Shown below are results for the glue weight measurements
IService::UPLOADDB INFO Working on test code ASIC_GLUE_WEIGHT
GlueWeightSvc::uploadDB INFO Formatting database test for ASIC_GLUE_WEIGHT
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/GlueWeightHybridASIC_PROD_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed 20USBHX2001815_IMG_0084.jpeg...
IService::install INFO Installed DB_COMMENTS.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_GLUE_WEIGHT.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_LS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name GlueWeightModule_SS_PPA ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleBonding_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPullTest ignored through users request!
TopControl::monitor INFO Service with algoirthm name PullTestCicorelCard ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridFlexArray_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name Powerboards_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ABC_Wafer_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HCC_PullTest_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorBondingQC_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_Before_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HVTabSheet_SheerTest_After_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name PhotoUpload ignored through users request!
TopControl::monitor INFO Service with algoirthm name PictureModule ignored through users request!
TopControl::monitor INFO Service with algoirthm name GeneralPictures ignored through users request!
TopControl::monitor INFO Service with algoirthm name PreHVTabIV ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PreTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name Module_postHVTabIV_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_PostTabIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalIV ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_Module_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SensorIV_AMACIV_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name SixWayJig_Y_slots ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridPanelMetrology_v7 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridMetrology_Y_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_v10-beta ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PPB_X_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PPB_Y_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_Y_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
Metadata
Value
Component type
Operator
LM, AND
Date
2024-05-17T22:46:56.389+00:00
Program
ASIC_X_PPB.SRC
Field
Weight/Volume
Assummed density of glue
1.077
Total volume of ASIC glue [uL]
41.976
Volume per glue dot [nL]
807.227
Weight of glue under ASICs [mg]
45.200
Weights of bare hybrid [g]
1.973
Weights of stuffed hybrid [g]
2.018
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 785.613250, chip thickness 300.000000 and glue 96.805375, giving hybrid 388.807875 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 780.314663, chip thickness 300.000000 and glue 91.892306, giving hybrid 388.422358 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 776.704877, chip thickness 300.000000 and glue 88.546389, giving hybrid 388.158488 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 774.285773, chip thickness 300.000000 and glue 88.053056, giving hybrid 386.232718 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 773.777019, chip thickness 300.000000 and glue 86.996167, giving hybrid 386.780852 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 773.434528, chip thickness 300.000000 and glue 85.759972, giving hybrid 387.674555 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 772.733222, chip thickness 300.000000 and glue 84.219278, giving hybrid 388.513944 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 771.714689, chip thickness 300.000000 and glue 88.201222, giving hybrid 383.513467 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 772.656663, chip thickness 300.000000 and glue 82.953694, giving hybrid 389.702969 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 776.131724, chip thickness 300.000000 and glue 87.629750, giving hybrid 388.501974 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 773.487750, chip thickness 300.000000 and glue 90.167500, giving hybrid 383.320250 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/1//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/1//Results__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/1//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/1//Results__GPC2349_X_011_A_H1.txt
IService::log INFO Logging status 0111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/MetrologyHybrid_PROD_X_v2-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H2-1.config
IService::next INFO Scheduling GPC2349-X-0011-A0-5.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H2/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
Measurement::addPoint ERROR Unknown type ?! Ignoring!
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 958.104250, chip thickness 300.000000 and glue 87.639125, giving hybrid 570.465125 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.015713, chip thickness 300.000000 and glue 97.855528, giving hybrid 593.160185 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.695793, chip thickness 300.000000 and glue 91.579500, giving hybrid 604.116293 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 976.644132, chip thickness 300.000000 and glue 85.370333, giving hybrid 591.273799 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 963.058561, chip thickness 300.000000 and glue 80.220667, giving hybrid 582.837894 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 960.830880, chip thickness 300.000000 and glue 77.510000, giving hybrid 583.320880 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 961.060673, chip thickness 300.000000 and glue 76.957139, giving hybrid 584.103534 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 968.405156, chip thickness 300.000000 and glue 82.214667, giving hybrid 586.190490 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 967.053628, chip thickness 300.000000 and glue 77.706806, giving hybrid 589.346823 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 952.449286, chip thickness 300.000000 and glue 83.789500, giving hybrid 568.659786 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 953.149500, chip thickness 300.000000 and glue 89.412875, giving hybrid 563.736625 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/2//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/2//Results__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/2//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H1/2//Results__GPC2349_X_011_A_H1.txt
IService::log INFO Logging status 0111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/MetrologyHybrid_PROD_X_v2-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H6-2.config
IService::next INFO Scheduling GPC2349-X-010_B0-1_011_A2-1-6-5_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2//GPC2349_X_011_A_H6/2/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2349_X_011_A_H1 has failed criteria!
