025-04-15T00:02:24.000Z
Strobe Delay Burn In 2025-04-15T00:02:38.000Z
Response Curve Burn In 2025-04-15T00:11:37.000Z
Noise Occupancy Burn In 2025-04-15T00:11:54.000Z
Pedestal Trim TC 2025-04-25T23:47:08.000Z
Strobe Delay TC 2025-04-25T23:47:08.000Z
Response Curve TC 2025-04-25T23:47:08.000Z
Noise Occupancy TC 2025-04-25T23:47:08.000Z
Noise Occupancy PPA 2025-06-11T16:42:16.000Z
Response Curve PPA 2025-06-11T16:30:47.000Z
Pedestal Trim PPA 2025-06-11T16:27:39.000Z
Strobe Delay PPA 2025-06-11T16:28:13.000Z

Glue weight for GPC2233_X_021_C_H0


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H0/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2002468_IMG_5983.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H0.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator FMM, QFP
Date 2025-04-11T03:13:11.707+00:00
Program ASIC_X_PPB.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 40.211
Volume per glue dot [nL] 773.295
Weight of glue under ASICs [mg] 43.300
Weights of bare hybrid [g] 2.694
Weights of stuffed hybrid [g] 2.738

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               454.597000 +/- 2.930500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               19.464000 +/- 12.901340 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             435.133000
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 135.133000 +/- 14.143281 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 436.133000 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               448.733500 +/- 0.931000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               34.169111 +/- 7.535000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             414.564389
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 114.564389 +/- 9.090819 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 415.564389 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               447.067500 +/- 1.193000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               38.020778 +/- 5.069167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             409.046722
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 109.046722 +/- 7.219397 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 410.046722 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               442.396500 +/- 0.497000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               36.799111 +/- 3.427500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             405.597389
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 105.597389 +/- 6.082332 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 406.597389 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               441.901500 +/- 1.177500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               30.459778 +/- 5.250167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             411.441722
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 111.441722 +/- 7.345118 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 412.441722 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               440.021250 +/- 1.274500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               26.891778 +/- 3.536333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             413.129472
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 113.129472 +/- 6.255398 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 414.129472 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               441.396000 +/- 0.752000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               34.211778 +/- 6.301833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             407.184222
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 107.184222 +/- 8.079518 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 408.184222 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               442.598000 +/- 0.836500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               38.715333 +/- 6.053667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             403.882667
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 103.882667 +/- 7.895987 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 404.882667 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               445.736500 +/- 1.763250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               31.711667 +/- 3.887833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             414.024833
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 114.024833 +/- 6.574519 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 415.024833 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               451.326000 +/- 1.375000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               32.232250 +/- 4.947803 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             419.093750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 119.093750 +/- 7.167383 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 420.093750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               450.121750 +/- 1.532250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               31.106000 +/- 3.778955 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             419.015750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 119.015750 +/- 6.451999 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 420.015750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 997.132000, chip thickness 300.000000 and glue 135.133000, giving hybrid 561.999000 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 993.158126, chip thickness 300.000000 and glue 114.564389, giving hybrid 578.593737 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 992.120350, chip thickness 300.000000 and glue 109.046722, giving hybrid 583.073628 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 987.753840, chip thickness 300.000000 and glue 105.597389, giving hybrid 582.156451 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 988.160701, chip thickness 300.000000 and glue 111.441722, giving hybrid 576.718979 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 986.855352, chip thickness 300.000000 and glue 113.129472, giving hybrid 573.725880 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 987.281389, chip thickness 300.000000 and glue 107.184222, giving hybrid 580.097166 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 985.938381, chip thickness 300.000000 and glue 103.882667, giving hybrid 582.055715 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 986.316761, chip thickness 300.000000 and glue 114.024833, giving hybrid 572.291928 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 990.404489, chip thickness 300.000000 and glue 119.093750, giving hybrid 571.310739 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 984.697750, chip thickness 300.000000 and glue 119.015750, giving hybrid 565.682000 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H0/2//Data__GPC2233_X_021_C_H0.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H0/2//Results__GPC2233_X_021_C_H0.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H0/2//Data__GPC2233_X_021_C_H0.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H0/2//Results__GPC2233_X_021_C_H0.txt
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H0/MetrologyHybrid_PROD_X_v2_thick_interposer-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC2233_X_021_C_H0.txt...
IService::install                          INFO                Installed Results__GPC2233_X_021_C_H0.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H2-2.config
IService::next                             INFO                Scheduling GPC2233-X-021-C0-C2-C4.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H2/2/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0002504
MetadataValue
Component type X
Operator Len Morelos-Zaragoza
Date 2025-04-11T18:29:35.177+00:00
Program version MetrologyHybrid_PROD_X_v2_thick_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thick_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for GPC2233_X_021_C_H0


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H0/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//GPC2233_X_021_C_H2-1.config
IService::next                             INFO                Scheduling HybridBonding_GPC2233_X_021_C_H2-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//GPC2233_X_021_C_H2/1/
MetadataValue
Date 2025-04-11T22:03:54.207+00:00
Operator LM
Bonder hk2
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files GPC2233_X_021_C_H0/20USBHX2002468
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files GPC2233_X_021_C_H0/20USBHX2002468
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002468_20250414_34_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002468_20250414_34_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002468_20250414_34_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002468_20250414_34_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002468_20250414_34_STROBE_DELAY_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_021_C_H0_GAIN_TEST.json
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H0
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H0/BurnInHybrids_PROD_v2-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2002468_20250414_34_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2002468_20250414_34_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002468_20250414_34_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002468_20250414_34_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2002468_20250414_34_NO_BURNIN.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H0.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_021_C_H2-2.config
IService::next                             INFO                Scheduling BurnIn_Panel_53_Apr_14_2025_merged file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_021_C_H2/2/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for GPC2233_X_021_C_H0
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0002504

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.