Results for GPC2328_X_007_C_H3


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Basic Information for GPC2328_X_007_C_H3


Brief description of DB components associated to this Hybrid Assembly and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier UCSC-X-0516
Serial Number 20USBHX2003082
Batch PRESERIES_UCSC
Assembled True
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID GPC2328_X_007_C_H3
User SCIPP Module Institute Account

Children

ComponentTypeTimestamp
STAR Hybrid Flex X 2025-07-16T17:29:49.920Z
HCC Chip HCCSTARV1 2025-07-16T22:48:35.916Z
ABC Chip ABCSTARV1 2025-07-16T22:48:37.754Z
ABC Chip ABCSTARV1 2025-07-16T22:48:39.526Z
ABC Chip ABCSTARV1 2025-07-16T22:48:41.293Z
ABC Chip ABCSTARV1 2025-07-16T22:48:42.992Z
ABC Chip ABCSTARV1 2025-07-16T22:48:44.833Z
ABC Chip ABCSTARV1 2025-07-16T22:48:46.584Z
ABC Chip ABCSTARV1 2025-07-16T22:48:48.326Z
ABC Chip ABCSTARV1 2025-07-16T22:48:50.148Z
ABC Chip ABCSTARV1 2025-07-16T22:48:51.901Z
ABC Chip ABCSTARV1 2025-07-16T22:48:53.615Z
Hybrid Interposer 2025-07-16T17:29:45.586Z

Parents

ComponentTypeTimestamp
STAR Hybrid Test Panel
Module 2025-07-21T20:59:40.003Z

NameCurrent StageTimestamp

Test NamePassed?Date
Glue weight (ASICs on hybrid) 2025-07-16T17:46:42.165Z
Visual Inspection 2025-07-16T21:56:59.287Z
ASIC Metrology 2025-07-16T19:55:10.740Z
Wire bonding 2025-07-16T21:56:59.287Z
Pedestal Trim Burn In 2025-07-17T18:21:21.000Z
Strobe Delay Burn In 2025-07-17T18:21:32.000Z
Response Curve Burn In 2025-07-17T18:29:17.000Z
Noise Occupancy Burn In 2025-07-17T18:29:36.000Z
Pedestal Trim TC 2025-07-25T11:54:04.000Z
Strobe Delay TC 2025-07-25T11:54:15.000Z
Response Curve TC 2025-07-25T12:02:41.000Z
Noise Occupancy TC 2025-07-25T12:04:12.000Z
Open Channel Search TC 2025-07-25T14:07:05.000Z
Pedestal Trim PPA 2025-07-16T22:55:29.000Z
Strobe Delay PPA 2025-07-16T22:55:40.000Z
Response Curve PPA 2025-07-16T23:03:12.000Z
Noise Occupancy PPA 2025-07-16T23:03:30.000Z

Glue weight for GPC2328_X_007_C_H3


Shown below are results for the glue weight measurements

IService::UPLOADDB                         INFO                Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB                    INFO                Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2328_X_007_C_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2328_X_007_C_H3/GlueWeightHybridASIC_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed 20USBHX2003082_image.jpg...
IService::install                          INFO                Installed DB_COMMENTS.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2328_X_007_C_H3.root...
IService::install                          INFO                Installed status.json...
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_Y_v0_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyHybrid_PROD_X_v2_thick_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_LS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name MetrologyModules_PROD_SS_v1_thin_interposer ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
TopControl::monitor                        INFO                Service with algoirthm name TCModules_PROD_v0 ignored through users request!

MetadataValue
Component type
Operator KA
Date 2025-07-16T17:46:42.165+00:00
Program ASIC-X.SRC
FieldWeight/Volume
Assummed density of glue 1.077
Total volume of ASIC glue [uL] 39.004
Volume per glue dot [nL] 750.078
Weight of glue under ASICs [mg] 42.000
Weights of bare hybrid [g] 2.846
Weights of stuffed hybrid [g] 2.889