Measurement::addPoint ERROR Unknown type ?! Ignoring!
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 956.384250, chip thickness 300.000000 and glue 90.791500, giving hybrid 565.592750 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.908133, chip thickness 300.000000 and glue 89.753389, giving hybrid 562.154744 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 950.045702, chip thickness 300.000000 and glue 84.831611, giving hybrid 565.214091 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 946.008723, chip thickness 300.000000 and glue 80.324667, giving hybrid 565.684057 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 944.240093, chip thickness 300.000000 and glue 79.495333, giving hybrid 564.744759 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 944.321458, chip thickness 300.000000 and glue 78.747750, giving hybrid 565.573708 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.587943, chip thickness 300.000000 and glue 76.701750, giving hybrid 563.886193 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.837006, chip thickness 300.000000 and glue 81.984944, giving hybrid 559.852061 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.509701, chip thickness 300.000000 and glue 76.341222, giving hybrid 565.168478 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 942.227087, chip thickness 300.000000 and glue 86.615125, giving hybrid 555.611962 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 942.478500, chip thickness 300.000000 and glue 88.398750, giving hybrid 554.079750 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2349_X_011_A_H1/1//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2349_X_011_A_H1/1//Results__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2349_X_011_A_H1/1//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PPB_X_v0//GPC2349_X_011_A_H1/1//Results__GPC2349_X_011_A_H1.txt
IService::log INFO Logging status 0111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/MetrologyHybrid_PPB_X_v0-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PPB_Y_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_Y_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyHybrid_PROD_X_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name HybridToSensorMetrology_v2a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_v8a ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPA_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_SS_wuerth_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PPB_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_LS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name MetrologyModules_PROD_SS_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleLS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ModuleSS_Bow_PPA_v0 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PPB_v1 ignored through users request!
TopControl::monitor INFO Service with algoirthm name BurnInHybrids_PROD_v2 ignored through users request!
TopControl::monitor INFO Service with algoirthm name ElectricalModules_PPA_v1 ignored through users request!
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
IService::PASSFAIL WARNING Service GPC2349_X_011_A_H1 has failed criteria!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
MetrologySvc::PassFail WARNING Identified a total of 11 objects outside tolerence!!
Metadata
Value
Component type
X
Operator
LM
Date
2024-06-14T23:14:16.784+00:00
Program version
MetrologyHybrid_PPB_X_v0/PPB_cloneable_v0_DB102
Instrument
SmartScope Flash 250
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 958.104250, chip thickness 300.000000 and glue 87.639125, giving hybrid 570.465125 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 991.015713, chip thickness 300.000000 and glue 97.855528, giving hybrid 593.160185 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 995.695793, chip thickness 300.000000 and glue 91.579500, giving hybrid 604.116293 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 976.644132, chip thickness 300.000000 and glue 85.370333, giving hybrid 591.273799 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 963.058561, chip thickness 300.000000 and glue 80.220667, giving hybrid 582.837894 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 960.830880, chip thickness 300.000000 and glue 77.510000, giving hybrid 583.320880 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 961.060673, chip thickness 300.000000 and glue 76.957139, giving hybrid 584.103534 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 963.147683, chip thickness 300.000000 and glue 82.214667, giving hybrid 580.933016 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 967.053628, chip thickness 300.000000 and glue 77.706806, giving hybrid 589.346823 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 952.449286, chip thickness 300.000000 and glue 83.789500, giving hybrid 568.659786 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 953.149500, chip thickness 300.000000 and glue 89.412875, giving hybrid 563.736625 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/2//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/2//Results__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/2//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/2//Results__GPC2349_X_011_A_H1.txt
IService::log INFO Logging status 1111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/MetrologyHybrid_PROD_X_v2_interposer-2/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H2-2.config
IService::next INFO Scheduling GPC2349-X-010_B0-1_011_A2-1-6-5_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H2/2/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
Measurement::addPoint ERROR Unknown type ?! Ignoring!
