Hybrid PRESERIES_UCSC_X results


Hybrid DB registered Glue weight Metrology Wirebonding Burn-in Comment
GPC2413_X_017_C_H4  
GPC2413_X_017_C_H3 Failed hybrid used for thin UV glue curing/bonding trial using X grade hybrids QA part and not a real failure - Anthony Affolder, 04.06.2025--14-08-41
Gap too big under chips; 200um shims used, but flex is thin. We will refill to use in trials but failed parts. - Anthony Affolder, 11.06.2025--00-19-59
GPC2337_X_016_A_H6
GPC2337_X_016_A_H5
GPC2337_X_016_A_H4
GPC2337_X_016_A_H3  
GPC2337_X_016_A_H2
GPC2337_X_016_A_H1  
GPC2337_X_016_A_H0  
GPC2328_X_014_B_H6  
GPC2328_X_014_B_H5  
GPC2328_X_014_B_H4  
GPC2328_X_014_B_H3  
GPC2328_X_014_B_H2  
GPC2328_X_014_B_H1  
GPC2328_X_014_B_H0
GPC2328_X_007_C_H0  
GPC2324_X_024_A_H6  
GPC2324_X_024_A_H5  
GPC2324_X_024_A_H4  
GPC2324_X_024_A_H3  
GPC2324_X_024_A_H2  
GPC2324_X_024_A_H1  
GPC2324_X_024_A_H0  
GPC2324_X_023_C_H6  
GPC2324_X_023_C_H5 Physically was on panel 46, but due to some testing issues was assembled onto panel 53 on the website during testing.

GPC2324_X_023_C_H4  
GPC2324_X_023_C_H3  
GPC2324_X_023_C_H2  
GPC2324_X_023_C_H0  
GPC2324_X_016_A_H6  
GPC2324_X_016_A_H5  
GPC2324_X_016_A_H4  
GPC2324_X_016_A_H3
GPC2324_X_016_A_H1
GPC2324_X_016_A_H0
GPC2324_X_012_C_H6     Failed hybrid used with X grade ABCStar for test of thin UV glue curing and bonding. QA piece not to be in pre-series yields - Anthony Affolder, 04.06.2025--14-45-57
GPC2324_X_012_C_H5  
GPC2324_X_012_C_H3
GPC2324_X_012_C_H2
GPC2324_X_012_C_H1
GPC2324_X_012_C_H0     Failed hybrid used with X grade ABCStar for test of thin UV glue curing and bonding. QA piece not to be in pre-series yields - Anthony Affolder, 04.06.2025--14-46-34
GPC2324_X_011_A_H6
GPC2324_X_011_A_H5
GPC2324_X_011_A_H4
GPC2324_X_011_A_H3
GPC2324_X_011_A_H2
GPC2324_X_011_A_H1
GPC2324_X_011_A_H0     Metrology fail - HCC shifted ~200 microns in Y - LM, 09.06.2025--18-15-01
AMACStar shifted in y by 250 um. FAILED COMPONENT - Anthony Affolder, 11.06.2025--01-11-01
GPC2324_X_006_C_H6  
GPC2324_X_006_C_H5
GPC2324_X_006_C_H4        
GPC2324_X_006_C_H3
GPC2324_X_006_C_H2
GPC2324_X_006_C_H1  
GPC2324_X_006_C_H0  
GPC2320_X_025_C_H5  
GPC2320_X_025_C_H4  
GPC2320_X_025_C_H3  
GPC2320_X_025_C_H2  
GPC2320_X_025_C_H1 Physically was on panel 45, but due to some testing issues was assembled onto panel 25 on the website during testing.

