Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/GlueWeightHybridASIC_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2001803_IMG_0072.jpeg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2349_X_006_A_H4.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor INFO Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor INFO Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor INFO Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor INFO Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PPB_X_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PPB_Y_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_Y_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
Metadata
Value
Component type
Operator
LM, AND, KA
Date
2024-05-17T18:47:33.438+00:00
Program
ASIC_X_PPB.src
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
41.047
Volume per glue dot [nL]
789.368
Weight of glue under ASICs [mg]
44.200
Weights of bare hybrid [g]
1.970
Weights of stuffed hybrid [g]
2.014
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 783.084000, chip thickness 300.000000 and glue 94.401500, giving hybrid 388.682500 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 779.048772, chip thickness 300.000000 and glue 92.958944, giving hybrid 386.089827 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.686094, chip thickness 300.000000 and glue 88.730528, giving hybrid 386.955566 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.413742, chip thickness 300.000000 and glue 91.470556, giving hybrid 383.943187 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.262807, chip thickness 300.000000 and glue 84.680278, giving hybrid 389.582529 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.361850, chip thickness 300.000000 and glue 85.445139, giving hybrid 388.916711 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.680911, chip thickness 300.000000 and glue 88.367806, giving hybrid 387.313105 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.995152, chip thickness 300.000000 and glue 86.439528, giving hybrid 389.555624 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.230756, chip thickness 300.000000 and glue 90.994472, giving hybrid 384.236284 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 775.728674, chip thickness 300.000000 and glue 103.454125, giving hybrid 372.274549 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 776.024750, chip thickness 300.000000 and glue 93.717000, giving hybrid 382.307750 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/1//Data__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/1//Results__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/1//Data__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/1//Results__GPC2349_X_006_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/MetrologyHybrid_PROD_X_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_006_A_H4.txt...
IService::install INFO Installed Results__GPC2349_X_006_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_006_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H5-1.config
IService::next INFO Scheduling GPC2349-X-006-A1-6.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H5/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006820
Measurement::addPoint ERROR Unknown type ?! Ignoring!
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 953.311250, chip thickness 300.000000 and glue 83.726500, giving hybrid 569.584750 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 952.243437, chip thickness 300.000000 and glue 85.860222, giving hybrid 566.383215 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 949.826095, chip thickness 300.000000 and glue 82.826028, giving hybrid 567.000067 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 950.680419, chip thickness 300.000000 and glue 83.056222, giving hybrid 567.624197 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 953.084811, chip thickness 300.000000 and glue 77.485000, giving hybrid 575.599811 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.107039, chip thickness 300.000000 and glue 78.995833, giving hybrid 572.111205 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.618892, chip thickness 300.000000 and glue 81.775861, giving hybrid 569.843031 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 945.433142, chip thickness 300.000000 and glue 80.009611, giving hybrid 565.423531 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 944.935732, chip thickness 300.000000 and glue 87.088417, giving hybrid 557.847316 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.309969, chip thickness 300.000000 and glue 100.239750, giving hybrid 540.070219 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.265500, chip thickness 300.000000 and glue 90.629625, giving hybrid 549.635875 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/2//Data__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/2//Results__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/2//Data__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H4/2//Results__GPC2349_X_006_A_H4.txt
IService::log INFO Logging status 0111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/MetrologyHybrid_PROD_X_v2-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_006_A_H4.txt...
IService::install INFO Installed Results__GPC2349_X_006_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_006_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H5-2.config
IService::next INFO Scheduling GPC2349-X-006-A1-5_interposed_dont-use-6th.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_006_A_H5/2/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006820
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2349_X_006_A_H4 has failed criteria!
Measurement::addPoint ERROR Unknown type ?! Ignoring!
