Results for GPC2238_X_024_A_H4


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Basic Information for GPC2238_X_024_A_H4


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0431
Serial Number 20USBHX2002612
Batch PRESERIES_UCSC
Assembled True
Completed True
Current Location STFC Rutherford Appleton Laboratory
Manufacture ID GPC2238_X_024_A_H4
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2025-05-12T18:19:50.380Z
HCC Chip HCCSTARV1 2025-05-15T21:43:40.120Z
ABC Chip ABCSTARV1 2025-05-15T21:43:40.639Z
ABC Chip ABCSTARV1 2025-05-15T21:43:41.124Z
ABC Chip ABCSTARV1 2025-05-15T21:43:41.627Z
ABC Chip ABCSTARV1 2025-05-15T21:43:42.152Z
ABC Chip ABCSTARV1 2025-05-15T21:43:42.638Z
ABC Chip ABCSTARV1 2025-05-15T21:43:43.131Z
ABC Chip ABCSTARV1 2025-05-15T21:43:43.642Z
ABC Chip ABCSTARV1 2025-05-15T21:43:44.150Z
ABC Chip ABCSTARV1 2025-05-15T21:43:44.649Z
ABC Chip ABCSTARV1 2025-05-15T21:43:45.162Z
Hybrid Interposer 2025-05-12T18:19:48.550Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2025-06-04T23:56:25.368Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2025-05-12T19:38:56.327Z
Visual Inspection 2025-05-16T23:15:15.761Z
ASIC Metrology 2025-05-12T22:38:51.812Z
Wire bonding 2025-05-16T23:15:15.761Z
Pedestal Trim Burn In 2025-05-16T17:38:57.000Z
Strobe Delay Burn In 2025-05-16T17:39:36.000Z
Response Curve Burn In 2025-05-16T17:55:19.000Z
Noise Occupancy Burn In 2025-05-16T17:59:56.000Z
Pedestal Trim TC 2025-06-06T15:59:48.000Z
Strobe Delay TC 2025-06-06T16:00:07.000Z
Response Curve TC 2025-06-06T16:02:24.000Z
Noise Occupancy TC 2025-06-06T16:13:55.000Z
Open Channel Search TC 2025-06-06T18:17:09.000Z
Response Curve PPA 2025-07-18T14:10:04.000Z
Noise Occupancy PPA 2025-07-18T14:29:15.000Z
Strobe Delay PPA 2025-07-18T14:06:05.000Z
Pedestal Trim PPA 2025-07-18T14:05:36.000Z

Glue weight for GPC2238_X_024_A_H4


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2238_X_024_A_H4
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_024_A_H4/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2002612_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2238_X_024_A_H4.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator QFP, LM
Date 2025-05-12T19:38:56.327+00:00
Program ASIC_X_PPB.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 40.211
Volume per glue dot [nL] 773.295
Weight of glue under ASICs [mg] 43.300
Weights of bare hybrid [g] 2.715
Weights of stuffed hybrid [g] 2.759

