Results for GPC2233_X_021_C_H2


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Basic Information for GPC2233_X_021_C_H2


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0390
Serial Number 20USBHX2002470
Batch PRESERIES_UCSC
Assembled True
Completed True
Current Location Brookhaven National Laboratory
Manufacture ID GPC2233_X_021_C_H2
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2025-04-11T03:00:20.416Z
HCC Chip HCCSTARV1 2025-04-14T21:26:09.127Z
ABC Chip ABCSTARV1 2025-04-14T21:26:09.631Z
ABC Chip ABCSTARV1 2025-04-14T21:26:10.155Z
ABC Chip ABCSTARV1 2025-04-14T21:26:10.642Z
ABC Chip ABCSTARV1 2025-04-14T21:26:11.127Z
ABC Chip ABCSTARV1 2025-04-14T21:26:11.616Z
ABC Chip ABCSTARV1 2025-04-14T21:26:12.128Z
ABC Chip ABCSTARV1 2025-04-14T21:26:12.645Z
ABC Chip ABCSTARV1 2025-04-14T21:26:13.141Z
ABC Chip ABCSTARV1 2025-04-14T21:26:13.634Z
ABC Chip ABCSTARV1 2025-04-14T21:26:14.137Z
Hybrid Interposer 2025-04-11T03:00:12.056Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2025-04-28T18:22:00.569Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2025-04-11T03:16:29.631Z
Visual Inspection 2025-04-11T22:03:54.214Z
ASIC Metrology 2025-04-11T18:29:35.181Z
Wire bonding 2025-04-11T22:03:54.214Z
Pedestal Trim Burn In 2025-04-15T00:02:24.000Z
Strobe Delay Burn In 2025-04-15T00:02:38.000Z
Response Curve Burn In 2025-04-15T00:11:37.000Z
Noise Occupancy Burn In 2025-04-15T00:11:54.000Z
Pedestal Trim TC 2025-04-30T14:04:50.000Z
Strobe Delay TC 2025-04-30T14:05:05.000Z
Response Curve TC 2025-04-30T14:07:06.000Z
Noise Occupancy TC 2025-04-30T14:17:33.000Z
Open Channel Search TC 2025-04-30T16:20:32.000Z
Pedestal Trim PPA 2025-06-11T16:27:39.000Z
Strobe Delay PPA 2025-06-11T16:28:13.000Z
Response Curve PPA 2025-06-11T16:39:21.000Z
Noise Occupancy PPA 2025-06-11T16:42:16.000Z

Glue weight for GPC2233_X_021_C_H2


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H2/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2002470_IMG_5983.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H2.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator FMM, QFP
Date 2025-04-11T03:16:29.631+00:00
Program ASIC_X_PPB.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 38.911
Volume per glue dot [nL] 748.292
Weight of glue under ASICs [mg] 41.900
Weights of bare hybrid [g] 2.702
Weights of stuffed hybrid [g] 2.744

