Results for GPC2238_X_009_B_H3


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Basic Information for GPC2238_X_009_B_H3


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0487
Serial Number 20USBHX2002790
Batch PRESERIES_UCSC
Assembled True
Completed True
Current Location Brookhaven National Laboratory
Manufacture ID GPC2238_X_009_B_H3
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2025-06-10T19:12:15.035Z
HCC Chip HCCSTARV1 2025-06-30T23:46:57.024Z
ABC Chip ABCSTARV1 2025-06-30T23:46:58.827Z
ABC Chip ABCSTARV1 2025-06-30T23:47:00.648Z
ABC Chip ABCSTARV1 2025-06-30T23:47:02.428Z
ABC Chip ABCSTARV1 2025-06-30T23:47:04.253Z
ABC Chip ABCSTARV1 2025-06-30T23:47:06.021Z
ABC Chip ABCSTARV1 2025-06-30T23:47:07.794Z
ABC Chip ABCSTARV1 2025-06-30T23:47:09.532Z
ABC Chip ABCSTARV1 2025-06-30T23:47:11.276Z
ABC Chip ABCSTARV1 2025-06-30T23:47:13.317Z
ABC Chip ABCSTARV1 2025-06-30T23:47:15.009Z
Hybrid Interposer 2025-06-10T19:12:11.848Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2025-07-16T17:12:44.550Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2025-06-27T19:03:35.539Z
Visual Inspection 2025-06-28T00:07:03.380Z
ASIC Metrology 2025-06-27T20:56:58.767Z
Wire bonding 2025-06-28T00:07:03.380Z
Pedestal Trim Burn In 2025-07-01T19:11:45.000Z
Strobe Delay Burn In 2025-07-01T19:11:53.000Z
Response Curve Burn In 2025-07-01T19:19:10.000Z
Noise Occupancy Burn In 2025-07-01T19:19:23.000Z
Pedestal Trim TC 2025-07-22T11:06:43.000Z
Strobe Delay TC 2025-07-22T11:06:59.000Z
Response Curve TC 2025-07-22T11:16:02.000Z
Noise Occupancy TC 2025-07-22T11:19:20.000Z
Open Channel Search TC 2025-07-22T13:22:39.000Z
Response Curve PPA 2025-07-31T15:47:49.000Z
Pedestal Trim PPA 2025-07-31T15:32:16.000Z
Strobe Delay PPA 2025-07-31T15:32:29.000Z
Noise Occupancy PPA 2025-07-31T15:54:47.000Z

Glue weight for GPC2238_X_009_B_H3


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2238_X_009_B_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_009_B_H3/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2238_X_009_B_H3.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator KA
Date 2025-06-27T19:03:35.539+00:00
Program ASIC-X.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 41.790
Volume per glue dot [nL] 803.655
Weight of glue under ASICs [mg] 45.000
Weights of bare hybrid [g] 2.821
Weights of stuffed hybrid [g] 2.866

