Results for SCIPP-M3-13


Photos of SCIPP-M3-13


Basic Information for SCIPP-M3-13


Brief description of DB components associated to this Module and associated tests


Click for packaging sticker
MetadataValue
Alt Identifier SCIPP-M3-13
Serial Number 20USBML0000085
Assembled False
Completed False
Current Location SCIPP, UC Santa Cruz
Manufacture ID SCIPP-M3-13
User Jane Gunnell

Children

ComponentTypeTimestamp
Hybrid (Obsolete) HX 2019-12-12T23:11:35+01:00
Powerboard B3 2019-12-18T19:47:25+01:00
Sensor ATLAS17LS

Parents

ComponentTypeTimestamp

NameCurrent StageTimestamp

Metrology results


Shown below are the results of the module metrology scans

IService::UPLOADDB                         INFO                Working on test code MMETROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M3-13/1//Data__SCIPP-M3-13.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M3-13/1//Results__SCIPP-M3-13.txt
IService::UPLOADDB                         INFO                Working on test code MMETROLOGY
MetrologySvc::uploadDB                     INFO                Doing DB upload...
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M3-13/1//Data__SCIPP-M3-13.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M3-13/1//Results__SCIPP-M3-13.txt
MetrologySvc::writeOutput                  INFO                Writing common output file /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M3-13/1//Data__SCIPP-M3-13.txt
MetrologySvc::writeOutput                  INFO                Writing results output file /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M3-13/1//Results__SCIPP-M3-13.txt
IService::log                              INFO                Logging status 0111 for component SCIPP-M3-13
IService::install                          INFO                Installing output directory to /home/data/modules/SCIPP-M3-13/HybridToSensorMetrology_v2a-1/
IService::install                          INFO                Installed warningLog.txt...
IService::install                          INFO                Installed errorLog.txt...
IService::install                          INFO                Installed infoLog.txt...
IService::install                          INFO                Installed Summary.pdf...
IService::install                          INFO                Installed Data__SCIPP-M3-13.txt...
IService::install                          INFO                Installed Results__SCIPP-M3-13.txt...
IService::install                          INFO                Installed Results.json...
IService::install                          INFO                Installed DB_READY_MODULE_MMETROLOGY.json...
IService::install                          INFO                Installed SCIPP-M3-13.root...
IService::install                          INFO                Installed status.json...
MetaData::readField                        INFO                Reading file /home/data/upload//MetrologyModules///SCIPP-M4-01.config
IService::next                             INFO                Scheduling SCIPP-M4-01.txt file to run...
IService::next                             INFO                Writing results to /home/data/output//HybridToSensorMetrology_v2a//SCIPP-M4-01/1/
MetaData::getLocalName                     WARNING             Could not find a local name for identifier 20USBP02020025
  • ✔ Component is at UCSC. OK to upload
  • ✘ Component fails stage checks. Current stage is BONDED but requires one of { "GLUED" }. Prohibiting upload!

MetadataValue
Component type LS
Operator Matthew Gignac
Date 27.01.2020 00:00
Program version v2a
Instrument SmartScope Flash 250

The glue thicknesses are shown below.