Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 1000.720000, chip thickness 300.000000 and glue 105.853250, giving hybrid 594.866750 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1005.665714, chip thickness 300.000000 and glue 120.292417, giving hybrid 585.373298 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1001.846047, chip thickness 300.000000 and glue 114.828278, giving hybrid 587.017769 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1007.289285, chip thickness 300.000000 and glue 122.722417, giving hybrid 584.566868 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1010.832863, chip thickness 300.000000 and glue 125.300917, giving hybrid 585.531946 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1014.594807, chip thickness 300.000000 and glue 127.133389, giving hybrid 587.461418 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1011.306326, chip thickness 300.000000 and glue 123.214694, giving hybrid 588.091632 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1006.124301, chip thickness 300.000000 and glue 115.707944, giving hybrid 590.416356 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 1005.628729, chip thickness 300.000000 and glue 119.912222, giving hybrid 585.716506 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 999.143487, chip thickness 300.000000 and glue 118.364500, giving hybrid 580.778987 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 997.152250, chip thickness 300.000000 and glue 109.676000, giving hybrid 587.476250 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H5/1//Data__GPC2233_X_023_B_H5.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H5/1//Results__GPC2233_X_023_B_H5.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H5/1//Data__GPC2233_X_023_B_H5.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H5/1//Results__GPC2233_X_023_B_H5.txt
IService::log INFO Logging status 0111 for component GPC2233_X_023_B_H5
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_023_B_H5/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2233_X_023_B_H5.txt...
IService::install INFO Installed Results__GPC2233_X_023_B_H5.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2233_X_023_B_H5.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H6-1.config
IService::next INFO Scheduling GPC2233-X-023-B2-3-4-5-6_GPC2230-X-016-B6_interposed_v2.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2233_X_023_B_H6/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002544
Measurement::addPoint ERROR Unknown type ?! Ignoring!
✔ Component is at UCSC. OK to upload
✔ Service has no required stages or transformations. Allowing for upload, but careful! OK to upload
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2233_X_023_B_H5/20USBHX2001573
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2233_X_023_B_H5/20USBHX2001573
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_023_B_H5_NO.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_023_B_H5_RESPONSE_CURVE.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_023_B_H5_STROBE_DELAY.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_023_B_H5_PEDESTAL_TRIM.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2233_X_023_B_H5_3PG.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_023_B_H5_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 0111 for component GPC2233_X_023_B_H5
IService::install INFO Installing output directory to /home/data/modules/GPC2233_X_023_B_H5/BurnInHybrids_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_PEDESTAL_TRIM_BURNIN_GPC2233_X_023_B_H5_PEDESTAL_TRIM.json...
IService::install INFO Installed DB_READY_STROBE_DELAY_BURNIN_GPC2233_X_023_B_H5_STROBE_DELAY.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_GPC2233_X_023_B_H5_RESPONSE_CURVE.json...
IService::install INFO Installed DB_READY_RESPONSE_CURVE_BURNIN_GPC2233_X_023_B_H5_3PG.json...
IService::install INFO Installed DB_READY_NO_BURNIN_GPC2233_X_023_B_H5_NO.json...
IService::install INFO Installed GPC2233_X_023_B_H5.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2233_X_023_B_H4-1.config
IService::next INFO Scheduling Test_BurnIn_LBNL_009_010_merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2233_X_023_B_H4/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2233_X_023_B_H5
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0002544
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.