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               458.438750 +/- 3.226000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               14.316000 +/- 10.079277 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             444.122750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 144.122750 +/- 11.704653 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 445.122750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               451.162000 +/- 1.447750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               20.457778 +/- 3.491167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             430.704222
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 130.704222 +/- 6.267713 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 431.704222 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               448.651000 +/- 2.064000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               24.102444 +/- 3.917000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             424.548556
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 124.548556 +/- 6.678547 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 425.548556 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               444.775500 +/- 0.962000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               25.966667 +/- 5.287500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             418.808833
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 118.808833 +/- 7.340511 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 419.808833 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               444.397750 +/- 1.461000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               30.363222 +/- 6.429167 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             414.034528
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 114.034528 +/- 8.274582 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 415.034528 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               443.733250 +/- 1.359250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               29.625000 +/- 13.531333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             414.108250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 114.108250 +/- 14.489463 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 415.108250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               444.343750 +/- 1.744750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               22.434000 +/- 11.885500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             421.909750
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 121.909750 +/- 13.011889 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 422.909750 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               445.541500 +/- 2.273250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               32.197556 +/- 6.814333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             413.343944
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 113.343944 +/- 8.752303 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 414.343944 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               449.703250 +/- 2.878250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               44.469000 +/- 4.678333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             405.234250
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 105.234250 +/- 7.427727 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 406.234250 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               451.857750 +/- 4.096000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               45.325375 +/- 8.382574 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             406.532375
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 106.532375 +/- 10.585120 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 407.532375 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               461.046000 +/- 1.135000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               50.743125 +/- 6.468790 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             410.302875
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 110.302875 +/- 8.254300 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 411.302875 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 1011.123500, chip thickness 300.000000 and glue 144.122750, giving hybrid 567.000750 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 1004.404147, chip thickness 300.000000 and glue 130.704222, giving hybrid 573.699925 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 1001.158838, chip thickness 300.000000 and glue 124.548556, giving hybrid 576.610282 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 996.210407, chip thickness 300.000000 and glue 118.808833, giving hybrid 577.401574 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 995.356988, chip thickness 300.000000 and glue 114.034528, giving hybrid 581.322460 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 993.852704, chip thickness 300.000000 and glue 114.108250, giving hybrid 579.744454 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 992.132880, chip thickness 300.000000 and glue 121.909750, giving hybrid 570.223130 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 989.422437, chip thickness 300.000000 and glue 113.343944, giving hybrid 576.078493 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 989.462670, chip thickness 300.000000 and glue 105.234250, giving hybrid 584.228420 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 988.742422, chip thickness 300.000000 and glue 106.532375, giving hybrid 582.210047 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 993.856750, chip thickness 300.000000 and glue 110.302875, giving hybrid 583.553875 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_024_A_H4/1//Data__GPC2238_X_024_A_H4.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_024_A_H4/1//Results__GPC2238_X_024_A_H4.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_024_A_H4/1//Data__GPC2238_X_024_A_H4.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_024_A_H4/1//Results__GPC2238_X_024_A_H4.txt
IService::log                              INFO                Logging status 0111 for component GPC2238_X_024_A_H4
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_024_A_H4/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC2238_X_024_A_H4.txt...
IService::install                          INFO                Installed Results__GPC2238_X_024_A_H4.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC2238_X_024_A_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_024_A_H6-1.config
IService::next                             INFO                Scheduling GPC2238-X-024-A2-3-4-6_2324-X-011-A0-1.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2238_X_024_A_H6/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0003082
MetadataValue
Component type X
Operator Len Morelos-Zaragoza
Date 2025-05-12T22:38:51.812+00:00
Program version MetrologyHybrid_PROD_X_v2_thick_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thick_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for GPC2238_X_024_A_H4


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2238_X_024_A_H4
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_024_A_H4/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2238_X_024_A_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//GPC2238_X_024_A_H6-1.config
IService::next                             INFO                Scheduling HybridBonding_GPC2238_X_024_A_H6-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//GPC2238_X_024_A_H6/1/
MetadataValue
Date 2025-05-16T23:15:15.761+00:00
Operator LMM
Bonder hk2
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files GPC2238_X_024_A_H4/20USBHX2002612
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files GPC2238_X_024_A_H4/20USBHX2002612
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002612_20250515_6_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002612_20250515_6_STROBE_DELAY_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002612_20250515_6_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002612_20250515_6_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2002612_20250515_6_NO_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2238_X_024_A_H4_GAIN_TEST.json
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component GPC2238_X_024_A_H4
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2238_X_024_A_H4/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2002612_20250515_6_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2002612_20250515_6_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002612_20250515_6_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2002612_20250515_6_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2002612_20250515_6_NO_BURNIN.json...
IService::install                          INFO                Installed GPC2238_X_024_A_H4.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2238_X_024_A_H6-1.config
IService::next                             INFO                Scheduling Burnin_Panel_25_27 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2238_X_024_A_H6/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for GPC2238_X_024_A_H4
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0003082

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.