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Metrology results
Shown below are the results of the module metrology scans
MetrologySvc::analyzeHybridThickness INFO Total stack up 956.384250, chip thickness 300.000000 and glue 90.791500, giving hybrid 565.592750 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 951.908133, chip thickness 300.000000 and glue 89.753389, giving hybrid 562.154744 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 950.045702, chip thickness 300.000000 and glue 84.831611, giving hybrid 565.214091 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 946.008723, chip thickness 300.000000 and glue 80.324667, giving hybrid 565.684057 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 944.240093, chip thickness 300.000000 and glue 79.495333, giving hybrid 564.744759 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 944.321458, chip thickness 300.000000 and glue 78.747750, giving hybrid 565.573708 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 940.587943, chip thickness 300.000000 and glue 76.701750, giving hybrid 563.886193 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.837006, chip thickness 300.000000 and glue 81.984944, giving hybrid 559.852061 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 941.509701, chip thickness 300.000000 and glue 76.341222, giving hybrid 565.168478 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 942.227087, chip thickness 300.000000 and glue 86.615125, giving hybrid 555.611962 thickness
MetrologySvc::analyzeHybridThickness INFO Total stack up 942.478500, chip thickness 300.000000 and glue 88.398750, giving hybrid 554.079750 thickness
IService::UPLOADDB INFO Working on test code ASIC_METROLOGY
MetrologySvc::uploadDB INFO Doing DB upload...
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/1//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/1//Results__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing common output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/1//Data__GPC2349_X_011_A_H1.txt
MetrologySvc::writeOutput INFO Writing results output file /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H1/1//Results__GPC2349_X_011_A_H1.txt
IService::log INFO Logging status 1111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/MetrologyHybrid_PROD_X_v2_interposer-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed Summary.pdf...
IService::install INFO Installed TotalStackUp.pdf...
IService::install INFO Installed HybridThickness.pdf...
IService::install INFO Installed Positions.pdf...
IService::install INFO Installed Tilt.pdf...
IService::install INFO Installed Data__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results__GPC2349_X_011_A_H1.txt...
IService::install INFO Installed Results.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_ASIC_METROLOGY.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H3-1.config
IService::next INFO Scheduling GPC2349-X-011-A3_interposed.txt file to run...
IService::next INFO Writing results to /home/data/output//MetrologyHybrid_PROD_X_v2_interposer//GPC2349_X_011_A_H3/1/
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
The thickness of the glue \(t_{glue}\) is calculated as:
$$t_{glue} = \frac{1}{N_{c}}\sum_{c=1}^{N_{c}} z_{c} - \frac{1}{N_{b}}\sum_{b=1}^{N_{b}} z_{b} - t_{chip} $$
where \(t_{chip}\) is the thickness of the chip
\(z_{i}\) is the z-height measurement,
\(N_{i}\) is the number of measurements on a given surface,
and \(c\) and \(b\) run over measurements taken on the chip and base, respectively.
The assumed thickness of the chip is \(t_{chip} = 300\mu m\).
Uncertainties on the glue height measurement are estimated from the spread in z-height measurements on a given surface.
On a given surface, the height uncertainty \(\sigma_{i}\) is calculated as:
$$\sigma_{i} = \frac{\Delta z}{2\sqrt{N_{i}}}$$
where \(\Delta z = z_{max} - z_{min}\) and \(z_{max}\) and \(z_{min}\) are the maximum and minimum z-height measurements, respectively.
In addition, a conservative \(\sigma_{chip} = 10\mu m\) uncertainty on the chip thickeness is assumed.
The total uncertainty is calculated as:
$$\sigma_{glue} = \sqrt{ \sigma_{c}^2 + \sigma_{b}^2 + \sigma_{chip} }$$
The glue thickness measurements for each ASIC are shown in the figure and table below.