GPC2320_X_025_C_H0  
GPC2320_X_025_A_H6  
GPC2320_X_025_A_H5  
GPC2320_X_025_A_H4  
GPC2320_X_025_A_H3  
GPC2320_X_025_A_H2  
GPC2320_X_025_A_H0
GPC2320_X_012_B_H5
GPC2320_X_012_B_H4
GPC2320_X_012_B_H3
GPC2320_X_012_B_H2
GPC2320_X_012_B_H0
GPC2320_X_002_C_H6  
GPC2320_X_002_C_H5  
GPC2320_X_002_C_H4  
GPC2320_X_002_C_H3  
GPC2320_X_002_C_H2  
GPC2320_X_002_C_H1  
GPC2320_X_002_C_H0     Vacuum off during curing - stack up too low - LM, 11.06.2025--20-32-14
GPC2238_X_024_A_H6
GPC2238_X_024_A_H4
GPC2238_X_024_A_H3
GPC2238_X_024_A_H2
GPC2238_X_024_A_H0
GPC2238_X_019_C_H6
GPC2238_X_019_C_H5
GPC2238_X_019_C_H4
GPC2238_X_019_C_H3
GPC2238_X_019_C_H2
GPC2238_X_019_C_H0
GPC2238_X_009_B_H6  
GPC2238_X_009_B_H5  
GPC2238_X_009_B_H4  
GPC2238_X_009_B_H3  
GPC2238_X_009_B_H1  
GPC2238_X_009_B_H0  
GPC2238_X_007_B_H5
GPC2238_X_007_B_H4
GPC2238_X_007_B_H3
GPC2238_X_007_B_H2
GPC2238_X_007_B_H1
GPC2238_X_007_B_H0        
GPC2233_X_021_C_H5
GPC2233_X_021_C_H4
GPC2233_X_021_C_H2
GPC2233_X_021_C_H1       ABCStar glued on in the wrong orientation. FAILED HYBRID - Anthony Affolder, 11.06.2025--17-39-03
GPC2233_X_021_C_H0
GPC2233_X_012_B_H6
GPC2233_X_012_B_H5
GPC2233_X_012_B_H4
GPC2233_X_012_B_H3
GPC2233_X_012_B_H2
GPC2233_X_012_B_H1        
GPC2233_X_012_B_H0
GPC2233_X_006_A_H6  
GPC2233_X_006_A_H5  
GPC2233_X_006_A_H4  
GPC2233_X_006_A_H3  
GPC2233_X_006_A_H2  
GPC2233_X_006_A_H1  
GPC2233_X_006_A_H0      
GPC2225_X_015_B_H6
GPC2225_X_015_B_H4     Pickup tool not down during chip attachment. Both chip glue thickness and total stack up 200 um above nominal. FAILED HYBRID - Anthony Affolder, 11.06.2025--21-55-16
GPC2225_X_015_B_H3
GPC2225_X_015_B_H2
GPC2225_X_015_B_H1
GPC2225_X_015_B_H0  
GPC2225_X_011_C_H6
GPC2225_X_011_C_H2       Dummy hybrid made with failed hybrids, X grade ABCStar and a dummy HCCStar - Anthony Affolder, 11.06.2025--02-15-39
GPC2225_X_011_C_H1
GPC2225_X_011_C_H0       Dummy hybrid made with failed hybrids, X grade ABCStar and a dummy HCCStar - Anthony Affolder, 11.06.2025--02-16-02
GPC2225_X_010_B_H6     Failed hybrid used with X grade ABCStar for test of thin UV glue curing and bonding. QA piece not to be in pre-series yields - Anthony Affolder, 04.06.2025--14-47-32
GPC2225_X_010_B_H5  
GPC2225_X_010_B_H4 Could not detect chip 20USGAA1386115 during burn-in (6th chip counting from 1)

GPC2225_X_010_B_H3  
GPC2225_X_010_B_H2
GPC2225_X_010_B_H1  
GPC2225_X_010_B_H0     Failed hybrid used with X grade ABCStar for test of thin UV glue curing and bonding. QA piece not to be in pre-series yields - Anthony Affolder, 04.06.2025--14-48-04
GPC2225_X_009_B_H6  
GPC2225_X_009_B_H5  
GPC2225_X_009_B_H4  
GPC2225_X_009_B_H2  
GPC2225_X_009_B_H1
GPC2225_X_009_B_H0