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               457.161000 +/- 4.423500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               34.527125 +/- 14.773759 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             422.633875
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 122.633875 +/- 16.212073 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 423.633875 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               445.951500 +/- 2.740250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               35.471000 +/- 8.981000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             410.480500
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 110.480500 +/- 10.638013 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 411.480500 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               441.017000 +/- 3.866750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               36.547778 +/- 8.130833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             404.469222
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 104.469222 +/- 10.298651 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 405.469222 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               433.726250 +/- 4.039250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               31.189222 +/- 10.833833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             402.537028
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 102.537028 +/- 12.597122 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 403.537028 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               430.585250 +/- 3.637750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               29.767778 +/- 6.718333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             400.817472
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 100.817472 +/- 9.130675 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 401.817472 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               425.758250 +/- 2.770750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               31.479000 +/- 6.467833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             394.279250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 94.279250 +/- 8.631913 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 395.279250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               423.015750 +/- 2.908000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               26.242667 +/- 12.477833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             396.773083
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 96.773083 +/- 13.753283 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 397.773083 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               420.984250 +/- 3.011750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               19.756667 +/- 7.663000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             401.227583
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 101.227583 +/- 9.632871 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 402.227583 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               421.154250 +/- 3.208250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               21.839222 +/- 7.833000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             399.315028
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 99.315028 +/- 9.831010 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 400.315028 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               423.187500 +/- 3.133000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               20.705750 +/- 7.670871 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             402.481750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 102.481750 +/- 9.677704 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 403.481750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               437.611500 +/- 0.849000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               31.317875 +/- 2.392142 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             406.293625
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 106.293625 +/- 5.607419 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 407.293625 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 1011.759750, chip thickness 300.000000 and glue 122.633875, giving hybrid 589.125875 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 1003.305210, chip thickness 300.000000 and glue 110.480500, giving hybrid 592.824710 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 1000.501686, chip thickness 300.000000 and glue 104.469222, giving hybrid 596.032463 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 995.021068, chip thickness 300.000000 and glue 102.537028, giving hybrid 592.484040 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 994.296777, chip thickness 300.000000 and glue 100.817472, giving hybrid 593.479305 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 991.538386, chip thickness 300.000000 and glue 94.279250, giving hybrid 597.259136 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 989.344081, chip thickness 300.000000 and glue 96.773083, giving hybrid 592.570998 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 986.273356, chip thickness 300.000000 and glue 101.227583, giving hybrid 585.045773 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 985.194857, chip thickness 300.000000 and glue 99.315028, giving hybrid 585.879829 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 987.231238, chip thickness 300.000000 and glue 102.481750, giving hybrid 584.749488 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 993.429500, chip thickness 300.000000 and glue 106.293625, giving hybrid 587.135875 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_009_B_H3/1//Data__GPC2238_X_009_B_H3.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_009_B_H3/1//Results__GPC2238_X_009_B_H3.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_009_B_H3/1//Data__GPC2238_X_009_B_H3.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_009_B_H3/1//Results__GPC2238_X_009_B_H3.txt
IService::log                              INFO                Logging status 0111 for component GPC2238_X_009_B_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_009_B_H3/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC2238_X_009_B_H3.txt...
IService::install                          INFO                Installed Results__GPC2238_X_009_B_H3.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC2238_X_009_B_H3.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_009_B_H4-1.config
IService::next                             INFO                Scheduling GPC2238-X-009-B3-4-5-6_2225-X-009-B0-1.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_009_B_H4/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0002773
MetadataValue
Component type X
Operator LM
Date 2025-06-27T20:56:58.767+00:00
Program version MetrologyHybrid_PROD_X_v2_thick_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thick_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for GPC2238_X_009_B_H3


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2238_X_009_B_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_009_B_H3/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2238_X_009_B_H3.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//GPC2238_X_009_B_H4-1.config
IService::next                             INFO                Scheduling HybridBonding_GPC2238_X_009_B_H4-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//GPC2238_X_009_B_H4/1/
MetadataValue
Date 2025-06-28T00:07:03.380+00:00
Operator QFP, LM
Bonder hk2
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files GPC2238_X_009_B_H3/20USBHX2002790
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files GPC2238_X_009_B_H3/20USBHX2002790
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002790_20250630_40_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002790_20250630_40_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002790_20250630_40_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002790_20250630_40_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002790_20250630_40_NO_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2238_X_009_B_H3_GAIN_TEST.json
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component GPC2238_X_009_B_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_009_B_H3/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2002790_20250630_40_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2002790_20250630_40_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002790_20250630_40_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002790_20250630_40_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2002790_20250630_40_NO_BURNIN.json...
IService::install                          INFO                Installed GPC2238_X_009_B_H3.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2238_X_009_B_H4-1.config
IService::next                             INFO                Scheduling Burnin_Panel_23 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2238_X_009_B_H4/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for GPC2238_X_009_B_H3
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0002773

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.