The thickness total stack up is measured from the top of the each chip to the jig,
and accounts for the combined thickness of hybrid flex, glue, and ABC/HCC chips in the case of hybrid.
The positions of the ASICs are measured on the 95x95 \(\mu m^2\) square pads on the opposite side of the sensor wire bonds.
These measured positions are compared against the technical drawns to calculated the relative ASIC position.
In some cases, the SmartScope incorrectly measures a different object than these square pads,
and using properties (such as the perimeter), the position is corrected.
The positions are shown in the figure below. If any corrections are applied, they are shown as transparent points.
The hybrid thickness is plotted below. It is calculated from the total stack up height minus the assembed chip thickness and measured glue thickness.
The tilt of a chip can be calculated in either the direction along the surface of a chip. We define
the x-direction to be any points whose difference is much larger along x, and similarly for y. The tilt in both cases is defined to be:
$$tilt = \frac{|\Delta z|}{\sqrt{\Delta x^{2} + \Delta y^{2}}} $$
Wirebonding for GPC2349_X_011_A_H1
Wirebonding summaries will be given below
WireBondSvc::run INFO Loading group FAILED_ASIC_BACKEND
WireBondSvc::run INFO Loading group FAILED_HYBRID_TO_PANEL
WireBondSvc::run INFO Loading group REPAIRED_ASIC_BACKEND
WireBondSvc::run INFO Loading group REPAIRED_HYBRID_TO_PANEL
IService::UPLOADDB INFO Working on test code WIRE_BONDING
IService::UPLOADDB INFO Working on test code VISUAL_INSPECTION
IService::log INFO Logging status 0111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/HybridBonding_v1-1/
IService::install INFO Installed warningLog.txt...
IService::install INFO Installed errorLog.txt...
IService::install INFO Installed infoLog.txt...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_WIRE_BONDING.json...
IService::install INFO Installed DB_READY_HYBRID_ASSEMBLY_VISUAL_INSPECTION.json...
IService::install INFO Installed GPC2349_X_011_A_H1.root...
IService::install INFO Installed status.json...
MetaData::readField INFO Reading file /home/data/upload//HybridBonding_v1//GPC2349_X_006_A_H1-1.config
IService::next INFO Scheduling HybridBonding_GPC2349_X_006_A_H1-1.json file to run...
IService::next INFO Writing results to /home/data/output//HybridBonding_v1//GPC2349_X_006_A_H1/1/
Metadata
Value
Date
2024-06-18T02:05:22.948+00:00
Operator
AND
Bonder
hk2
Version
v1
Bond number
Type
Comment
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2349_X_011_A_H1/20USBHX2001815
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2349_X_011_A_H1_20240620.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2349_X_011_A_H1_RC_2_3.txt
ElectricalSvc::getListOfFilesFromDir INFO Found file GPC2349_X_011_A_H1_RC_2_6.txt
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2349_X_011_A_H1/20USBHX2001815
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_20240620_2_1_PEDESTAL_TRIM_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_20240620_2_2_STROBE_DELAY_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_20240620_2_3_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_20240620_2_6_RESPONSE_CURVE_PPA.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_20240620_2_16_NO_PPA.json
ElectricalSvc::read INFO Found 2 results files...
ElectricalSvc::read INFO Analyzing test ResponseCurve for component GPC2349_X_011_A_H1
ElectricalSvc::read INFO Detected 14 dead channels
ElectricalSvc::read INFO Detected 0 stuck channels
ElectricalSvc::read INFO Detected 0 low gain channels
ElectricalSvc::read INFO Detected 0 high gain channels
ElectricalSvc::read INFO Detected 0 low offset channels
ElectricalSvc::read INFO Detected 0 high offset channels
ElectricalSvc::read INFO Detected 2543 unbonded channels
ElectricalSvc::read INFO Detected 0 part bonded channels
ElectricalSvc::read INFO Detected 0 high noise channels
ElectricalSvc::read INFO Detected 0 inefficient channels
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2349_X_011_A_H1_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_PPA
IService::UPLOADDB INFO Working on test code STROBE_DELAY_PPA
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_PPA
IService::UPLOADDB INFO Working on test code NO_PPA
IService::log INFO Logging status 1111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/ElectricalHybrids_PPB_v1-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: Gain_Channel1D.pdf...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_PPA_GPC2349_X_011_A_H1_20240620_2_1_PEDESTAL_TRIM_PPA.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_PPA_GPC2349_X_011_A_H1_20240620_2_2_STROBE_DELAY_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2349_X_011_A_H1_20240620_2_3_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_PPA_GPC2349_X_011_A_H1_20240620_2_6_RESPONSE_CURVE_PPA.json...