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 953.311250, chip thickness 300.000000 and glue 83.726500, giving hybrid 569.584750 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 952.243437, chip thickness 300.000000 and glue 85.860222, giving hybrid 566.383215 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 949.826095, chip thickness 300.000000 and glue 82.826028, giving hybrid 567.000067 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 950.680419, chip thickness 300.000000 and glue 83.056222, giving hybrid 567.624197 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 953.084811, chip thickness 300.000000 and glue 77.485000, giving hybrid 575.599811 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.107039, chip thickness 300.000000 and glue 78.995833, giving hybrid 572.111205 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.618892, chip thickness 300.000000 and glue 81.775861, giving hybrid 569.843031 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 945.433142, chip thickness 300.000000 and glue 80.009611, giving hybrid 565.423531 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 944.935732, chip thickness 300.000000 and glue 87.088417, giving hybrid 557.847316 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.309969, chip thickness 300.000000 and glue 100.239750, giving hybrid 540.070219 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.265500, chip thickness 300.000000 and glue 90.629625, giving hybrid 549.635875 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_006_A_H4/2//Data__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_006_A_H4/2//Results__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_006_A_H4/2//Data__GPC2349_X_006_A_H4.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_006_A_H4/2//Results__GPC2349_X_006_A_H4.txt
IService::log INFO Logging status 1111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/MetrologyHybrid_PROD_X_v2_interposer-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_006_A_H4.txt...
IService::install INFO Installed Results__GPC2349_X_006_A_H4.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_006_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_006_A_H5-2.config
IService::next INFO Scheduling GPC2349-X-006-A1-5_interposed_dont-use-6th.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_006_A_H5/2/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006820
Measurement::addPoint ERROR Unknown type ?! Ignoring!
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2349_X_006_A_H4
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2349_X_006_A_H4.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2349_X_006_A_H5-1.config
IService::next INFO Scheduling HybridBonding_GPC2349_X_006_A_H5-1.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2349_X_006_A_H5/1/
Metadata
Value
Date
2024-06-18T02:05:22.968+00:00
Operator
AND
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2349_X_006_A_H4/20USBHX2001803
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2349_X_006_A_H4_20240618.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2349_X_006_A_H4_RC_3_3.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2349_X_006_A_H4_RC_3_6.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2349_X_006_A_H4/20USBHX2001803
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_20240618_3_1_PEDESTAL_TRIM_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_20240618_3_2_STROBE_DELAY_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_20240618_3_3_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_20240618_3_6_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_20240618_3_16_NO_PPA.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC2349_X_006_A_H4
ElectricalSvc::read INFO Detected 16 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2541 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2349_X_006_A_H4_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::UPLOADDB INFO Working on test code NO_PPA
IService::log INFO Logging status 1111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/ElectricalHybrids_PPB_v1-2/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC2349_X_006_A_H4_20240618_3_1_PEDESTAL_TRIM_PPA.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC2349_X_006_A_H4_20240618_3_2_STROBE_DELAY_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2349_X_006_A_H4_20240618_3_3_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2349_X_006_A_H4_20240618_3_6_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_NO_PPA_GPC2349_X_006_A_H4_20240618_3_16_NO_PPA.json...
IService::install INFO File already installed: GPC2349_X_006_A_H4.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2349_X_006_A_H5-2.config
IService::next INFO Scheduling Official_Single_Panel_Test_42_Jun_18 file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids_PPB_v1//GPC2349_X_006_A_H5/2/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2349_X_006_A_H4
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006820
Defect
Number of channels (%)
Dead
16
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2541
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2349_X_006_A_H4/20USBHX2001803
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2349_X_006_A_H4/20USBHX2001803
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_3PG.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_NO.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_PEDESTAL_TRIM.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_RESPONSE_CURVE.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_006_A_H4_STROBE_DELAY.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2349_X_006_A_H4_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 1111 for component GPC2349_X_006_A_H4
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_006_A_H4/BurnInHybrids_PROD_v2-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_BURNIN_GPC2349_X_006_A_H4_PEDESTAL_TRIM.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_BURNIN_GPC2349_X_006_A_H4_STROBE_DELAY.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2349_X_006_A_H4_3PG.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2349_X_006_A_H4_RESPONSE_CURVE.json...
IService::install INFO File already installed: DB_READY_NO_BURNIN_GPC2349_X_006_A_H4_NO.json...
IService::install INFO File already installed: GPC2349_X_006_A_H4.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2349_X_006_A_H5-1.config
IService::next INFO Scheduling BurnIn_Panel_42_49_52_53_Merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2349_X_006_A_H5/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2349_X_006_A_H4
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006820
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