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               450.578500 +/- 3.067750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               25.657250 +/- 6.858936 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             424.921250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 124.921250 +/- 9.025303 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 425.921250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               445.014500 +/- 0.837000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               34.987222 +/- 8.280833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             410.027278
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 110.027278 +/- 9.709417 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 411.027278 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               443.057750 +/- 0.852250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               36.167000 +/- 10.274000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             406.890750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 106.890750 +/- 11.457810 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 407.890750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               439.697500 +/- 1.189250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               30.018000 +/- 6.550333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             409.679500
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 109.679500 +/- 8.325934 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 410.679500 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               439.953750 +/- 0.521000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               33.590333 +/- 5.521333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             406.363417
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 106.363417 +/- 7.467032 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 407.363417 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               438.658000 +/- 0.892750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               32.566222 +/- 7.271167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             406.091778
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 106.091778 +/- 8.869434 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 407.091778 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               439.282000 +/- 0.477250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               28.744556 +/- 7.415667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             410.537444
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 110.537444 +/- 8.956555 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 411.537444 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               440.357000 +/- 1.327750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               30.223556 +/- 6.756833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             410.133444
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 110.133444 +/- 8.509860 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 411.133444 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               443.419000 +/- 1.597000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               30.701222 +/- 6.490833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             412.717778
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 112.717778 +/- 8.347534 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 413.717778 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               449.605500 +/- 2.297500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               30.427875 +/- 3.519094 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             419.177625
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 119.177625 +/- 6.531656 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 420.177625 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               448.515000 +/- 1.802500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               34.840500 +/- 2.447297 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             413.674500
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 113.674500 +/- 5.851347 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 414.674500 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 995.983250, chip thickness 300.000000 and glue 124.921250, giving hybrid 571.062000 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 992.105907, chip thickness 300.000000 and glue 110.027278, giving hybrid 582.078629 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 990.321015, chip thickness 300.000000 and glue 106.890750, giving hybrid 583.430265 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 986.811739, chip thickness 300.000000 and glue 109.679500, giving hybrid 577.132239 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 987.519679, chip thickness 300.000000 and glue 106.363417, giving hybrid 581.156262 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 986.322317, chip thickness 300.000000 and glue 106.091778, giving hybrid 580.230539 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 985.545746, chip thickness 300.000000 and glue 110.537444, giving hybrid 575.008302 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 983.625013, chip thickness 300.000000 and glue 110.133444, giving hybrid 573.491569 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 983.484945, chip thickness 300.000000 and glue 112.717778, giving hybrid 570.767167 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 987.719578, chip thickness 300.000000 and glue 119.177625, giving hybrid 568.541953 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 983.930000, chip thickness 300.000000 and glue 113.674500, giving hybrid 570.255500 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H2/2//Data__GPC2233_X_021_C_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H2/2//Results__GPC2233_X_021_C_H2.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H2/2//Data__GPC2233_X_021_C_H2.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H2/2//Results__GPC2233_X_021_C_H2.txt
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H2/MetrologyHybrid_PROD_X_v2_thick_interposer-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC2233_X_021_C_H2.txt...
IService::install                          INFO                Installed Results__GPC2233_X_021_C_H2.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H4-2.config
IService::next                             INFO                Scheduling GPC2233-X-021-C0-C2-C4.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_021_C_H4/2/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0002506
Measurement::addPoint                      ERROR               Unknown type ?! Ignoring!
MetadataValue
Component type X
Operator Len Morelos-Zaragoza
Date 2025-04-11T18:29:35.181+00:00
Program version MetrologyHybrid_PROD_X_v2_thick_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thick_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for GPC2233_X_021_C_H2


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H2/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//GPC2233_X_021_C_H4-1.config
IService::next                             INFO                Scheduling HybridBonding_GPC2233_X_021_C_H4-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//GPC2233_X_021_C_H4/1/
MetadataValue
Date 2025-04-11T22:03:54.214+00:00
Operator LM
Bonder hk2
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files GPC2233_X_021_C_H2/20USBHX2002470
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files GPC2233_X_021_C_H2/20USBHX2002470
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002470_20250414_34_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002470_20250414_34_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002470_20250414_34_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002470_20250414_34_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002470_20250414_34_STROBE_DELAY_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_021_C_H2_GAIN_TEST.json
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component GPC2233_X_021_C_H2
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2233_X_021_C_H2/BurnInHybrids_PROD_v2-2/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2002470_20250414_34_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2002470_20250414_34_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002470_20250414_34_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002470_20250414_34_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2002470_20250414_34_NO_BURNIN.json...
IService::install                          INFO                Installed GPC2233_X_021_C_H2.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_021_C_H4-2.config
IService::next                             INFO                Scheduling BurnIn_Panel_53_Apr_14_2025_merged file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_021_C_H4/2/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for GPC2233_X_021_C_H2
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0002506

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.