IService::install INFO File already installed: DB_READY_NO_PPA_GPC2349_X_011_A_H1_20240620_2_16_NO_PPA.json...
IService::install INFO File already installed: GPC2349_X_011_A_H1.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//ElectricalHybrids_PPB_v1//GPC2349_X_010_B_H0-1.config
IService::next INFO Scheduling Official_Single_Panel_Test_52_Jun_20 file to run...
IService::next INFO Writing results to /home/data/output//ElectricalHybrids_PPB_v1//GPC2349_X_010_B_H0/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2349_X_011_A_H1
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
Defect
Number of channels (%)
Dead
14
Stuck
0
Low gain
0
High gain
0
Low offset
0
High offset
0
Unbonded
2543
Part bonded
0
High noise
0
Inefficient
0
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
Electrical results
Electrical summaries will be given below
ElectricalSvc::getListOfFilesFromDir INFO Scanning for test files GPC2349_X_011_A_H1/20USBHX2001815
ElectricalSvc::getListOfJsonFilesFromDir INFO Scanning for test files GPC2349_X_011_A_H1/20USBHX2001815
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_3PG.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_NO.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_PEDESTAL_TRIM.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_RESPONSE_CURVE.json
ElectricalSvc::getListOfJsonFilesFromDir INFO Loading json fle GPC2349_X_011_A_H1_STROBE_DELAY.json
ElectricalSvc::read INFO Found 0 results files...
ElectricalSvc::load_asic_db INFO Reading ASIC database file /home/data/upload//BurnInHybrids_PROD_v2//GPC2349_X_011_A_H1_GAIN_TEST.json
IService::UPLOADDB INFO Working on test code PEDESTAL_TRIM_BURNIN
IService::UPLOADDB INFO Working on test code STROBE_DELAY_BURNIN
IService::UPLOADDB INFO Working on test code RESPONSE_CURVE_BURNIN
IService::UPLOADDB INFO Working on test code NO_BURNIN
IService::log INFO Logging status 1111 for component GPC2349_X_011_A_H1
IService::install INFO Installing output directory to /home/data/modules/GPC2349_X_011_A_H1/BurnInHybrids_PROD_v2-1/
IService::install INFO File already installed: warningLog.txt...
IService::install INFO File already installed: errorLog.txt...
IService::install INFO File already installed: infoLog.txt...
IService::install INFO File already installed: DB_READY_PEDESTAL_TRIM_BURNIN_GPC2349_X_011_A_H1_PEDESTAL_TRIM.json...
IService::install INFO File already installed: DB_READY_STROBE_DELAY_BURNIN_GPC2349_X_011_A_H1_STROBE_DELAY.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2349_X_011_A_H1_3PG.json...
IService::install INFO File already installed: DB_READY_RESPONSE_CURVE_BURNIN_GPC2349_X_011_A_H1_RESPONSE_CURVE.json...
IService::install INFO File already installed: DB_READY_NO_BURNIN_GPC2349_X_011_A_H1_NO.json...
IService::install INFO File already installed: GPC2349_X_011_A_H1.root...
IService::install INFO File already installed: status.json...
MetaData::readField INFO Reading file /home/data/upload//BurnInHybrids_PROD_v2//GPC2349_X_010_B_H0-1.config
IService::next INFO Scheduling BurnIn_Panel_42_49_52_53_Merged file to run...
IService::next INFO Writing results to /home/data/output//BurnInHybrids_PROD_v2//GPC2349_X_010_B_H0/1/
ElectricalSvc::load_asic_db WARNING Could not find database ASIC GAIN_TEST results for GPC2349_X_011_A_H1
MetaData::getLocalName WARNING Could not find a local name for identifier 20USBHN0006901
Figures of gain and noise, and correlations with wafer/hybrid level test results, if they exist.