Metrology results


Shown below are the results of the module metrology scans

MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               446.523750 +/- 3.369750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_0] Height in z :                               24.697125 +/- 17.472962 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             421.826625
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 121.826625 +/- 18.484037 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 422.826625 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               441.233750 +/- 2.322750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_1] Height in z :                               42.591778 +/- 8.463833 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             398.641972
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 98.641972 +/- 10.101071 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 399.641972 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               435.754250 +/- 3.078500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_2] Height in z :                               27.453222 +/- 9.297667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             408.301028
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 108.301028 +/- 10.996534 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 409.301028 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               429.643250 +/- 3.671750 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_3] Height in z :                               19.662333 +/- 5.842333 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             409.980917
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 109.980917 +/- 8.521420 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 410.980917 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               427.041500 +/- 2.731250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_4] Height in z :                               30.854444 +/- 3.110500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             396.187056
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 96.187056 +/- 6.491143 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 397.187056 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               423.642250 +/- 2.578250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_5] Height in z :                               25.741222 +/- 3.128000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             397.901028
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 97.901028 +/- 6.436751 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 398.901028 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               422.095750 +/- 2.203000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_6] Height in z :                               26.593889 +/- 6.098000 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             395.501861
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 95.501861 +/- 8.187723 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 396.501861 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               421.301750 +/- 2.558250 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_7] Height in z :                               26.821222 +/- 8.280500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             394.480528
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 94.480528 +/- 10.005565 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 395.480528 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               422.800000 +/- 3.230500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_8] Height in z :                               27.511222 +/- 5.740667 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             395.288778
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 95.288778 +/- 8.269908 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 396.288778 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               425.232000 +/- 2.838500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [ABC_X_9] Height in z :                               33.036625 +/- 7.302469 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             392.195375
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 92.195375 +/- 9.294252 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 393.195375 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeGlueHeights           INFO                Printing associated surfaces...
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               437.392750 +/- 0.535500 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> [HCC_X_0] Height in z :                               42.103375 +/- 4.297618 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Difference in heights :                             395.289375
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue assuming 300.000000 +/- 5.000000 extra material : 95.289375 +/- 6.614853 um 
MetrologySvc::analyzeGlueHeights           INFO                 ----> Thickeness of glue using derived value -1.000000 from hybrid measurements : 396.289375 um 
MetrologySvc::analyzeGlueHeights           INFO                --------------------------------------------------------------------------------- 
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 999.731750, chip thickness 300.000000 and glue 121.826625, giving hybrid 577.905125 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 994.378318, chip thickness 300.000000 and glue 98.641972, giving hybrid 595.736346 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 989.422004, chip thickness 300.000000 and glue 108.301028, giving hybrid 581.120976 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 983.557916, chip thickness 300.000000 and glue 109.980917, giving hybrid 573.576999 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 981.783801, chip thickness 300.000000 and glue 96.187056, giving hybrid 585.596746 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 978.894652, chip thickness 300.000000 and glue 97.901028, giving hybrid 580.993624 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 976.320133, chip thickness 300.000000 and glue 95.501861, giving hybrid 580.818272 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 972.892915, chip thickness 300.000000 and glue 94.480528, giving hybrid 578.412387 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 971.556003, chip thickness 300.000000 and glue 95.288778, giving hybrid 576.267225 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 972.398086, chip thickness 300.000000 and glue 92.195375, giving hybrid 580.202711 thickness
MetrologySvc::analyzeHybridThickness       INFO                Total stack up 967.309750, chip thickness 300.000000 and glue 95.289375, giving hybrid 572.020375 thickness
IService::UPLOADDB                         INFO                Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2328_X_007_C_H3/1//Data__GPC2328_X_007_C_H3.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2328_X_007_C_H3/1//Results__GPC2328_X_007_C_H3.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2328_X_007_C_H3/1//Data__GPC2328_X_007_C_H3.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2328_X_007_C_H3/1//Results__GPC2328_X_007_C_H3.txt
IService::log                              INFO                Logging status 0111 for component GPC2328_X_007_C_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2328_X_007_C_H3/MetrologyHybrid_PROD_X_v2_thick_interposer-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed TotalStackUp.pdf...
IService::install                          INFO                Installed HybridThickness.pdf...
IService::install                          INFO                Installed Positions.pdf...
IService::install                          INFO                Installed Tilt.pdf...
IService::install                          INFO                Installed Data__GPC2328_X_007_C_H3.txt...
IService::install                          INFO                Installed Results__GPC2328_X_007_C_H3.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install                          INFO                Installed GPC2328_X_007_C_H3.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2328_X_007_C_H4-1.config
IService::next                             INFO                Scheduling GPC2328-X-007-C1-2-3-4-5_GPC2328-X-002-A0.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_thick_interposer//GPC2328_X_007_C_H4/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0004292
MetadataValue
Component type X
Operator LM
Date 2025-07-16T19:55:10.740+00:00
Program version MetrologyHybrid_PROD_X_v2_thick_interposer/PROD_clonable_v2_new-jig_DB102_6hybrids_thick_interposer
Instrument SmartScope Flash 250

The thickness of the glue \(t_{glue}\) is calculated as: $$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$ where \(t_{chip}\) is the thickness of the chip \(z_{i}\) is the z-height measurement, \(N_{i}\) is the number of measurements on a given surface, and \(c\) and \(b\) run over measurements taken on the chip and base, respectively. The assumed thickness of the chip is \(t_{chip} = 300\mu m\).

Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface. On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as: $$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$ where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively. In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed. The total uncertainty is calculated as: $$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$ The glue thickness measurements for each ASIC are shown in the figure and table below.


The thickness total stack up is measured from the top of the each chip to the jig, and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.


The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds. These measured positions are compared against the technical drawns to calculated the relative ASIC position. In some cases, the SmartScope incorrectly measures a different object than these square pads, and using properties (such as the perimeter), the position is corrected. The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.

The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.

The tilt of a chip can be calculated in either the direction along the surface of a chip. We define the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be: $$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$

Wirebonding for GPC2328_X_007_C_H3


Wirebonding summaries will be given below

WireBondSvc::run                           INFO                Loading group FAILED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run                           INFO                Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run                           INFO                Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB                         INFO                Working on test code WIRE_BONDING
IService::UPLOADDB                         INFO                Working on test code VISUAL_INSPECTION
IService::log                              INFO                Logging status 0111 for component GPC2328_X_007_C_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2328_X_007_C_H3/HybridBonding_v1-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install                          INFO                Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install                          INFO                Installed GPC2328_X_007_C_H3.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//HybridBonding_v1//GPC2328_X_007_C_H4-1.config
IService::next                             INFO                Scheduling HybridBonding_GPC2328_X_007_C_H4-1.json file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridBonding_v1//GPC2328_X_007_C_H4/1/
MetadataValue
Date 2025-07-16T21:56:59.287+00:00
Operator LM
Bonder hk1
Version v1
Bond numberTypeComment

Electrical results


Electrical summaries will be given below

ElectricalSvc::getListOfFilesFromDir       INFO                Scanning for test files GPC2328_X_007_C_H3/20USBHX2003082
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Scanning for test files GPC2328_X_007_C_H3/20USBHX2003082
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2003082_20250716_6_3PG_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2003082_20250716_6_NO_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2003082_20250716_6_PEDESTAL_TRIM_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2003082_20250716_6_RESPONSE_CURVE_BURNIN.json
ElectricalSvc::getListOfJsonFilesFromDir   INFO                Loading json fle SN20USBHX2003082_20250716_6_STROBE_DELAY_BURNIN.json
ElectricalSvc::read                        INFO                Found 0 results files...
ElectricalSvc::load_asic_db                INFO                Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2328_X_007_C_H3_GAIN_TEST.json
IService::UPLOADDB                         INFO                Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB                         INFO                Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB                         INFO                Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB                         INFO                Working on test code NO_BURNIN
IService::log                              INFO                Logging status 0111 for component GPC2328_X_007_C_H3
IService::install                          INFO                Installing output directory to /home/data/modules/GPC2328_X_007_C_H3/BurnInHybrids_PROD_v2-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed DB_READY_PEDESTAL_TRIM_BURNIN_SN20USBHX2003082_20250716_6_PEDESTAL_TRIM_BURNIN.json...
IService::install                          INFO                Installed DB_READY_STROBE_DELAY_BURNIN_SN20USBHX2003082_20250716_6_STROBE_DELAY_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2003082_20250716_6_3PG_BURNIN.json...
IService::install                          INFO                Installed DB_READY_RESPONSE_CURVE_BURNIN_SN20USBHX2003082_20250716_6_RESPONSE_CURVE_BURNIN.json...
IService::install                          INFO                Installed DB_READY_NO_BURNIN_SN20USBHX2003082_20250716_6_NO_BURNIN.json...
IService::install                          INFO                Installed GPC2328_X_007_C_H3.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2328_X_007_C_H4-1.config
IService::next                             INFO                Scheduling Burnin_Panel_31_43 file to run...
IService::next                             INFO                Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2328_X_007_C_H4/1/
ElectricalSvc::load_asic_db                WARNING             Could not find database ASIC GAIN_TEST results for GPC2328_X_007_C_H3
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBHN0004292

Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.